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    JEDEC PIN1 QFN TAPE & REEL Search Results

    JEDEC PIN1 QFN TAPE & REEL Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    74AC521SC REEL Rochester Electronics LLC 74AC521 - Identity Comparator, AC Series, 8-Bit, Inverted Output, CMOS Visit Rochester Electronics LLC Buy
    NBSG53AMNG Rochester Electronics LLC 53 SERIES, LOW SKEW CLOCK DRIVER, 1 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), QCC16, 3 X 3 MM, LEAD FREE, QFN-16 Visit Rochester Electronics LLC Buy
    HSCHD02BV1001R Amphenol Communications Solutions HSC Vertical plug,Tape and Reel,Blue housing Visit Amphenol Communications Solutions
    HSCHD02AR0001R Amphenol Communications Solutions HSC Right Angle plug,Tape and Reel,Black housing Visit Amphenol Communications Solutions
    HSCHD02AV0001R Amphenol Communications Solutions HSC Vertical plug,Tape and Reel,Black housing Visit Amphenol Communications Solutions

    JEDEC PIN1 QFN TAPE & REEL Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    ATMEL 740

    Abstract: atmel 830 ATMEL Tape and Reel drawing LQFP-44 ATMEL shipping label atmel 0635 ATMEL Tape and Reel QFN-64 QFN-64 atmel 1030 pj 54 diode
    Text: Packaging and Packing Information Packaging according to IEC 60286-3 for Tape and Reel, and IEC 60286-4 for tube packing. 1. Labels In general, on products coming out of Atmel ’s Heilbronn Germany location, two labels are on the inner cardboard: Atmel's standard bar code label and a customer


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    PDF JESD97. 4845C ATMEL 740 atmel 830 ATMEL Tape and Reel drawing LQFP-44 ATMEL shipping label atmel 0635 ATMEL Tape and Reel QFN-64 QFN-64 atmel 1030 pj 54 diode

    56QN50T18080

    Abstract: Senju MO-220-compliant Theta JA of 64-pin BGA 56RGQ senju solder paste MO-220 SN74SSTV16859 IPC-9701 qfn jc jb
    Text: Application Report SCEA032 - March 2003 56-Pin Quad Flatpack No-Lead Logic Package Frank Mortan and Lance Wright SLL Package Development ABSTRACT Texas Instruments TI Quad Flatpack No-Lead (QFN) 56-terminal package complies with JEDEC standard MO-220, allows for board miniaturization, and holds several advantages


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    PDF SCEA032 56-Pin 56-terminal MO-220, 56QN50T18080 Senju MO-220-compliant Theta JA of 64-pin BGA 56RGQ senju solder paste MO-220 SN74SSTV16859 IPC-9701 qfn jc jb

    Solder bar of Senju M705

    Abstract: senju M31 GRN360 Senju senju m31 JESD Senju 7100 reflow profile 16QN50T23030 JESD 51-7, ambient measurement qfn 32 land pattern Senju paste 7100
    Text: Application Report SCBA017D – February 2004 Quad Flatpack No-Lead Logic Packages Frank Mortan and Lance Wright SLL Package Development ABSTRACT Texas Instruments TI Quad Flatpack No-lead (QFN) 14/16/20-terminal Pb-free plastic packages meet dimensions specified in JEDEC standard MO-241, allow for board miniaturization, and hold


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    PDF SCBA017D 14/16/20-terminal MO-241, Solder bar of Senju M705 senju M31 GRN360 Senju senju m31 JESD Senju 7100 reflow profile 16QN50T23030 JESD 51-7, ambient measurement qfn 32 land pattern Senju paste 7100

    TPS59611

    Abstract: No abstract text available
    Text: This device is designed specifically to power IMVP Mobile Processors under a strict disclosure agreement with Intel. The end user must have a current CNDA Agreement in place with Intel. For more information please contact IMVP@list.ti.com. PACKAGE MATERIALS INFORMATION


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    PDF 8-Apr-2009 TPS59611RHBR TPS59611RHBT TPS59611

    Untitled

    Abstract: No abstract text available
    Text: This device is designed specifically to power IMVP Mobile Processors under a strict disclosure agreement with Intel. The end user must have a current CNDA Agreement in place with Intel. For more information please contact IMVP@list.ti.com. PACKAGE MATERIALS INFORMATION


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    PDF 8-Apr-2009 TPS59610RHBR TPS59610RHBT

    Untitled

    Abstract: No abstract text available
    Text: This device is designed specifically to power IMVP Mobile Processors under a strict disclosure agreement with Intel. The end user must have a current CNDA Agreement in place with Intel. For more information please contact IMVP@list.ti.com. PACKAGE MATERIALS INFORMATION


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    PDF 8-Apr-2009 TPS51610IRHBR TPS51610IRHBT TPS51610RHBR TPS51610RHBT

    TPS59610

    Abstract: No abstract text available
    Text: This device is designed specifically to power IMVP Mobile Processors under a strict disclosure agreement with Intel. The end user must have a current CNDA Agreement in place with Intel. For more information please contact IMVP@list.ti.com. PACKAGE MATERIALS INFORMATION


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    PDF 8-Apr-2009 TPS59610RHBR TPS59610RHBT TPS59610

    40spq

    Abstract: No abstract text available
    Text: This device is designed specifically to power IMVP Mobile Processors under a strict disclosure agreement with Intel. The end user must have a current CNDA Agreement in place with Intel. For more information please contact IMVP@list.ti.com. PACKAGE MATERIALS INFORMATION


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    PDF 8-Apr-2009 TPS59610RHBR TPS59610RHBT 40spq

    TI QFN marking

    Abstract: TPS59611
    Text: This device is designed specifically to power IMVP Mobile Processors under a strict disclosure agreement with Intel. The end user must have a current CNDA Agreement in place with Intel. For more information please contact IMVP@list.ti.com. PACKAGE MATERIALS INFORMATION


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    PDF 8-Apr-2009 TPS59611RHBR TPS59611RHBT TI QFN marking TPS59611

    CDC857-2

    Abstract: CY2SSTV857-32
    Text: CY2SSTV857-32 Differential Clock Buffer/Driver DDR400/PC3200-Compliant Features Description • Operating frequency: 60 MHz to 230 MHz The CY2SSTV857-32 is a high-performance, low-skew, low-jitter zero-delay buffer designed to distribute differential clocks in high-speed applications. The CY2SSTV857-32


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    PDF CY2SSTV857-32 DDR400/PC3200-Compliant CY2SSTV857-32 CDC857-2

    CDC857-2

    Abstract: CY2SSTV857-32
    Text: CY2SSTV857-32 Differential Clock Buffer/Driver DDR400/PC3200-Compliant Features Description • Operating frequency: 60 MHz to 230 MHz The CY2SSTV857-32 is a high-performance, low-skew, low-jitter zero-delay buffer designed to distribute differential clocks in high-speed applications. The CY2SSTV857-32


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    PDF CY2SSTV857-32 DDR400/PC3200-Compliant CY2SSTV857-32 CDC857-2

    Untitled

    Abstract: No abstract text available
    Text: This device is designed specifically to power IMVP Mobile Processors under a strict disclosure agreement with Intel. The end user must have a current CNDA Agreement in place with Intel. For more information please contact IMVP@list.ti.com. PACKAGE MATERIALS INFORMATION


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    PDF 8-Apr-2009 TPS59610RHBR TPS59610RHBT

    CDC857-2

    Abstract: CY2SSTV857-32 QFN "200 pin" PACKAGE
    Text: CY2SSTV857-32 Differential Clock Buffer/Driver DDR400/PC3200-Compliant Features Description • Operating frequency: 60 MHz to 230 MHz The CY2SSTV857-32 is a high-performance, low-skew, low-jitter zero-delay buffer designed to distribute differential clocks in high-speed applications. The CY2SSTV857-32


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    PDF CY2SSTV857-32 DDR400/PC3200-Compliant CY2SSTV857-32 400-MHz CDC857-2 QFN "200 pin" PACKAGE

    CDC857-2

    Abstract: CY2SSTV857-32 QFN "200 pin" PACKAGE
    Text: CY2SSTV857-32 Differential Clock Buffer/Driver DDR400/PC3200-Compliant Features Description • Operating frequency: 60 MHz to 230 MHz The CY2SSTV857-32 is a high-performance, low-skew, low-jitter zero-delay buffer designed to distribute differential clocks in high-speed applications. The CY2SSTV857-32


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    PDF CY2SSTV857-32 DDR400/PC3200-Compliant CY2SSTV857-32 400-MHz CDC857-2 QFN "200 pin" PACKAGE

    JEDEC MO 224

    Abstract: CY2SSTU877 CY2SSTU877BVC-XX CY2SSTU877BVI-XX CY2SSTU877BVI-XXT CY2SSTU877LFC-XX CY2SSTU877LFC-XXT CY2SSTU877LFI-XX JEDEC pin1 qfn tape
    Text: CY2SSTU877 PRELIMINARY 1.8V, 500-MHz, 10-Output JEDEC-Compliant Zero Delay Buffer Features • Operating frequency: 125 MHz to 500 MHz • Supports DDRII SDRAM • Ten differential outputs from one differential input • Spread-Spectrum-compatible • Low jitter cycle-to-cycle : < 40 ps


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    PDF CY2SSTU877 500-MHz, 10-Output 52-ball 40-pin CY2SSTU877 JEDEC MO 224 CY2SSTU877BVC-XX CY2SSTU877BVI-XX CY2SSTU877BVI-XXT CY2SSTU877LFC-XX CY2SSTU877LFC-XXT CY2SSTU877LFI-XX JEDEC pin1 qfn tape

    FMS2016-001

    Abstract: FMS2016-001-TB FMS2016-001-TR FMS2016QFN MIL-HDBK-263 sp4t switch die
    Text: FMS2016-001 Datasheet v2.4 High Power Reflective GaAs SP4T Switch FEATURES: • • • • • • FUNCTIONAL SCHEMATIC: 3x3x0.9mm Packaged pHEMT Switch High isolation: >30dB at 1.8GHz Low Insertion loss: 0.65dB at 1.8GHz Excellent low control voltage performance


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    PDF FMS2016-001 2002/95/EC) FMS2016-001 22-A114. MIL-STD-1686 MIL-HDBK-263. FMS2016-001-TR FMS2016-001-TB FMS2016-001-EB FMS2016-001-TB FMS2016-001-TR FMS2016QFN MIL-HDBK-263 sp4t switch die

    tps5161

    Abstract: No abstract text available
    Text: This device is designed specifically to power IMVP Mobile Processors under a strict disclosure agreement with Intel. The end user must have a current CNDA Agreement in place with Intel. For more information please contact IMVP@list.ti.com. PACKAGE MATERIALS INFORMATION


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    PDF 8-Apr-2009 TPS51610IRHBR TPS51610IRHBT TPS51610RHBR TPS51610RHBT tps5161

    CDC857-2

    Abstract: CY2SSTV857-32 CY2SSTV857LFI-32
    Text: CY2SSTV857-32 Differential Clock Buffer/Driver DDR400/PC3200-Compliant Features Description • Operating frequency: 60 MHz to 230 MHz The CY2SSTV857-32 is a high-performance, low-skew, low-jitter zero-delay buffer designed to distribute differential clocks in high-speed applications. The CY2SSTV857-32


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    PDF CY2SSTV857-32 DDR400/PC3200-Compliant CY2SSTV857-32 400-MHz CDC857-2 CY2SSTV857LFI-32

    PC3200-Compliant

    Abstract: No abstract text available
    Text: CY2SSTV857-32 Differential Clock Buffer/Driver DDR400/PC3200-Compliant Features Description • Operating frequency: 60 MHz to 230 MHz The CY2SSTV857-32 is a high-performance, low-skew, low-jitter zero-delay buffer designed to distribute differential clocks in high-speed applications. The CY2SSTV857-32


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    PDF CY2SSTV857-32 DDR400/PC3200-Compliant 400-MHz CDC857-2 48-pin CY2SSTV857-32 250MHz 230MHz PC3200-Compliant

    TSC2020

    Abstract: No abstract text available
    Text: TSC2020 SBAS536B – FEBRUARY 2011 – REVISED MARCH 2011 www.ti.com Analog Matrix TOUCH SCREEN CONTROLLER with I2C Serial Interface for 3 x 5 Array Check for Samples: TSC2020 FEATURES APPLICATIONS • • • • • • 1 23 • • • • • • •


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    PDF TSC2020 SBAS536B 12-Bit TSC2020

    TI QFN marking

    Abstract: No abstract text available
    Text: TSC2020 SBAS536B – FEBRUARY 2011 – REVISED MARCH 2011 www.ti.com Analog Matrix TOUCH SCREEN CONTROLLER with I2C Serial Interface for 3 x 5 Array Check for Samples: TSC2020 FEATURES APPLICATIONS • • • • • • 1 23 • • • • • • •


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    PDF TSC2020 SBAS536B 12-Bit TI QFN marking

    Untitled

    Abstract: No abstract text available
    Text: TSC2020 SBAS536B – FEBRUARY 2011 – REVISED MARCH 2011 www.ti.com Analog Matrix TOUCH SCREEN CONTROLLER with I2C Serial Interface for 3 x 5 Array Check for Samples: TSC2020 FEATURES APPLICATIONS • • • • • • 1 23 • • • • • • •


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    PDF TSC2020 SBAS536B 12-Bit

    lf24a

    Abstract: fs211 CY2544FI CY2544 CY2546
    Text: CY2544 CY2546 PRELIMINARY Quad PLL Programmable Clock Generator with Spread Spectrum Features Benefits • Four fully integrated phase-locked loops PLLs • Input Frequency range: — External crystal: 8 to 48 MHz — External reference: 8 to 166 MHz clock


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    PDF CY2544 CY2546 nineY2546 CY2544 CY2546 lf24a fs211 CY2544FI

    FMS2016-005-TB

    Abstract: FMS2016-005TR FMS2016-005 FMS2016-005-TR FMS2016QFN MIL-HDBK-263
    Text: FMS2016-005 Datasheet v2.4 High Power Reflective GaAs SP4T Switch FEATURES: • • • • • • FUNCTIONAL SCHEMATIC: 3x3x0.9mm Packaged pHEMT Switch NiPdAu finish for Military and High reliability applications High isolation: >30dB at 1.8GHz Excellent low control voltage performance


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    PDF FMS2016-005 2002/95/EC) FMS2016-005 22-A114. MIL-STD-1686 MIL-HDBK-263. FMS2016-005-TR FMS2016-005-TB FMS2016-005-EB FMS2016-005-TB FMS2016-005TR FMS2016-005-TR FMS2016QFN MIL-HDBK-263