JEDEC QFN CASE OUTLINE Search Results

QFN56

Contextual Info: FREESCALE SEMICONDUCTOR, INC. ALL RIGHTS RESERVED. TITLE: MECHANICAL OUTLINE PRINT VERSION NOT TO SCALE DOCUMENT NO: 98ARJ10510D QUAD FLAT NON-LEADED PACKAGE QFN CASE NUMBER: 1674-02 56 TERMINAL, 0.5 PITCH ( 8X8X0. 9) STANDARD: NON-JEDEC CASE-OUTLINE

Contextual Info: VIEW ROTATED 90° CW FREESCALE SEMICONDUCTOR, INC. ALL RIGHTS RESERVED. TITLE: MECHANICAL OUTLINE PRINT VERSION NOT TO SCALE DOCUMENT NO: 98ARJ10509D QUAD FLAT NON-LEADED PACKAGE QFN; CASE NUMBER: 1657-01 56 TERMINAL, 0.5 PITCH (8X8X1 STANDARD: NON-JEDEC

Contextual Info: B Ü I 1 0.1 C 2X 2.25 1.95 4- 0.1 c A ^ 0.1 C 2X 19 I EXPOSED DIE ATTACH PAD 18- I M CD PIN 1 -INDEX AREA DETAIL M I <p W PIN 1 INDEX ! -B2. 25 1. 95 CD 4- 0.1 C A -B-B-B- 13 —E - < r cbÒttüfbÒÓ I I H TITLE: MECHANICAL OUTLINE THERMALLY ENHANCED QUAD

162701

Contextual Info: PIN 1 INDEX AREA DETAIL M PIN 1 INDEX DETAIL N 32X 0.50 0.30 0 . 1 C A B 0.05® C F R E E S C A L E SEMICONDUCTOR, ALL R I G H T S RESERVED. INC. VIEW M -M MECHANICAL OUTLINE THERMALLY ENHANCED QUAD FLAT NON-LEADED PACKAGE QFN 32 TERMINAL, 0.5 PITCH ( 5 X 5 X 1 )

4x4x1

Abstract: 98ARH99061A 050 qfn 16
Contextual Info: DETAIL G M PIN 1 INDEX AREA EXPOSED DIE ATTACH PAD o > rh p DETAIL N 0 .0 5 C FREESCALE SEMICONDUCTOR, INC. ALL RIGHTS RESERVED. B 16X 0 .7 5 0 .5 0 VIEW M - M MECHANICAL OUTLINE THERMALLY ENHANCED QUAD FLAT N O N -LE A D E D PACKAGE QFN 16 TERMINAL, 0 .6 5 PITCH ( 4 X 4 X 1 )

Contextual Info: AA 10 PIN 1 INDEX AREA 28 27 26 25 10 U [ZSlcTilc P IN N U M B E R REF. O N L Y 2X A |^ | ~r - -Q5T rr o I— 0 . 8 — I c DETAIL (VIEW POWER QUAD ROTATED 9 0 ° CW) MECHANICAL OUTLINE F LA T NO N -LEAD ED PACKAGE 29 0.8 TERMINAL, " |- - ( - ( 0 . 5 5 )

jedec package MO-220 QFN-32

Abstract: jedec package MO-220 jedec package MO-220 16 pin MO-220 jedec package MO-220 for qfn JEDEC MO-220 JEDEC QFN case outline 24 terminal jedec package MO-220 jedec package MO-220 vhhd4 jedec MO-220 QFN 16
Contextual Info: DETAIL G PIN 1 INDEX AREA DETAIL N 32X 0.45 0.35 <§> o o U1 A B rh 0 . 1 C C V IE W F R E E S C A L E SEMICONDUCTOR, ALL RI GH TS RESERVED. INC. MECHANICAL OUTLINE THERMALLY ENHANCED QUAD FLAT NON-LEADED PACKAGE QFN 32 TERMINAL, 0.5 PITCH (5 X 5 X 1 ,

qfn24

Abstract: QFN-24
Contextual Info: FREESCALE SEMICONDUCTOR, INC. ALL RIGHTS RESERVED. TITLE: MECHANICAL OUTLINE THERMALLY ENHANCED QUAD FLAT NON-LEADED PACKAGE QFN 24 TERMINAL, 0.5 PITCH ( 4 X 4 X 1 ) PRINT VERSION NOT TO SCALE DOCUMENT NO: 98ARL10605D REV: 0 CASE NUMBER: 1897-01 08 SEP 2006

Contextual Info: FREESCALE SEMICONDUCTOR, INC. ALL RIGHTS RESERVED. MECHANICAL OUTLINE TITLE: THERMALLY ENHANCED QUAD FLAT NON-LEADED PACKAGE QFN 24 TERMINAL, 0.5 PITCH ( 4 X 4 X 1 ) PRINT VERSION NOT TO SCALE DOCUMENT NO: 98ARE10714D REV: 0 CASE NUMBER: 1969-01 23 JUL 2007

jedec package MO-220

Abstract: jedec package MO-220 VKKD-4 jedec package MO-220 vkkd4 MO-220 jedec package MO-220 for qfn QFN-48 jedec package MO-220 vkkd jedec package MO-220-VKKD-4 qfn48 JEDEC MO-220
Contextual Info: DETAIL G PIN 1 INDEX AREA M * 0.1 c A B DETAIL M PIN 1 INDEX □ ü ü ü ü CHO ü ü ü Ü EXPOSED DIE ATTACH PAD rh F R E E S C A L E SEMICONDUCTOR, ALL RI GH TS RESERVED. INC. 0 .1 C A B 0 .0 5 ® C VIEW M - M MECHANICAL OUTLINE TITLE: THERMALLY ENHANCED QUAD

jedec package MO-220 QFN-32

Abstract: jedec package MO-220 MO-220 jedec package MO-220-vhhd-5 jedec package MO-220 for qfn JEDEC MO-220 98ARE10739D
Contextual Info: * 0.1 c A CD INDEX AREA DETAIL M PIN 1 INDEX . - n n n n n EXPOSED DIE ATTACH PAD DETAIL N 32X 0.5 0.3 rh F R E E S C A L E SEMICONDUCTOR, ALL RI GH TS RESERVED. TITLE: 0 .1 C A B 0 .0 5 ® C INC. VIEW M - M MECHANICAL OUTLINE THERMALLY ENHANCED QUAD

QFN52

Abstract: M0-220
Contextual Info: PIN 1 INDEX AREA DETAIL M EXPOSED DIE ATTACH PAD PIN 1 INDEX 5 .7 ± 0.15 4 - 0.1 C A B DETAIL N rh 0 .1 C A B 0 .0 5 ® C FREESCALE SEMICONDUCTOR, INC. ALL RIGHTS RESERVED. VIEW M - M MECHANICAL OUTLINE TITLE: THERMALLY ENHANCED QUAD FLAT N O N -L E A D E D PACKAGE QFN

Contextual Info: PIN 1 INDEX AREA EXPOSED DIE ATTACH PAD @ o > rh p DETAIL 0 .0 5 C FREESCALE SEMICONDUCTOR, INC. ALL RIGHTS RESERVED. 64X 0.55 0.45 B VIEW M - M MECHANICAL OUTLINE THERMALLY ENHANCED QUAD FLAT NO N-LEADED PACKAGE QFN 6 4 TERMINAL, 0 .5 PITCH ( 9 X 9 X 1 )

QFN-36

Abstract: QFN36 JEDEC QFN case outline M0251A M0-251A
Contextual Info: PIN 1 INDEX AREA - $ - | 0 . 1 | c | a |B HI H 36 PIN 1 INDEX 28 @ 4- o - i - c A B a EXPOSED METAL PAD o o cn ® rh 0 . 1 ® C A B C FREESCALE SEMICONDUCTOR, INC. ALL RIGHTS RESERVED. TITLE: POWER QUAD NO N -LEAD ED 36 N 0 .9 5 VIEW M - M MECHANICAL OUTLINE

7x7x1

Abstract: 7x7x1 freescale
Contextual Info: FREESCALE SEMICONDUCTOR, INC. ALL RIGHTS RESERVED. MECHANICAL OUTLINE TITLE: THERMALLY ENHANCED QUAD FLAT NON-LEADED PACKAGE QFN 32 TERMINAL, 0.65 PITCH ( 7 X 7 X 1 ) PRINT VERSION NOT TO SCALE DOCUMENT NO: 98ARH99032A REV: E CASE NUMBER: 1306-02 19 APR 2005

MM1764X

Contextual Info: PIN 1 INDEX AREA @ o > rh p DETAIL N 64X 0.5 0.3 B 0 .0 5 C FREESCALE SEMICONDUCTOR, INC. ALL RIGHTS RESERVED. MECHANICAL OUTLINE THERMALLY ENHANCED QUAD FLAT NON-LEADED PACKAGE QFN 64 TERMINAL, 0.5 PITCH ( 9 X 9 X 1 ) TITLE: PRINT VERSION NOT TO SCALE

QFN "100 pin" PACKAGE

Contextual Info: FREESCALE SEMICONDUCTOR, INC. ALL RIGHTS RESERVED. MECHANICAL OUTLINE THERMALLY ENHANCED QUAD FLAT NON-LEADED PACKAGE QFN 64 TERMINAL, 0.5 PITCH ( 9 X 9 X 1 ) TITLE: PRINT VERSION NOT TO SCALE DOCUMENT NO: 98ARL10501D REV: A CASE NUMBER: 1346-02 14 MAR 2005

M0220

Abstract: elat JEDEC QFN case outline
Contextual Info: * 0.1 c A B D E T A IL M EXPOSED DIE ATTACH PAD PIN 1 INDEX 8X 0 .5 h I D E T A IL N 12X 0.75 0.50 0 .1 C A B 0 .0 5 ® C FREESCALE SEMICONDUCTOR, INC. ALL RIGHTS RESERVED. TITLE: VIEW M - M MECHANICAL OUTLINE THERMALLY ENHANCED QUAD FLAT N O N -L E A D E D PACKAGE Q FN

QFN56

Abstract: VF-PQFN-56
Contextual Info: PIN 1 INDEX AREA DETAIL M PIN 1 INDEX DETAIL N 52X 0.55 0.30 rh 0.1 C A B 0.05® C F R E E S C A L E SEMICONDUCTOR, A L L R IG H TS RESERVED. TITLEl INC. VIEW M-M MECHANICAL OUTLINE QUAD FLAT NON-LEADED PACKAGE QFN 56 TERMINAL, 0.5 PITCH, (8X8X1) PRINT VERSION NOT TD SCALE

qfn 12 x 12

Contextual Info: PIN 1 INDEX AREA M 49 p u u u u u u u o u u l u u u u u a ZONE F DETAIL M PIN 1 INDEX □□□ ]□ □ □ -B- -B□ □ □ -B □ □ >I 34 >I □ □ □ □ Dn □□□[]□ I dnnnnnnnnnpnnnnn 33 60X 0.32 0.18 rh 0 .1 C A B C VIEW M-M MECHANICAL OUTLINE

JEDEC-MO-220

Abstract: DETAIL
Contextual Info: DETAIL G PIN 1 INDEX AREA n n n njn n n n DETAIL N 16 32X 0.30 0.18 rh 0.1 C A B 0 .0 5 ® C FREESCALE SEMICONDUCTOR, INC. ALL RIGHTS RESERVED. TITLE: THERMALLY e n h a n c e d 32X 0.5 0.3 VIEW M-M MECHANICAL OUTLINE quad FLAT NON-LEADED PACKAGE QFN

qfn64

Abstract: QFN-64 QFN 64
Contextual Info: PIN 1 INDEX AREA DETAIL M PIN 1 INDEX 0 .0 5 C FREESCALE SEMICONDUCTOR, ALL RIGHTS RESERVED. TITLE: @ o > rh p DETAIL N INC. 60X 0.75 0.50 B VIEW M-M MECHANICAL OUTLINE QUAD FLAT NON-LEADED PACKAGE QFN , 64 TERMINAL 0.5 PITCH(9 X 9 X 0.75) PRINT VERSION NOT TO SCALE

Contextual Info: DETAIL G P IN 1 INDEX DETAIL N 32X 0. 5 0. 3 0. 1 c A B 0. 0 5 ® C FREESCALE SEMICONDUCTOR, INC. ALL RIGHTS RESERVED. VIEW M-M MECHANICAL OUTLINE PR IN T VERSION NOT TO SCALE THERMALLY ENHANCED QUAD DOCUMENT NO: 98A S A 10560D FLAT NON-LEADED PACKAGE QFN

Contextual Info: M _a cl t PIN N U M B ER REF. O N LY D E TA IL G / / 0.1 c 2.2 2.0 i /4\ | ^ | q.05Tc j FREESCALE SEMICONDUCTOR, ALL RIGHTS RESERVED. TITLE: n SEATING PLAN 0.05 DETAIL G INC. MECHANICAL OUTLINE POWER QUAD FLAT NON-LEADED PACKAGE PWR QFN 23 TERMINAL, 0.9 PITCH(1 2X12X2.1 )