Package tray
Abstract: OT-007TM-01 PPO datasheet jedec Package QFP JEDEC tray JEDEC tray
Text: 77.46 29.22 135.9 OT-007TM-01 UNIT : mm A 50.56 31.10 A' 252.8 315 322.6 <SECTION A - A'> 4.12 7.62 6.35 39.57 48.8 Tray Material Heat Proof Temp. Surface resistance OT-007TM-01 JEDEC Tray Carbon PPO 125°C less than 1x106Ω / Applied Package Quantity(PCS)
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OT-007TM-01
Package tray
OT-007TM-01
PPO datasheet
jedec Package
QFP JEDEC tray
JEDEC tray
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JEDEC TRAY DIMENSIONS
Abstract: JEDEC tray standard OT-007TM-01 JEDEC tray QFP JEDEC tray JEDEC tray standard 10 TRAY MATERIAL
Text: 39.57 135°C MAX 77.46 29.22 135.9 OT-007TM-01 UNIT : mm A 50.56 31.10 A' 39.57 252.8 315 322.6 <SECTION A - A'> 4.12 6.35 7.62 39.57 48.8 Tray OT-007TM-01 (JEDEC Tray) Material Carbon PPO Heat Proof Temp. Surface resistance 135°C 12 less than 1 x 10 Ω /
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OT-007TM-01
JEDEC TRAY DIMENSIONS
JEDEC tray standard
OT-007TM-01
JEDEC tray
QFP JEDEC tray
JEDEC tray standard 10
TRAY MATERIAL
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240-pin
Abstract: LA-3522A-1
Text: Mounting Pad Packing NEC Tray JEDEC Tray Name LA-3522A-1 MQFP 32x32 3.2mm 240 pin QFP 32 × 32 Terminal Spacing Linear = 0.5 A B 180 181 121 120 detail of lead end S C D R Q 240 1 F G 61 60 H I J M P K M N S L NOTE ITEM 1. Controlling dimention millimeter.
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LA-3522A-1
P240GN-50-LMU,
240-pin
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JEDEC TQFP 10*10 1.0 MM
Abstract: No abstract text available
Text: Mounting Pad Packing NEC Tray JEDEC Tray Name LA-3A73B-1 TQFP 10x10 1.0T 64 pin TQFP 10 × 10 Terminal Spacing Linear = 0.5 A B 48 33 32 49 F 64 R Q S D C detail of lead end 17 16 1 G H I M J M P K N L NOTE ITEM Each lead centerline is located within 0.10 mm (0.004 inch) of
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LA-3A73B-1
S64GB-50-9EU-1
JEDEC TQFP 10*10 1.0 MM
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JEDEC TRAY QFP
Abstract: QFP JEDEC tray nec 44-pin qfp LA-042A-1 P44G-80-22-2 p44g
Text: Packing Name LA-3242A-1 Mounting Pad NEC Tray LA-042A-1 LA-3242A JEDEC Tray QFP 10x10×1.45 44 pin QFP 10 × 10 Terminal Spacing Linear = 0.8 A B Q F G H I M 5˚±5˚ 12 11 S 44 1 detail of lead end D 23 22 C 33 34 J M P K N L NOTE Each lead centerline is located within 0.15
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LA-3242A-1
LA-042A-1
LA-3242A
P44G-80-22-2
JEDEC TRAY QFP
QFP JEDEC tray
nec 44-pin qfp
LA-042A-1
P44G-80-22-2
p44g
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PGA weight
Abstract: NEC 1169
Text: Packing Name NEC Tray LA-A76 JEDEC Tray PGA 20x20 447 pin Ceramic PGA Metal Slug A V W2 (Bottom View) X D P W1 Q 2-10-32UNF 2-M3 R S I J Index mark H G N E K L φM M F X447RP-50A NOTE Each lead centerline is located within φ 0.254 mm ( φ 0.010 inch) of its true position (T.P.) at
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LA-A76
2-10-32UNF
X447RP-50A
PGA weight
NEC 1169
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NEC 2701
Abstract: NEC D 582 2701 NEC LA-1244A-1 transistor NEC D 582 QFP JEDEC tray 1802M
Text: Packing Name LA-2244A-1 Mounting Pad NEC Tray LA-1244A-1 LA-044A-1 JEDEC Tray MQFP 14x20 2.7mm 64 pin QFP 14 × 20 Terminal Spacing Linear = 1.0 A B 51 52 detail of lead end 33 32 C D S R Q 64 1 20 19 F G H I M P J K M N L NOTE ITEM Each lead centerline is located within 0.20 mm (0.008 inch) of
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LA-2244A-1
LA-1244A-1
LA-044A-1
SC-582-A
P64GF-100-3B8,
P64GF-100-3B8
NEC 2701
NEC D 582
2701 NEC
LA-1244A-1
transistor NEC D 582
QFP JEDEC tray
1802M
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S64GF
Abstract: No abstract text available
Text: Mounting Pad Packing Name LA-2244A-1 NEC Tray LA-1244A-1 LA-044A-1 JEDEC Tray MQFP 14x20 2.7mm 64 pin QFP 14 × 20 Terminal Spacing Linear = 1.0 A B 51 52 33 32 detail of lead end C D S R Q 64 1 20 19 F J G H I M P K M N L NOTE ITEM Each lead centerline is located within 0.20 mm (0.008 inch) of
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LA-2244A-1
LA-1244A-1
LA-044A-1
039ch)
S64GF-100-3B8,
S64GF
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transistor NEC D 587
Abstract: NEC D 587 LA-3525A-1 LA-0525A-1
Text: Mounting Pad Packing NEC Tray Name LA-3525A-1 LA-0525A-1 JEDEC Tray OT-001T-01 160 pin QFP 28 x 28 Terminal Spacing Linear = 0.65 A B 81 80 120 121 detail of lead end C D S Q 160 1 R 41 40 F G H I J M P K M N L NOTE Each lead centerline is located within 0.15 mm (0.006 inch) of
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LA-3525A-1
LA-0525A-1
OT-001T-01
P160GD-65-5BD-3
SC-587-B
transistor NEC D 587
NEC D 587
LA-0525A-1
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P160GD-65-LBD
Abstract: No abstract text available
Text: Packing NEC Tray Name LA-3508A-1 Mounting Pad JEDEC Tray OT-001T-01 160 pin QFP 28 x 28 Terminal Spacing Linear = 0.65 A 81 80 160 1 41 40 F C 120 121 D B G H I M detail of lead end J N 5°±5° M Q P S K L P160GD-65-LBD, MBD NOTE Each lead centerline is located within 0.13 mm
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LA-3508A-1
OT-001T-01
P160GD-65-LBD,
P160GD-65-LBD
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P120GD-80-LBB
Abstract: No abstract text available
Text: Packing NEC Tray JEDEC Tray Name LA-3508A-1 MQFP 28x28 3.2mm OT-001T-01 Mounting Pad 120 pin QFP 28 × 28 Terminal Spacing Linear = 0.8 A B 90 61 91 60 F 120 1 R Q S D C detail of lead end 31 30 J G H I M M P K N ITEM NOTE Each lead centerline is located within 0.15 mm (0.006 inch) of
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LA-3508A-1
OT-001T-01
P120GD-80-LBB,
P120GD-80-LBB
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transistor NEC D 587
Abstract: 3525a LA-0525A-1 LA-3525A-1 136-pin
Text: Mounting Pad Packing NEC Tray Name LA-3525A-1 LA-0525A-1 JEDEC Tray OT-001T-01 136 pin QFP 28 x 28 Terminal Spacing Linear = 0.65 A B 102 103 69 68 F 136 1 G 5°±5° Q S C D detail of lead end 35 34 H I M J M P K N L P136GD-65-5BC-3 NOTE Each lead centerline is located within 0.15
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LA-3525A-1
LA-0525A-1
OT-001T-01
P136GD-65-5BC-3
SC-587-B
transistor NEC D 587
3525a
LA-0525A-1
136-pin
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transistor NEC D 586
Abstract: NEC D 586 P120GD-80-5BB-3 3525a SC-586-B LA-0525A-1 LA-3525A-1
Text: Mounting Pad Packing NEC Tray Name LA-3525A-1 LA-0525A-1 JEDEC Tray OT-001T-01 120 pin QFP 28 x 28 Terminal Spacing Linear = 0.8 A B 90 91 61 60 F 120 1 5°±5° Q D C S detail of lead end 31 30 G H I M J M P K N L P120GD-80-5BB-3 NOTE Each lead centerline is located within 0.15
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LA-3525A-1
LA-0525A-1
OT-001T-01
P120GD-80-5BB-3
SC-586-B
transistor NEC D 586
NEC D 586
P120GD-80-5BB-3
3525a
SC-586-B
LA-0525A-1
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0038 tsop
Abstract: No abstract text available
Text: Packing JEDEC Tray Name TSOP 2 400MIL21 Mounting Pad 32 pin TSOP (II) (400 mil) 32 17 1 P E F detail of lead end 16 A H J K G I N C D M B L M NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at maximum material condition.
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400MIL21
S32G5-50-7JD2
0038 tsop
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Untitled
Abstract: No abstract text available
Text: Packing JEDEC Tray Name TSOP 2 400MIL21 Mounting Pad 32 pin TSOP (II) (400 mil) 17 32 E 5°±5° F detail of lead end 1 16 A H J K G I N C D M B L M S32G5-50-7JD1-1 NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at
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400MIL21
S32G5-50-7JD1-1
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TSOP 54 tray
Abstract: tsop 0038
Text: Packing JEDEC Tray Name TSOP 2 400MIL21 Mounting Pad 32 pin TSOP (II) (400 mil) 17 32 F E 5°±5° detail of lead end 1 16 A D M M C L B G K N I J H S32G5-50-7KD1-1 NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at
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400MIL21
S32G5-50-7KD1-1
TSOP 54 tray
tsop 0038
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tray datasheet bga
Abstract: BGA35
Text: Mounting Pad Packing Name JEDEC Tray T-657 352 pin BGA 35 x 35 A S B C D P J H R K L φM F E I G M NOTE Each ball centerline is located within φ 0.30 mm (φ 0.012 inch) of its true position (T.P.) at maximum material condition. ITEM A MILLIMETERS 35.00±0.15
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T-657
P352S1-F6
tray datasheet bga
BGA35
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SOP 812
Abstract: No abstract text available
Text: Packing Magazine Name MM525-02A LB-066 Mounting Pad JEDEC Tray 32P SOP 32 pin SOP 525 mil 32 17 +7° 1 3° –3° detail of lead end 16 A J E K F G H I N C D L B M M P32GW-50-525A NOTE Each lead centerline is located within 0.12 mm (0.005 inch) of its true position (T.P.) at
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MM525-02A
LB-066
P32GW-50-525A
SOP 812
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ATMEL Tape and Reel drawing
Abstract: ATMEL Tape and Reel code JEDEC Drawing MO-220 qfn48 Atmel Moisture sensitivity level Moisture/ATMEL Tape and Reel QFN-64 ATSAMD21G18
Text: Atmel SAM D21E / SAM D21G / SAM D21J SMART ARM-Based Microcontroller DATASHEET SUMMARY Description The Atmel | SMART SAM D21 is a series of low-power microcontrollers using the 32-bit ARM® Cortex®-M0+ processor, and ranging from 32- to 64-pins with up to 256KB Flash and
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32-bit
64-pins
256KB
48MHz
ATMEL Tape and Reel drawing
ATMEL Tape and Reel code
JEDEC Drawing MO-220 qfn48
Atmel Moisture sensitivity level
Moisture/ATMEL Tape and Reel QFN-64
ATSAMD21G18
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ATSAMD21G18
Abstract: No abstract text available
Text: Atmel SAM D21E / SAM D21G / SAM D21J SMART ARM-Based Microcontroller DATASHEET SUMMARY Description The Atmel | SMART SAM D21 is a series of low-power microcontrollers using the 32-bit ARM® Cortex®-M0+ processor, and ranging from 32- to 64-pins with up to 256KB Flash and
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32-bit
64-pins
256KB
48MHz
ATSAMD21G18
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Untitled
Abstract: No abstract text available
Text: Atmel SAM D20J / SAM D20G / SAM D20E ARM-Based Microcontroller DATASHEET SUMMARY Description The Atmel SAM D20 is a series of low-power microcontrollers using the 32-bit ARM® Cortex®-M0+ processor, and ranging from 32- to 64-pins with up to 256KB Flash and
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32-bit
64-pins
256KB
48MHz
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tray lqfp
Abstract: JEDEC qfn tray QFn Package tray JEDEC TRAY DIMENSIONS QFN
Text: ARM-based Flash MCU SAM4S Series SUMMARY DATASHEET Description The Atmel SAM4S series is a member of a family of Flash microcontrollers based on the high-performance 32-bit ARM Cortex ® -M4 RISC processor. It operates at a maximum speed of 120 MHz and features up to 2048 Kbytes of Flash, with optional
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32-bit
tray lqfp
JEDEC qfn tray
QFn Package tray
JEDEC TRAY DIMENSIONS QFN
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ATSAMD21G18
Abstract: No abstract text available
Text: Atmel SAM D21E / SAM D21G / SAM D21J SMART ARM-Based Microcontroller DATASHEET SUMMARY Description The Atmel | SMART SAM D21 is a series of low-power microcontrollers using the 32-bit ARM® Cortex®-M0+ processor, and ranging from 32- to 64-pins with up to 256KB Flash and
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32-bit
64-pins
256KB
48MHz
ATSAMD21G18
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JEDEC TRAY DIMENSIONS
Abstract: JEDEC tray standard JEDEC tray standard 13 tsop Shipping Trays 32 jedec tray Shipping Trays jedec tray 32 0925D
Text: TRAY SPECIFICATIONS 32-pin TSOP-I Package Tray Critical Dimensions TEMP. RATING A B NOTES: 1. Surface electric resistivity of tray ranges from: < 1E+7 Ohm/sq. 2. The molded tray’s material shall be rigid enough to avoid damage to the components during handling, loading,
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32-pin
865495TG5
T944G
545-FRAM,
JEDEC TRAY DIMENSIONS
JEDEC tray standard
JEDEC tray standard 13
tsop Shipping Trays
32 jedec tray
Shipping Trays
jedec tray 32
0925D
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