SMD Packages
Abstract: No abstract text available
Text: IPC/JEDEC J-STD-033A July 2002 Supersedes IPC/JEDEC J-STD-033 April 1999 JOINT INDUSTRY STANDARD Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices NOTICE JEDEC standards and publications contain material that has been prepared, reviewed, and approved through the JEDEC Board of
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J-STD-033A
J-STD-033
SMD Packages
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A2ND
Abstract: No abstract text available
Text: JEDEC STANDARD Marking, Symbols, and Labels for Identification of Lead Pb Free Assemblies, Components, and Devices JESD97 MAY 2004 JEDEC SOLID STATE TECHNOLOGY ASSOCIATION NOTICE JEDEC standards and publications contain material that has been prepared, reviewed, and
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JESD97
A2ND
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JEDEC Jc-11 free
Abstract: Pub-95 TRANSISTOR Outlines JC11 JEP95 JEDEC diode Outlines IEC47D BGA OUTLINE DRAWING JEDEC bga case outline diode outlines
Text: JEDEC Publication 95 Microelectronic Package Standard Application Report 1999 Printed in U.S.A. 0199 SZZA006 JEDEC Publication 95 Microelectronic Package Standard SZZA006 January 1999 1 IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products
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SZZA006
5M-1994,
JEDEC Jc-11 free
Pub-95
TRANSISTOR Outlines
JC11
JEP95
JEDEC diode Outlines
IEC47D
BGA OUTLINE DRAWING
JEDEC bga case outline
diode outlines
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Untitled
Abstract: No abstract text available
Text: 1.27mm .050" Pitch SIMM Socket FEATURES AND SPECIFICATIONS Reference Information Product Specification: PS-78968 Packaging: Tray UL File No.: E29179 CSA File No.: LR19980 Mates With: JEDEC modules Designed In: Inches Electrical Voltage: 250V Current: 1.0A
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PS-78968
E29179
LR19980
100Gold
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Untitled
Abstract: No abstract text available
Text: 1.27mm .050" Pitch SIMM Socket FEATURES AND SPECIFICATIONS Reference Information Product Specification: PS-78954 Packaging: Tray UL File No.: E29179 CSA File No.: LR19980 Mates With: JEDEC modules Designed In: Inches Electrical Voltage: 250V Current: 1.0A
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PS-78954
E29179
LR19980
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SB865A
Abstract: SB866A ddr2 PLL JESD82 SSTUx32864 SSTU32868 JEDEC DDR2-400 2rx8 SB866 SN74SSTUB32866
Text: Application Report SCAA101 – March 2009 DDR2 Memory Interface Clocks and Registers – Overview Christian Schmoeller . CDC - Clock Distribution Circuits ABSTRACT This application report gives an overview of the existing JEDEC DDR2 Register and
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SCAA101
SB865A
SB866A
ddr2 PLL
JESD82
SSTUx32864
SSTU32868
JEDEC DDR2-400
2rx8
SB866
SN74SSTUB32866
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EIA and EIAJ tape standards
Abstract: TR3000MT TR-3000MT EIA and EIAJ standards
Text: TAPE AND REEL EQUIPMENT REEL-TECH TR-3000MT • ■ ■ ■ ■ ■ ■ ■ Dual pick-and-place probes 3400 UPH tray-to-tape Continuous operation 8-inch high stack of JEDEC trays Easy PC control Quick, accurate changeovers Mark, implied lead and pin #1 Vision
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TR-3000MT
TR-3000MT
EIA and EIAJ tape standards
TR3000MT
EIA and EIAJ standards
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Package tray
Abstract: OT-007TM-01 PPO datasheet jedec Package QFP JEDEC tray JEDEC tray
Text: 77.46 29.22 135.9 OT-007TM-01 UNIT : mm A 50.56 31.10 A' 252.8 315 322.6 <SECTION A - A'> 4.12 7.62 6.35 39.57 48.8 Tray Material Heat Proof Temp. Surface resistance OT-007TM-01 JEDEC Tray Carbon PPO 125°C less than 1x106Ω / Applied Package Quantity(PCS)
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OT-007TM-01
Package tray
OT-007TM-01
PPO datasheet
jedec Package
QFP JEDEC tray
JEDEC tray
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78730-1002
Abstract: 78726-1005
Text: Available in Press-fit, SMT and Through-hole mounting, DDR4 DIMM sockets offer significant assemblyprocessing compatibility and cost savings in high-speed server memory applications Meeting JEDEC specifications, Molex’s Vertical Press-fit, SMT and Through
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PS-78730-001
PS-78731-001
USA/KC/2014
78730-1002
78726-1005
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2013310-2
Abstract: JEDEC tray standard DIMM 240 2013298-1 2-2013310-1 2013289-1
Text: DDR3 DIMM Sockets TE Connectivity’ DIMM sockets address interconnect requirements across server, communications, and notebook platforms. This product portfolio is designed around JEDEC industry standards. Sockets are offered with a variety of features designed to
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Teradyne connector
Abstract: 470-2075-100 470-2105-100 337 BGA footprint 471-2045-100 471-1045-100 471-1025-100 470-2235-100 BGA PROFILING Teradyne
Text: TB-2082 DFM and SMT Assembly Guideline Revision “C“ Specification Revision Status Revision SCR No. Description Initial Date “-“ “A” 33277 36994 J. Marvin J. Proulx 1/16/01 10/19/01 “B” “C” 39831 42921 Initial Release Update stencil design, JEDEC tray info, add weight
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TB-2082
Teradyne connector
470-2075-100
470-2105-100
337 BGA footprint
471-2045-100
471-1045-100
471-1025-100
470-2235-100
BGA PROFILING
Teradyne
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JEDEC TRAY DIMENSIONS
Abstract: JEDEC tray standard OT-007TM-01 JEDEC tray QFP JEDEC tray JEDEC tray standard 10 TRAY MATERIAL
Text: 39.57 135°C MAX 77.46 29.22 135.9 OT-007TM-01 UNIT : mm A 50.56 31.10 A' 39.57 252.8 315 322.6 <SECTION A - A'> 4.12 6.35 7.62 39.57 48.8 Tray OT-007TM-01 (JEDEC Tray) Material Carbon PPO Heat Proof Temp. Surface resistance 135°C 12 less than 1 x 10 Ω /
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OT-007TM-01
JEDEC TRAY DIMENSIONS
JEDEC tray standard
OT-007TM-01
JEDEC tray
QFP JEDEC tray
JEDEC tray standard 10
TRAY MATERIAL
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1-1735438-2
Abstract: DDR3 DIMM 6-1773454-7 PEAK TRAY 2-2013289-1 2013289-1 1735438-2 1735438-4 2-2013289 2-2013287-2 2-2013287-3
Text: DDR3 DIMM Sockets The Tyco Electronics’ DIMM sockets address interconnect requirements across server, communications, and notebook platforms. This product portfolio is designed around JEDEC industry standards. Sockets are offered with a variety of features designed to
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3-201e
1-1735438-2
DDR3 DIMM
6-1773454-7
PEAK TRAY
2-2013289-1 2013289-1
1735438-2
1735438-4
2-2013289
2-2013287-2
2-2013287-3
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Untitled
Abstract: No abstract text available
Text: Features and Benefits Electrical Voltage: 250V contact life and provide for fast on-line assembly Current: 1.0A Guaranteed 2 points of contact per readout with standard Contact Resistance: 30mΩ max. JEDEC module Dielectric Withstanding Voltage: 1000V AC
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simm socket
Abstract: simm socket 40 socket, simm PS-78968
Text: Features and Benefits Electrical Voltage: 250V contact life and provide for fast on-line assembly Current: 1.0A Guaranteed 2 points of contact per readout with standard Contact Resistance: 30mΩ max. JEDEC module Dielectric Withstanding Voltage: 1000V AC
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PS-78968
E29179
LR19980
MO-116
simm socket
simm socket 40
socket, simm
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JEDEC tray standard dimension
Abstract: simm socket jedec SIMM MO-116
Text: Features and Benefits Electrical Voltage: 250V contact life and provide for fast on-line assembly Current: 1.0A Guaranteed 2 points of contact per readout with standard Contact Resistance: 30mΩ max. JEDEC module Dielectric Withstanding Voltage: 1000V AC
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PS-78968
E29179
LR19980
MO-116
JEDEC tray standard dimension
simm socket
jedec SIMM MO-116
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JEDEC tray standard dimension
Abstract: No abstract text available
Text: Features and Benefits Electrical Voltage: 250V contact life and provide for fast on-line assembly Current: 1.0A Guaranteed 2 points of contact per readout with standard Contact Resistance: 30mΩ max. JEDEC module Dielectric Withstanding Voltage: 1000V AC
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PS-78968
E29179
LR19980
MO-116
JEDEC tray standard dimension
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Untitled
Abstract: No abstract text available
Text: Features and Benefits Electrical Voltage: 250V contact life and provide for fast on-line assembly Current: 1.0A Guaranteed 2 points of contact per readout with standard Contact Resistance: 30mΩ max. JEDEC module Dielectric Withstanding Voltage: 1000V AC
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54189
Abstract: No abstract text available
Text: Sockets and Edge Connectors FEATURES AND SPECIFICATIONS E Features and Benefits Sizes 144 circuits Mounted Height: 10.0mm Accepts JEDEC standard SGRAM modules Plastic latch prevents scratching of module, while metal anti-overstress feature protects latch from bending too
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jedec SIMM MO-116
Abstract: 15-82-1175 78954 molex Molex 78962
Text: Features and Benefits Electrical Voltage: 250V contact life and provide for fast on-line assembly Current: 1.0A Guaranteed 2 points of contact per readout with standard Contact Resistance: 30mΩ max. JEDEC module Dielectric Withstanding Voltage: 1000V AC
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PS-78954
E29179
LR19980
MO-116
jedec SIMM MO-116
15-82-1175
78954 molex
Molex 78962
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MO-160
Abstract: MO-190 JEDEC tray standard
Text: S.O. DIMM Connectors Features/Benefits SERIES 6401 Series 6401 is a right-angle SMT connector, conforming to JEDEC MO-160 standard of S.O. DIMM. TECHNICAL SPECIFICATIONS Application: Pitch: Number of Contacts: Height: Current Rating: Voltage Rating: Mating Cycles
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MO-160
MO-160
MO-190
JEDEC tray standard
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SMT CONNECTOR
Abstract: JEDEC tray standard
Text: S.O. DIMM Connectors Features/Benefits SERIES 6401 Series 6401 is a right-angle SMT connector, conforming to JEDEC MO-160 standard of S.O. DIMM. TECHNICAL SPECIFICATIONS Application: Pitch: Number of Contacts: Height: Current Rating: Voltage Rating: Mating Cycles
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MO-160
MO-160
SMT CONNECTOR
JEDEC tray standard
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JEDEC dip profile
Abstract: No abstract text available
Text: S.O. DIMM Connectors Features/Benefits SERIES 6401 Series 6401 is a right-angle SMT connector, conforming to JEDEC MO-160 standard of S.O. DIMM. TECHNICAL SPECIFICATIONS Application: Pitch: Number of Contacts: Height: Current Rating: Voltage Rating: Mating Cycles
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MO-160
MO-160
JEDEC dip profile
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Untitled
Abstract: No abstract text available
Text: •&AEC INTERC0HNECT10N SPECIALISTS LCC SOCKETS FOR SMD JEDEC TYPE C DEVICES Typical Cellular Telephone Application (Patent Pending) Andon has developed a leadless ceramic chip socket contact providing excellent electrical conductivity and excellent mechanical security.
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INTERC0HNECT10N
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