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    KF66X-C62P-NJ Search Results

    KF66X-C62P-NJ Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    L717HDC62PC309 Amphenol Communications Solutions Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 62 Pin, 0.76m (30 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock Visit Amphenol Communications Solutions
    L717HDC62POL2C309 Amphenol Communications Solutions Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 62 Pin, 0.76m (30 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock Visit Amphenol Communications Solutions
    L717HDC62PD1CO4R Amphenol Communications Solutions Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (.350in), 62 Pin, Flash Gold, 4-40 Rear Threaded Insert, Without Boardlock Visit Amphenol Communications Solutions
    L777HRC62P Amphenol Communications Solutions Dsub, Straight, High Density, Housing only, Crimp & Poke, Bright Tin Shell+Grounding Dimples, Bright Tin Shell, 62 Pin, 3.05mm (0.120in) Clear Hole Visit Amphenol Communications Solutions
    L777HDC62PD1CH3F Amphenol Communications Solutions Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 62 Pin, 0.38m (15 in) Gold, M3 Front Screwlock, Ground Tab, With Boardlock Visit Amphenol Communications Solutions