KS-886H
Abstract: Kostat tray
Contextual Info: Thermal Management and Mechanical Handling for Altera TCFCBGA Devices AN-657-1.1 Application Note This application note describes the thermal composite flip chip ball-grid array TCFCBGA package for the Arria V device family. TCFCBGA improves board real-estate use by allowing closer spacing between passive
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AN-657-1
KS-886H
Kostat tray
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kostat tray qfn 5 x 3
Abstract: ePAK kostat qfn 6 x 6 Kostat kostat skyworks 6 x 6 Kostat tray EPAK TRAY kostat skyworks 3 x 3 kostat qfn 9 x 9 kostat 6 x 6
Contextual Info: APPLICATION NOTE Tape and Reel Information – RF Modules Production quantities of Skyworks RF Modules are shipped in standard tape and reel format. The enclosed information provides the formats and dimensions for the popular sizes of current modules. APPLICATION NOTE
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101568E
kostat tray qfn 5 x 3
ePAK
kostat qfn 6 x 6
Kostat
kostat skyworks 6 x 6
Kostat tray
EPAK TRAY
kostat skyworks 3 x 3
kostat qfn 9 x 9
kostat 6 x 6
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EN4900GC
Abstract: NC7720 CEL9220HF10 EME-G760L EME-G760 HL832nxa Yizbond Hitachi EN4900GC CEL9220 DS-7409HG
Contextual Info: PCN No: PCN1-110704 Qualification of selected products at additional assembly and test sites Initial Change Notification Date: 7/04/2011 This is an initial announcement of change to a device that is currently offered by Energy Micro. The details of this change are on the following pages.
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PCN1-110704
EFM32G890F128
J-STD-020D,
JESD22-A113
JESD22-A104
C/125
JESD22-A103
JESD22-A102
JESD22-A110
EN4900GC
NC7720
CEL9220HF10
EME-G760L
EME-G760
HL832nxa
Yizbond
Hitachi EN4900GC
CEL9220
DS-7409HG
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FC-BGA
Abstract: T0812012 daewon tray
Contextual Info: Thermal Management and Mechanical Handling for Lidless Flip Chip Ball-Grid Array AN-659-1.0 Application Note This application note provides guidance on thermal management and mechanical handling of lidless flip chip ball-grid array FCBGA for Altera devices.
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AN-659-1
FC-BGA
T0812012
daewon tray
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EPAK TRAY
Abstract: GP01-D232 JEDEC Kostat Kostat tray kostat qfn 6 x 6 eC3-LGA0909-24-12-F1-L 3M060 Kostat GP01-D232-173 SOT-89-D
Contextual Info: APPLICATION NOTE Tape and Reel Information – RF Modules Production quantities of Skyworks RF Modules are shipped in standard tape and reel format. The enclosed information provides the formats and dimensions for the currently popular sizes. APPLICATION NOTE
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101568G
EPAK TRAY
GP01-D232
JEDEC Kostat
Kostat tray
kostat qfn 6 x 6
eC3-LGA0909-24-12-F1-L
3M060
Kostat
GP01-D232-173
SOT-89-D
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Kostat
Abstract: JEDEC Kostat AN101094-1 Kostat tray J-STD-013 AN-1126 pcb design 0,5 mm pitch Shipping Trays kostat 10 x 10 Kostat tray 3.0 JEDEC Kostat component tray
Contextual Info: National Semiconductor Application Note 1126 September 1999 Printed Circuit Board PCB Layout Guidelines NSMD defined pads enhance vision registration of copper fiducials compared to the SMD defined pad. For SMD defined pads, any misregistration of the solder mask will contribute
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AN-1126
Kostat
JEDEC Kostat
AN101094-1
Kostat tray
J-STD-013
AN-1126
pcb design 0,5 mm pitch
Shipping Trays kostat 10 x 10
Kostat tray 3.0
JEDEC Kostat component tray
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TAIYO PSR 4000
Abstract: manual PACE PSR 800 CCL-HL-832 fbga Substrate design guidelines JEDEC Kostat FBGA CCL-HL832 ablebond esec 3018 operation kostat bga 6mm x 6mm nitto hc100
Contextual Info: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).
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TAIYO PSR 4000
Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY
Contextual Info: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).
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taiyo PSR4000
Abstract: Shipping Trays kostat 10 x 10 nitto hc100 Kostat tray PSR4000 aus5 EPAK EPAK TRAY JEDEC Kostat PSR4000 aus5
Contextual Info: Table of Contents Introduction . 2 CHIP SCALE PACKAGES . 2
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fBGA package tray 12 x 19
Abstract: EPAK TRAY FBGA THICK TRAY fbga Substrate design guidelines JEDEC Kostat FBGA EPAK Kostat PSR4000 SLB128B AN-1125
Contextual Info: Table of Contents Introduction . 2 CHIP SCALE PACKAGES . 2
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IC TRAY DATASHEETS KOSTAT
Abstract: Voice-Direct-364 Kostat Kostat tray SPEECH DIALER SD 2000 IC TRAY KOSTAT JEDEC Kostat Speech Recognition IC block diagram of speech recognition 24C65
Contextual Info: Voice Direct 364 Data Book Sensory, Inc. P/N 80-0179-F Table of Contents Copyright Copyright 2000, Sensory, Inc. You may not copy, modify, or translate this document or any part of this document. Nor can you reduce any part of it to any machine-readable form.
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80-0179-F
1N4148
IC TRAY DATASHEETS KOSTAT
Voice-Direct-364
Kostat
Kostat tray
SPEECH DIALER SD 2000
IC TRAY KOSTAT
JEDEC Kostat
Speech Recognition IC
block diagram of speech recognition
24C65
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