250v 224 K capacitor
Abstract: capacitor 106 16v tdk capacitors c5750 capacitor 226 25V airbag C3216X7R
Text: C SERIES | Soft Termination Capacitor TDK Soft Termination Series is designed for use in applications where significant board flex may occur. Safety/critical automotive applications such as ABS, ESP, airbag, and battery line applications are common examples.
|
Original
|
C3225
C1005/CC0402
C4532
C1608/CC0603
C5750
C2012/CC0805
C7563
250v 224 K capacitor
capacitor 106 16v
tdk capacitors c5750
capacitor 226 25V
airbag
C3216X7R
|
PDF
|
WHITE CAP FOR LAMP siemens
Abstract: No abstract text available
Text: IBSL BOX 24 DO 2/2 M12-2A INTERBUS Module for the Installation Local Bus with Two Digital Signal Outputs on M12 Actuator Sockets Data Sheet Revision A 03/1998 Product Description The installation local bus compatible output module is used to network distributed individual actuators on machines or in systems.
|
Original
|
M12-2A
WHITE CAP FOR LAMP siemens
|
PDF
|
IBS 24 bk-t
Abstract: No abstract text available
Text: IBSL BOX 24 DO 4/4 M12-2A INTERBUS Module for the Installation Local Bus with Four Digital Signal Outputs on M12 Actuator Sockets Data Sheet Revision A 03/1998 Product Description The installation local bus compatible output module is used to control distributed individual actuators
|
Original
|
M12-2A
IBS 24 bk-t
|
PDF
|
PSR4000 AUS308
Abstract: prepreg GHPL-830 taiyo AUS703 taiyo PSR4000 aus303 GHPL-830 THP 100 PSR4000 AUS703 Hitachi MCL-E-679FG MGC HL832 MCL-E-679FG
Text: Ball Grid Array Ball Grid Array • INTRODUCTION Ball Grid Array BGA is the one of package type which using the SMT. BGA package has several advantages for it's electrical, mechanical and thermal characteristics and these characteristics can come from it's outstanding structure. By using the PCB board and solder ball array
|
Original
|
HL832
HL832-HS
HL832-NB
MCL-E-679W
MCL-E-679BR
MCL-E-679FG
GHPL-830
GEA-679N
MR600
GHPL-830
PSR4000 AUS308
prepreg GHPL-830
taiyo AUS703
taiyo PSR4000 aus303
THP 100
PSR4000 AUS703
Hitachi MCL-E-679FG
MGC HL832
MCL-E-679FG
|
PDF
|
KS-886H
Abstract: Kostat tray
Text: Thermal Management and Mechanical Handling for Altera TCFCBGA Devices AN-657-1.1 Application Note This application note describes the thermal composite flip chip ball-grid array TCFCBGA package for the Arria V device family. TCFCBGA improves board real-estate use by allowing closer spacing between passive
|
Original
|
AN-657-1
KS-886H
Kostat tray
|
PDF
|
Untitled
Abstract: No abstract text available
Text: IBSL BOX 24 DO 2/2 M12-2A-D INTERBUS Module for the Installation Local Bus with Two Digital Signal Outputs on M12 Actuator Sockets Data Sheet Revision A 03/1998 Product Description The installation local bus compatible output module is used to network distributed individual actuators on machines or in systems.
|
Original
|
M12-2A-D
|
PDF
|
5358A
Abstract: IBS 24 bk-t M122A-D M12-2A-D IBS sl 24 BK-T QUICKON 1998
Text: IBSL BOX 24 DO 4/4 M12-2A-D INTERBUS Module for the Installation Local Bus with Four Digital Signal Outputs on M12 Actuator Sockets Data Sheet Revision A 03/1998 Product Description The installation local bus compatible output module is used to control distributed individual actuators
|
Original
|
M12-2A-D
5358A
IBS 24 bk-t
M122A-D
M12-2A-D
IBS sl 24 BK-T
QUICKON 1998
|
PDF
|
Untitled
Abstract: No abstract text available
Text: S even Points of Electrical Contact W hat sets our pins apart This unretouched photograph shows important differences between the TwistPin and stamped pins. A Stronger Front End Both types of contacts meet the requirements of MIL-DTL-83513. But only the TwistPin offers a stronger frontend with its seven points of contact,
|
Original
|
MIL-DTL-83513.
MIL-DTL-83513
MIL-DTL-32139
M39029
|
PDF
|
fuse n15
Abstract: 5249a IBS sl 24 BK-T S7-300 cable pcp 24V rectifier IBS 24 bk-t
Text: IBSL BOX 24 DIO 2/2/4 M12-2A Data Sheet INTERBUS Module for the Installation Local Bus with Two Digital Signal Inputs and Two Digital Signal Outputs on M12 Sockets Data Sheet Revision A 03/1998 Product Description The installation local bus compatible input and output module is
|
Original
|
M12-2A
fuse n15
5249a
IBS sl 24 BK-T
S7-300 cable
pcp 24V rectifier
IBS 24 bk-t
|
PDF
|
IPC-9701
Abstract: Amkor mold compound coreless substrate amkor flip "IPC-9701"
Text: LAMINATE data sheet FCMBGA Features Thermal Performance Flip Chip Molded Ball Grid Array FCMBGA Packages: Amkor’s flip chip molded BGA (FCMBGA) package enables thinner packaging and improves thermal performance while reducing system cost. Presenting an exposed die format, the
|
Original
|
MS-034
15mm-42
IPC-9701
Amkor mold compound
coreless substrate
amkor flip
"IPC-9701"
|
PDF
|
fuse n15
Abstract: 5354B
Text: IBSL BOX 24 DIO 2/2/4 M12-2A-D Data Sheet INTERBUS Module for the Installation Local Bus with Two Digital Signal Inputs and Two Digital Signal Outputs on M12 Sockets Data Sheet Revision B 02/1998 Product Description The installation local bus compatible input and output module is
|
Original
|
M12-2A-D
5354B
fuse n15
5354B
|
PDF
|
Pb95Sn5
Abstract: pcb warpage in ipc standard ROSIN FLUX TYPE ROL0 EIA-746 IPC-6012A MAXIM Assembly Locations OF CODE underfill dispense needle FR4 substrate height and thickness DS2761X J-STD-004 sn63pb37
Text: Maxim > App Notes > GENERAL ENGINEERING TOPICS PROTOTYPING AND PC BOARD LAYOUT Keywords: Wafer Level Package, WLP, Flip Chip, Flip-Chip, CSP, Chip Scale Package, PCB Assembly, PCBA, Die Product, Silicon Circuit, Silicon Die Circuit Oct 18, 2004 APPLICATION NOTE 3377
|
Original
|
DS2411:
DS2415:
DS2417:
DS2432:
DS2433:
DS2502:
DS2760:
DS2761:
DS2762:
DS9503:
Pb95Sn5
pcb warpage in ipc standard
ROSIN FLUX TYPE ROL0
EIA-746
IPC-6012A
MAXIM Assembly Locations OF CODE
underfill dispense needle
FR4 substrate height and thickness
DS2761X
J-STD-004 sn63pb37
|
PDF
|
joint filler board
Abstract: thick bga die size Amkor mold compound MS-034 amkor flip with or without underfill
Text: LAMINATE data sheet FCMBGA Thermal Performance: Flip Chip Molded Ball Grid Array FCMBGA Packages: FCMBGA packages are designed to allow die protrusion over the mold cap. This ensures the thinnest bond line and best thermal impedance between the FC die and the attached heat sink.
|
Original
|
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Application Specification 0.8 mm Cable Connector and Printed Circuit PC Board Header NOTE i 114- 6055 09 SEP 09 Rev A All numerical values are in metric units [with U.S. customary units in brackets]. Dimensions are in millimeters [and inches]. Unless otherwise specified, dimensions have a tolerance of +0.13 [+.005] and angles have a tolerance of +2_.
|
Original
|
|
PDF
|
|
|
Waveguide Gaskets
Abstract: MIL-DTL-85328 WR137 gasket dimensions M83528 001 Waveguide Gaskets WR187 ZZ-R-765 CLASS 2B, GRADE 50 SHELF LIFE m83528 MIL-DTL-83528C WR340 waveguide fluorosilicone curing
Text: Elastomeric EMI Shielding Solutions www.lairdtech.com Innovative Technology for a Connected World ANTENNAS & RECEPTION WIRELESS REMOTE CONTROL EMI SOLUTIONS THERMAL MANAGEMENT WIRELESS M2M & TELEMATICS ABOUT LAIRD TECHNOLOGIES Laird Technologies designs and manufactures customized, performance-critical
|
Original
|
|
PDF
|
US1 Series
Abstract: No abstract text available
Text: IBS RL 24 DIO 8/8/8 RS-LK -2MBD Digital Input/Output Module With Eight Inputs and Eight Relay Outputs Data Sheet 6080C 01/2002 Product Description The module is designed for use in systems engineering. With IP 67 protection, it is suitable for use without a control cabinet in harsh industrial
|
Original
|
6080C
US1 Series
|
PDF
|
TB477
Abstract: INTERSIL TRACEABILITY LOT PART MARKING land pattern for DFN Soldering guidelines pin in paste GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICES
Text: Surface Mount Assembly Guidelines for Optical Dual Flat Pack No Lead ODFN Package Technical Brief Introduction Optical Dual-in-line Flat No-lead (ODFN) packages are developed for light sensor applications. The mechanical structure of an ODFN is similar to that of a conventional
|
Original
|
TB477
INTERSIL TRACEABILITY LOT PART MARKING
land pattern for DFN
Soldering guidelines pin in paste
GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICES
|
PDF
|
TB477
Abstract: land pattern for DFN INTERSIL TRACEABILITY LOT PART MARKING Soldering guidelines pin in paste joint filler board
Text: Surface Mount Assembly Guidelines for Optical Dual Flat Pack No Lead ODFN Package Technical Brief Introduction Optical Dual-in-line Flat No-lead (ODFN) packages are developed for light sensor applications. The mechanical structure of an ODFN is similar to that of a conventional
|
Original
|
TB477
land pattern for DFN
INTERSIL TRACEABILITY LOT PART MARKING
Soldering guidelines pin in paste
joint filler board
|
PDF
|
Alumina ceramic AI203
Abstract: ausi die attach gold metal detectors AI203 gold melting furnace pressure low die attach spot welding schematics ausi die attach thin silicon die Dissolve Oxygen ceramic pin grid array package wire bond
Text: Alumina & Leaded Molded Technology 3 3.1 Introduction The packaging technologies used to manufacture or assemble three basic types of component packages are summarized in this chapter. The package families, described in Chapter 1, provide the functional specialization and diversity
|
Original
|
|
PDF
|
AMP din 72585
Abstract: hk120 DIN 72585 cannon apd din 72585 connector 121668-0222 cannon plug pin chart 121583-0058 APD-1BS din 72585 form 1 121583-0085
Text: Interconnect Technologies & Solutions for the Transportation Industry For over 90 years, ITT has been developing innovative solutions for harsh environment applications. We have a proven track record of demonstrating our expertise and commitment to the transportation industry, offering the broadest portfolio of interconnect products.
|
Original
|
|
PDF
|
ed28 smd diode
Abstract: hv 102 mos fet transistor diagram of high frequency pvc welding machine schematic diagram of electric cookers Ultrasonic Cleaner schematic engel injection machines TEG 2423 40khz ULTRASOUND CLEANER ultrasonic generator 40khz for cleaning schematic of trigger 555 n-mosfet
Text: FAILURE MECHANISMS OF SEMICONDUCTOR DEVICES III. FAILURE MECHANISMS OF SEMICONDUCTOR DEVICES 1. INTRODUCTION 2. FAILURE MECHANISMS AND SCREENING 3. FAILURE MECHANISMS ATTRIBUTED TO WAFER FABRICATION PROCESS 3.1 HOT CARRIER 3.3.1.1 INTRODUCTION 3.3.1.2 HOT CARRIER MECHANISM
|
Original
|
ED-4701-1
C-113:
ed28 smd diode
hv 102 mos fet transistor
diagram of high frequency pvc welding machine
schematic diagram of electric cookers
Ultrasonic Cleaner schematic
engel injection machines
TEG 2423
40khz ULTRASOUND CLEANER
ultrasonic generator 40khz for cleaning
schematic of trigger 555 n-mosfet
|
PDF
|
LDMOS PA Driver IC, Motorola
Abstract: MHVIC910HR2 AN1949 RO4350
Text: MOTOROLA Freescale Semiconductor, Inc. SEMICONDUCTOR APPLICATION NOTE Order this document by AN1949/D AN1949 Mounting Method for the MHVIC910HR2 PFP-16 and Similar Surface Mount Packages Prepared by: Wendi Stemmons, Richard Wetz, Mahesh Shah, Eddie Mares, Jin–Wook Jang and Lynn Frye
|
Original
|
AN1949/D
AN1949
MHVIC910HR2
PFP-16)
LDMOS PA Driver IC, Motorola
MHVIC910HR2
AN1949
RO4350
|
PDF
|
JEDEC J-STD-033b.1
Abstract: TB487 INTERSIL TRACEABILITY LOT PART MARKING
Text: Technical Brief 487 Author: Lynn Wiese Surface Mount Assembly Guidelines for Optical Co-Package Sensor and LED Introduction Optical co-packages are developed for light sensor and proximity applications; they have an LED as well as a silicon chip in each device. The co-package mechanical structure is
|
Original
|
TB487
JEDEC J-STD-033b.1
INTERSIL TRACEABILITY LOT PART MARKING
|
PDF
|
SMTO-8
Abstract: WATKINS-JOHNSON CO WATKINS-JOHNSON CO SMTO-8 IN5880
Text: A Revolutionary RF/Microwave "Surface-Mount" Product Line by: Louis M. Seieroe, Kenneth S. Ledford, Timothy J. Bianey and Louis Hsiao Watkins-Johnson Company Palo Alto, CA The emphasis on improving system per formance by adding new features, while at the same time reducing overall system
|
OCR Scan
|
96-hour
SMTO-8
WATKINS-JOHNSON CO
WATKINS-JOHNSON CO SMTO-8
IN5880
|
PDF
|
