JUNCTION TO CASE TEMPERATURE OF TO-3 PACKAGE Search Results

P1900ME

Abstract: P1400AD P1500ME P1800AD P1900NE P2300ME P3100AD P6002AD
Contextual Info: Hemar AG, Fendler 50, 5524 Nesselnbach, Tel. +41 56 6183141 Fax. +41 56 6183142 http://www.hemar.ch CATV and HFC SIDACtor Device CATV and HFC SIDACtor Device 1 3 This SIDACtor device is a 1000 A solid state protection device offered in a TO-220 package. It protects equipment located in the severe surge environment of Community Antenna TV

DIODE P31B

Abstract: P61a p31b diode p26b p31b p482a p-8cm DIODE P31A P06C diode p35b
Contextual Info: This section presents complete electrical specifications for Teccor’s SIDACtor solid state overvoltage protection devices. DO-214AA Package Symbolization. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3

WEDPN8M72V-XBX

Abstract: AN0019
Contextual Info: AN0019 White Electronic Designs APPLICATION NOTE PBGA THERMAL RESISTANCE CORRELATION INTRODUCTION CALIBRATION, MEASUREMENTS AND MODELING The thermal resistances for the Plastic Ball Grid Array PBGA Multi Chip Packages (MCP) published in WEDC data sheets are results from thermal modeling software

Contextual Info: ATS WHITE PAPER Device Thermal Coupling on a PCB THERMAL MINUTES Device Thermal Coupling on a PCB 1 to 5 mm Gap Insulation to Board or Insulation to Package Junction Temperature Board Temperature Thermocouple Soldered to Middle Lead Figure 1. Cross Section

SPRA953A

Abstract: Theta-JC QFP die down Theta-JC plcc Theta-JC qfp Theta-JC 28 PLCC mgmt coolant temperature sensor outline of the heat sink for Theta JC dead bug heat slugs attach QFP PACKAGE thermal resistance
Contextual Info: Application Report SPRA953A – June 2007 IC Package Thermal Metrics Darvin Edwards. ABSTRACT Many thermal metrics exist for integrated circuit IC packages ranging from θja to Ψjt.

Contextual Info: COMMERCIAL LASERS Diode Lasers, High Brightness 0.6 to 8.5 W, 8xx nm 24xx Series Key Features • 35 – 200 µm aperatures available • High-efficiency, MOCVD quantum well design • Open heat sink packages and encapsulated devices • High reliability The 24xx series diode lasers represent a breakthrough in high continuous wave

diode A26C

Abstract: schottky barrier type rectifier 30v 3a EP05Q04 xl marking sod-123 i50112
Contextual Info: SILICON RECTIFIER DIODE EClODSl EClODS2 EClODS4 EClODS6 lA/lOO-600V FEATURES Surface Mount Device 0 Miniature Size, thigh Surge Capability OLOW Forward Voltage Drop OLOW Reverse Leakage Current ~Packagedin 12mm Tape and Reel oNot Rolling During Assembly Dimensions

p30b diode

Abstract: p31b diode DIODE P31B Teccor P0080SC MC marking code DIODE P31A P06C diode p31b suppressor P3000AA61 p31b P31c
Contextual Info: This section presents complete electrical specifications for Teccor’s SIDACtor solid state overvoltage protection devices. DO-214AA Package Symbolization. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3

jdsu optic switch

Abstract: 808 nm 100 mw 2445-G1 laser diode for free space communication TO56 package Laser Diode 808 nm 5w CW laser diode 808 nm 2400150 TO-56 package laser diode 2455-G1
Contextual Info: COMMERCIAL LASERS Diode Lasers, High Brightness 0.6 to 8.5 W, 8xx nm 24xx Series Key Features • 35 – 200 µm aperatures available • High-efficiency, MOCVD quantum well design • Open heat sink packages and encapsulated devices • High reliability The 24xx series diode lasers represent a breakthrough in high continuous wave

to56

Contextual Info: COMMERCIAL LASERS Diode Lasers, High Brightness 0.6 to 8.5 W, 8xx nm 24xx Series Key Features • 35 – 200 µm aperatures available • High-efficiency, MOCVD quantum well design • Open heat sink packages and encapsulated devices • High reliability The 24xx series diode lasers represent a breakthrough in high continuous wave

heatsink design

Abstract: pulse load calculation formula pulse load calculation formula for single pulse SC18
Contextual Info: DISCTETE SEMICONDUCTORS DATA SHEET Chapter 5 Thermal considerations Discrete Semiconductor Packages File under Disctete Semiconductors, SC18 July 1997 Philips Semiconductors Discrete Semiconductor Packages Thermal considerations Chapter 5 INTRODUCTION The perfect power switch is not yet available. All power

Contextual Info: CHAPTER 5 THERMAL CONSIDERATIONS page Introduction 5-2 Part one: Thermal properties 5-2 Part two: Worked examples 5-7 Part three: Heat dissipation 5 - 15 Philips Semiconductors Discrete Semiconductor Packages Thermal considerations Chapter 5 INTRODUCTION The perfect power switch is not yet available. All power

AN1232

Abstract: QFP PACKAGE thermal resistance micromechanical
Contextual Info: MOTOROLA Order this document by AN1232/D SEMICONDUCTOR TECHNICAL DATA AN1232 Thermal Performance of Plastic Ball Grid Array PBGA Packages for Next Generation FSRAM Devices Prepared by: Shailesh Mulgaonker (APDC, Phoenix, AZ) and Bennett Joiner (APDPL, Austin, TX)

7834a

Contextual Info: Tem ic S e m i c o n d u c t o r s Taping of SMD Couplers TEMIC couplers in SMD packages are available in an anti­ static 12 mm blister tape in accordance with DIN IEC 286-3 for automatic component insertion. The blister tape is a plastic strip with impressed component

VTP8651

Abstract: VTP1112 VTP4085 VTP1188S VTP11188S VTP1232 silicon photodiode array VTP1012 VTP7840 VTP100
Contextual Info: VTP Process Photodiodes VTP100 PACKAGE DIMENSIONS inch mm CASE 52 FLAT SIDELOOKER CHIP ACTIVE AREA: .012 in2 (7.45 mm2) PRODUCT DESCRIPTION Planar silicon photodiode in a molded plastic sidelooker package. The package material is infrared transmitting (blocking visible light).

CR6CM-12A

Abstract: diagram 3 phase heater CR6CM-12A-A8 PRSS0004AA-A
Contextual Info: CR6CM-12A Thyristor Medium Power Use REJ03G1706-0100 Rev.1.00 Jul 03, 2008 Features • IT AV : 6 A • VDRM : 600 V • IGT : 10 mA • Non-Insulated Type • Planar Passivation Type Outline RENESAS Package code: PRSS0004AA-A (Package name: TO-220) 4 2, 4

IRK E78996 701819-303ac

Abstract: IR E78996 105 IRK E78996 p432 I27900 TO-240AA weight
Contextual Info: Bulletin I27140 rev. E 10/02 IRK.56, .71 SERIES ADD-A-pakTM GEN V Power Modules STANDARD DIODES Features Benefits High Voltage Industrial Standard Package Thick Al metal die and double stick bonding Thick copper baseplate UL E78996 approved 3500VRMS isolating voltage

QFP PACKAGE thermal resistance

Abstract: SPRA953 Theta-JC plcc qfp132
Contextual Info: Application Report SPRA953 − December 2003 IC Package Thermal Metrics SC Packaging Development ABSTRACT Many thermal metrics exist for IC packages ranging from θja to Ψjt. Often, these thermal metrics are misapplied by customers who try to use them to estimate junction temperatures

CECC00802

Abstract: THCA
Contextual Info: VISHAY Vishay Semiconductors Assembly Instructions General Vishay offers a wide product selection of optocouplers and solid state relays in a variety of packages. This document provides instructions on mounting for the different types of packages, specifically on the different methods of soldering. For DIP packages, they

MC33275

Abstract: MC33275D 27533 27550 27533G 27550G 27525G MC33275DT-5.0G 27530G sot-223 body marking D K Q F
Contextual Info: MC33275, NCV33275 300 mA, Low Dropout Voltage Regulator The MC33275 series are micropower low dropout voltage regulators available in a wide variety of output voltages as well as packages, SOT−223, SOP−8, DPAK, and DFN 4x4 surface mount packages. These devices feature a very low quiescent current and are

marking 27530

Abstract: 27533
Contextual Info: MC33275, NCV33275 300 mA, Low Dropout Voltage Regulator The MC33275 series are micropower low dropout voltage regulators available in a wide variety of output voltages as well as packages, SOT−223, SOP−8, DPAK, and DFN 4x4 surface mount packages. These devices feature a very low quiescent current and are

27533G

Abstract: 27550G 27525G 27530G 27550 27533 27530 marking 27550 MC33275 NCV33275
Contextual Info: MC33275, NCV33275 300 mA, Low Dropout Voltage Regulator The MC33275 series are micropower low dropout voltage regulators available in a wide variety of output voltages as well as packages, SOT−223, SOP−8, DPAK, and DFN 4x4 surface mount packages. These devices feature a very low quiescent current and are

marking 27533

Abstract: marking 27550 27533 27533G 27550G 27550 27525g MC33275
Contextual Info: MC33275, NCV33275 300 mA, Low Dropout Voltage Regulator The MC33275 series are micropower low dropout voltage regulators available in a wide variety of output voltages as well as packages, SOT−223, SOP−8, DPAK, and DFN 4x4 surface mount packages. These devices feature a very low quiescent current and are

27533

Abstract: marking 37525 37525 QFN8 37530 marking 27550 MC3327DT-3
Contextual Info: MC33275, MC33375, NCV33275 Product Preview 300 mA, Low Dropout Voltage Regulator http://onsemi.com The MC33275 and MC33375 series are micropower low dropout voltage regulators available in a wide variety of output voltages as well as packages, SOT−223, SOP−8, DPAK and QFN−8, 4x4 surface