ht 13003
Abstract: LCD 16002 Aromat relay hb2e HT 1200-4 hb2e MOTOROLA 13003 Aromat hb2e HT 1000-4 amp 12011p 87c196
Text: Correct-A-Chip Adapters DIP-to-JEDEC TO Adapter Socket – www.arieselec.com/products/18012.pdf Correct-A-Chip™ with Collet Contacts – www.arieselec.com/products/18003.pdf SOIC-to-JEDEC TO Adapter – www.arieselec.com/products/18013.pdf Series 350000-HT High-Temperature
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Original
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com/products/18012
com/products/18003
com/products/18013
350000-HT
com/products/18005
com/products/18013RC
35W000
com/products/18007
com/products/18014
35W000-11-RC
ht 13003
LCD 16002
Aromat relay hb2e
HT 1200-4
hb2e
MOTOROLA 13003
Aromat hb2e
HT 1000-4 amp
12011p
87c196
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PDF
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glass
Abstract: No abstract text available
Text: 80D0 Glass seal 80pin QFN EIAJ Package Code – JEDEC Code – 21.0±0.2 Weight g 18.4±0.15 3.32MAX 0.8TYP 1.78TYP 0.6TYP 41 64 65 INDEX 0.5TYP 0.8TYP 12.0±0.15 1.2TYP 15.6±0.2 0.8TYP 40 25 80 24 1.2TYP 1
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Original
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80pin
32MAX
78TYP
glass
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PDF
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Technical Brief TB389
Abstract: MO-220VJJC TB389
Text: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L28.6x6 28 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220VJJC ISSUE C) MILLIMETERS SYMBOL MIN NOMINAL MAX NOTES A 0.80
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Original
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MO-220VJJC
-30mm
TB389.
Technical Brief TB389
TB389
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PDF
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MO-220-VJJD-2
Abstract: TB389 tip 410
Text: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L40.6x6 40 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220VJJD-2 ISSUE C) MILLIMETERS SYMBOL MIN NOMINAL MAX NOTES A
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Original
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MO-220VJJD-2
TB389.
MO-220-VJJD-2
TB389
tip 410
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PDF
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MO-220-VGGC
Abstract: MO-220 TB389
Text: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L16.4x4 16 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220-VGGC ISSUE C) MILLIMETERS SYMBOL MIN NOMINAL MAX NOTES A 0.80
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Original
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MO-220-VGGC
TB389.
MO-220
TB389
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PDF
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jedec package MO-220 vggc
Abstract: MO-220-VGGC 12-leadquad TB389 jedec package MO-220 MO-220 Technical Brief TB389
Text: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L12.4x4 12 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220-VGGC ISSUE C) MILLIMETERS SYMBOL MIN NOMINAL MAX NOTES A 0.80
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Original
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MO-220-VGGC
TB389.
jedec package MO-220 vggc
12-leadquad
TB389
jedec package MO-220
MO-220
Technical Brief TB389
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PDF
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10N20
Abstract: 015mm TB389
Text: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L20.6x6 20 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220VJJB ISSUE C) MILLIMETERS SYMBOL MIN NOMINAL MAX NOTES A 0.80
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Original
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MO-220VJJB
-30mm
TB389.
10N20
015mm
TB389
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PDF
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land pattern for QFN 7x7
Abstract: MO-220-VKKD-2 qfn 7x7 jedec
Text: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L48.7x7 48 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220VKKD-2 ISSUE C) MILLIMETERS SYMBOL MIN NOMINAL MAX NOTES A
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Original
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MO-220VKKD-2
TB389.
land pattern for QFN 7x7
MO-220-VKKD-2
qfn 7x7 jedec
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PDF
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MO-220-VGGD-2
Abstract: TB389
Text: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L24.4x4 24 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220VGGD-2 ISSUE C) MILLIMETERS SYMBOL MIN NOMINAL MAX NOTES A
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Original
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MO-220VGGD-2
TB389.
MO-220-VGGD-2
TB389
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PDF
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MO-220vggd-1
Abstract: TB389
Text: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L20.4x4 20 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220VGGD-1 ISSUE I) MILLIMETERS SYMBOL MIN NOMINAL MAX NOTES A
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Original
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MO-220VGGD-1
TB389.
TB389
|
PDF
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MO-220-VGGD-2
Abstract: TB389
Text: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L24.4x4B 24 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220VGGD-2 ISSUE C) MILLIMETERS SYMBOL MIN NOMINAL MAX NOTES A
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Original
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MO-220VGGD-2
P30mm
TB389.
MO-220-VGGD-2
TB389
|
PDF
|
TB389
Abstract: No abstract text available
Text: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L20.6x6B 20 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220VJJB ISSUE C) MILLIMETERS SYMBOL MIN NOMINAL MAX NOTES A 0.80
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Original
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MO-220VJJB
-30mm
TB389.
TB389
|
PDF
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jedec do 35
Abstract: QFN weight JEDEC Code
Text: 100D0 Glass seal 100pin QFN EIAJ Package Code – JEDEC Code – Weight g 18.85±0.15 5.0MAX 21.0±0.13 3.5TYP 0.65TYP 0.45TYP 51 80 81 INDEX 0.35TYP 0.65TYP 12.35±0.15 1.075TYP 15.6±0.13 0.65TYP 50 31 100 30 1.075TYP 1 Mar.’98
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Original
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100D0
100pin
65TYP
45TYP
35TYP
075TYP
jedec do 35
QFN weight
JEDEC Code
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PDF
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MO-220-VGGD-2
Abstract: TB389
Text: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L24.4x4C 24 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220VGGD-2 ISSUE C) MILLIMETERS SYMBOL MIN NOMINAL MAX NOTES A
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Original
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MO-220VGGD-2
TB389.
MO-220-VGGD-2
TB389
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PDF
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|
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21002
Abstract: JEDEC Code
Text: 80D0 Glass seal 80pin QFN EIAJ Package Code – JEDEC Code – 21.0±0.2 Weight g 18.4±0.15 3.32MAX 0.8TYP 1.78TYP 0.6TYP 41 64 65 INDEX 0.5TYP 0.8TYP 12.0±0.15 1.2TYP 15.6±0.2 0.8TYP 40 25 80 24 1.2TYP 1 Mar.’98
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Original
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80pin
32MAX
78TYP
21002
JEDEC Code
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PDF
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Technical Brief TB389
Abstract: MO-220 TB389 e 380
Text: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L24.6x6 24 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220) MILLIMETERS SYMBOL MIN NOMINAL MAX NOTES A 0.80 0.85 0.90
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Original
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MO-220)
TB389.
Technical Brief TB389
MO-220
TB389
e 380
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PDF
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64-pinQFN
Abstract: 10-TYP JEDEC Code 1200-15
Text: 64D0 Metal seal 64pin QFN EIAJ Package Code – JEDEC Code – Weight g 12.0±0.15 3.13MAX 15.6±0.15 1.8TYP 0.8TYP 0.6TYP 33 48 49 INDEX 0.5TYP 1.0TYP 15.6±0.15 0.8TYP 0.8TYP 12.0±0.15 32 17 64 16 1.0TYP 1 Mar.’98
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Original
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64pin
13MAX
64-pinQFN
10-TYP
JEDEC Code
1200-15
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PDF
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qfn 3X3 land pattern
Abstract: L8 Package TB389 MO-220-VEEC
Text: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L8.3x3 8 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220VEEC ISSUE C) MILLIMETERS SYMBOL MIN NOMINAL MAX NOTES A 0.80
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Original
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MO-220VEEC
6030mm
TB389.
qfn 3X3 land pattern
L8 Package
TB389
MO-220-VEEC
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PDF
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MO-220-vhhd-2
Abstract: TB389 3NE8
Text: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L32.5x5 32 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220VHHD-2 ISSUE C MILLIMETERS SYMBOL MIN NOMINAL MAX NOTES A 0.80
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Original
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MO-220VHHD-2
TB389.
MO-220-vhhd-2
TB389
3NE8
|
PDF
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TB389
Abstract: 10n16
Text: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L16.5x5B 16 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220VHHB ISSUE C) MILLIMETERS SYMBOL MIN NOMINAL MAX NOTES A 0.80
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Original
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MO-220VHHB
TB389.
TB389
10n16
|
PDF
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TB389
Abstract: No abstract text available
Text: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L16.5x5 16 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220VHHB ISSUE C) MILLIMETERS SYMBOL MIN NOMINAL MAX NOTES A 0.80
|
Original
|
MO-220VHHB
P30mm
TB389.
TB389
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L56.8x8A 56 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220VLLD-2 ISSUE C) MILLIMETERS SYMBOL MIN NOMINAL MAX NOTES A
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Original
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MO-220VLLD-2
TB389.
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PDF
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QFN56
Abstract: No abstract text available
Text: FREESCALE SEMICONDUCTOR, INC. ALL RIGHTS RESERVED. TITLE: MECHANICAL OUTLINE PRINT VERSION NOT TO SCALE DOCUMENT NO: 98ARJ10510D QUAD FLAT NON-LEADED PACKAGE QFN CASE NUMBER: 1674-02 56 TERMINAL, 0.5 PITCH ( 8X8X0. 9) STANDARD: NON-JEDEC CASE-OUTLINE
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OCR Scan
|
98ARJ10510D
98ARJ10510D
QFN56
|
PDF
|
Untitled
Abstract: No abstract text available
Text: VIEW ROTATED 90° CW FREESCALE SEMICONDUCTOR, INC. ALL RIGHTS RESERVED. TITLE: MECHANICAL OUTLINE PRINT VERSION NOT TO SCALE DOCUMENT NO: 98ARJ10509D QUAD FLAT NON-LEADED PACKAGE QFN; CASE NUMBER: 1657-01 56 TERMINAL, 0.5 PITCH (8X8X1 STANDARD: NON-JEDEC
|
OCR Scan
|
98ARJ10509D
20MECHANICAL
5M-1994.
98ARJ10509D
|
PDF
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