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    JEDEC PACKAGE QFN-32 FOOTPRINT Search Results

    JEDEC PACKAGE QFN-32 FOOTPRINT Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    JEDEC PACKAGE QFN-32 FOOTPRINT Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    jedec footprint MO-220 VHHD-2

    Abstract: qfn 44 PACKAGE footprint QFN 64 9x9 footprint 32 pins qfn 5x5 footprint jedec package MO-220 64 9x9 WAN0118 WAN_0118 QFN footprint IPC-A-610D QFN 56 7x7 footprint
    Text: w WAN_0118 Guidelines on How to Use QFN Packages and Create Associated PCB Footprints INTRODUCTION The Quad Fine Pitch No Leads QFN package is a leadless plastic package, which obtains electrical contact via lands on the bottom surface of the device. Its compact nature and low profile makes the


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    JEDEC Drawing MO-220 qfn

    Abstract: 32 pins qfn 5x5 footprint QFN footprint WAN_0118 QFN 20 5x5 "recommended PCB Layout" qfn 48 7x7 stencil QFN 56 7x7 footprint 32-pin QFN PCB Layout guide MO-220 7x7 0.4 pitch qfn 44 PACKAGE footprint 7x7 DIe Size
    Text: w WAN_0118 Guidelines on How to Use QFN Packages and Create Associated PCB Footprints INTRODUCTION The Quad Fine Pitch No Leads QFN package is a leadless plastic package, which obtains electrical contact via lands on the bottom surface of the device. Its compact nature and low profile makes the


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    FOOTPRINT MO-229 2X3 SOLDERING

    Abstract: Theta-JC QFP die down QFN 56 7x7 footprint EIA-783 EIA and EIAJ standards 783 QFN 76 9x9 footprint AN1902 QFN 56 7x7 0.5 JESD51-7 MO-220
    Text: Freescale Semiconductor Application Note AN1902 Rev. 4.0, 9/2008 Quad Flat Pack No-Lead QFN Micro Dual Flat Pack No-Lead (uDFN) 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level


    Original     		PDF AN1902 FOOTPRINT MO-229 2X3 SOLDERING Theta-JC QFP die down QFN 56 7x7 footprint EIA-783 EIA and EIAJ standards 783 QFN 76 9x9 footprint AN1902 QFN 56 7x7 0.5 JESD51-7 MO-220

    QFN 76 9x9 footprint

    Abstract: QFN 64 8x8 footprint QFN PACKAGE thermal resistance JEDEC JESD51-8 BGA 4914 smd qfn 32 land pattern QFN 64 9x9 footprint QFN 9X9 AN1902 MO-220
    Text: Freescale Semiconductor Application Note AN1902 Rev. 3.0, 12/2005 Quad Flat Pack No-Lead QFN 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance


    Original     		PDF AN1902 QFN 76 9x9 footprint QFN 64 8x8 footprint QFN PACKAGE thermal resistance JEDEC JESD51-8 BGA 4914 smd qfn 32 land pattern QFN 64 9x9 footprint QFN 9X9 AN1902 MO-220

    BD 4914

    Abstract: QFN 76 9x9 footprint qfn 48 7x7 stencil QFN 64 8x8 footprint QFN 64 9x9 footprint land pattern BGA 0.75 freescale QFN 56 7x7 footprint QFN PCB Layout guide Motorola MAP QFN MO-220 8x8
    Text: Freescale Semiconductor, Inc. Application Note AN1902/D REV. 2, 03/2002 QUAD FLAT PACK NO-LEAD QFN Freescale Semiconductor, Inc. 1.0 PURPOSE This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance data are included as reference.


    Original     		PDF AN1902/D BD 4914 QFN 76 9x9 footprint qfn 48 7x7 stencil QFN 64 8x8 footprint QFN 64 9x9 footprint land pattern BGA 0.75 freescale QFN 56 7x7 footprint QFN PCB Layout guide Motorola MAP QFN MO-220 8x8

    24 leads qfn 5x5

    Abstract: qfn 3X3 land pattern JESD47D 28 leads qfn 4x5 QFN 20 5x5 "recommended PCB Layout" JEDEC J-STD-033b marking 8206 Jedec jesd47d AN0017 qfn 5x5 thermal resistance
    Text: AN0017 Application Note for Molded Plastic QFN Packages GaAs Monolithic Packaged Microwave IC 1. General considerations on plastic molded packages Surface Mount Device type packages SMD* for microwave applications are appearing more and more on the market. The use of such packages requires some


    Original     		PDF AN0017 AN0017-8206 24 leads qfn 5x5 qfn 3X3 land pattern JESD47D 28 leads qfn 4x5 QFN 20 5x5 "recommended PCB Layout" JEDEC J-STD-033b marking 8206 Jedec jesd47d AN0017 qfn 5x5 thermal resistance

    Untitled

    Abstract: No abstract text available
    Text: HI-3598, HI-3599 Octal ARINC 429 Receivers with Label Recognition and SPI Interface May 2009 GENERAL DESCRIPTION The Serial Peripheral Interface minimizes the number of host interface signals, providing a small footprint device which can be interfaced to a wide variety of industrystandard microcontrollers supporting SPI. Alternatively,


    Original     		PDF HI-3598, HI-3599 RIN8B-40 RIN8A-40 HI-3598 HI-3599 44-PIN 44PCS

    HI-3599

    Abstract: HI-3599PST HI-3598 HI-3599PCT-40
    Text: HI-3598, HI-3599 Octal ARINC 429 Receivers with Label Recognition and SPI Interface June 2008 GENERAL DESCRIPTION The Serial Peripheral Interface minimizes the number of host interface signals, providing a small footprint device which can be interfaced to a wide variety of industrystandard microcontrollers supporting SPI. Alternatively,


    Original     		PDF HI-3598, HI-3599 RIN8B-40 RIN8A-40 HI-3598 HI-3599 44-PIN 44PCS HI-3599PST HI-3599PCT-40

    Solder bar of Senju M705

    Abstract: senju M31 GRN360 Senju senju m31 JESD Senju 7100 reflow profile 16QN50T23030 JESD 51-7, ambient measurement qfn 32 land pattern Senju paste 7100
    Text: Application Report SCBA017D – February 2004 Quad Flatpack No-Lead Logic Packages Frank Mortan and Lance Wright SLL Package Development ABSTRACT Texas Instruments TI Quad Flatpack No-lead (QFN) 14/16/20-terminal Pb-free plastic packages meet dimensions specified in JEDEC standard MO-241, allow for board miniaturization, and hold


    Original     		PDF SCBA017D 14/16/20-terminal MO-241, Solder bar of Senju M705 senju M31 GRN360 Senju senju m31 JESD Senju 7100 reflow profile 16QN50T23030 JESD 51-7, ambient measurement qfn 32 land pattern Senju paste 7100

    Cambridge Silicon Radio

    Abstract: CSR1012A05-IQQP-R CSR1012
    Text: CSR µEnergy CSR1012 QFN Features • ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ Bluetooth Smart IC Production Information CSR1012A05 Issue 4 General Description Applications CSR1012 QFN is a CSR µEnergy platform device. CSR µEnergy are CSR's single-mode Bluetooth low


    Original     		PDF CSR1012 CSR1012A05 CSR1010 CS-238833-DSP4 Cambridge Silicon Radio CSR1012A05-IQQP-R

    32 pins qfn 5x5 footprint

    Abstract: ISL6421A ISL6421AER ISL6421AERZ MO-220 TB389 qfn 5x5 thermal resistance 24 leads qfn 5x5
    Text: ISL6421A Data Sheet Single Output LNB Supply and Control Voltage Regulator with I2C Interface for Advanced Satellite Set-top Box Designs The ISL6421A is a highly integrated solution for providing power and control signals from advanced satellite set-top


    Original     		PDF ISL6421A ISL6421A 5m-1994. 32 pins qfn 5x5 footprint ISL6421AER ISL6421AERZ MO-220 TB389 qfn 5x5 thermal resistance 24 leads qfn 5x5

    QFN 76 9x9 footprint

    Abstract: QFN 64 8x8 footprint qfn 44 PACKAGE footprint 7x7 DIe Size QFN 56 7x7 footprint DUAL ROW QFN leadframe qfn 44 PACKAGE footprint 7x7 qfn 44 7x7 PACKAGE footprint qfn 76 PACKAGE footprint QFN 48 7x7 footprint footprint mlf
    Text: LEADFRAME data sheet Leadframe CSP MicroLeadFrame MLF®/QFN/SON/DFN Package High Performance, Cost Efficient Features Amkor's MicroLeadFrame® (QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This package uses


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    SOT23W-3

    Abstract: MS-018-AC tssop 38 footprint PLCC 44 pin through hole MO-220WGGC SOT23 MARK EW PUB26013 transistor crossreference DUAL ROW QFN leadframe MS-018AC
    Text: Product Information Allegro Package Designations This document provides reference information as an aid to differentiating the device package types used by Allegro MicroSystems. It provides cross references to the package designation, an Allegro code that is integrated into the device part number:


    Original     		PDF PUB26013 SOT23W-3 MS-018-AC tssop 38 footprint PLCC 44 pin through hole MO-220WGGC SOT23 MARK EW transistor crossreference DUAL ROW QFN leadframe MS-018AC

    DUAL ROW QFN leadframe

    Abstract: amkor mlf qfn QFN 56 7x7 footprint qfn 44 PACKAGE footprint 7x7 DIe Size qfn 44 7x7 PACKAGE footprint qfn 76 PACKAGE footprint qfn 48 7x7 footprint QFN Shipping Trays qfn 44 PACKAGE footprint 7x7 156 qfn
    Text: LEADFRAME data sheet Leadframe CSP MicroLeadFrame MLF®/QFN/SON/DFN Package High Performance, Cost Efficient Features: Amkor's MicroLeadFrame® (QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This


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    CYWUSB6935

    Abstract: CYWUSB6953 cywusb6953-48lfxc CY8C21534 MO-220 SDA 555
    Text: CYWUSB6953 WirelessUSB PRoC™ Flash Programmable MCU + Radio Features • Operating temperature from 0° to 70°C • Offered in a small footprint 48 QFN • Microcontroller with Mixed Signal Array — Cypress M8C CPU Applications — CPU clock up to 12 MHz


    Original     		PDF CYWUSB6953 10-bit 32-bit CYWUSB6934" CYWUSB6935" CYWUSB6935 CYWUSB6953 cywusb6953-48lfxc CY8C21534 MO-220 SDA 555

    circuit diagram of smart home alarm system

    Abstract: remote control for home appliances rf based home security system block diagram 28 MHZ crystal radio control radio frequency remote control remote control for home appliances simple switch block diagram Crystal Radio simple home alarm circuit diagram
    Text: CYWUSB6953 WirelessUSB PRoC™ Flash Programmable MCU + Radio Features • Operating temperature from 0° to 70°C • Offered in a small footprint 48 QFN • Microcontroller with Mixed Signal Array — Cypress M8C CPU Applications — CPU clock up to 12 MHz


    Original     		PDF CYWUSB6953 10-bit 32-bit CYWUSB6934" CYWUSB6935" circuit diagram of smart home alarm system remote control for home appliances rf based home security system block diagram 28 MHZ crystal radio control radio frequency remote control remote control for home appliances simple switch block diagram Crystal Radio simple home alarm circuit diagram

    SOT23W-3

    Abstract: transistor crossreference footprint soic 16 soic pcb footprint DFN 10 socket EK QFN MS-018AC qfn 44 PACKAGE footprint qsop 16 pcb footprint SOT23 MARK EW
    Text: Product Information Allegro Package Designations This document provides reference information as an aid to differentiating the device package types used by Allegro MicroSystems. It provides cross references to the package designation, an Allegro code that is integrated into the device part number:


    Original     		PDF PUB26013 SOT23W-3 transistor crossreference footprint soic 16 soic pcb footprint DFN 10 socket EK QFN MS-018AC qfn 44 PACKAGE footprint qsop 16 pcb footprint SOT23 MARK EW

    WM8904G

    Abstract: wm8904
    Text: WM8904 w Ultra Low Power CODEC for Portable Audio Applications DESCRIPTION FEATURES The WM8904 is a high performance ultra-low power stereo CODEC optimised for portable audio applications. • The device features stereo ground-referenced headphone amplifiers using the Wolfson ‘Class-W’ amplifier techniques


    Original     		PDF WM8904 WM8904G

    32 pins tqfn 5x5 footprint

    Abstract: 32 pins qfn 5x5 footprint T3255-3 MAX3840ETJ D CML Crosspoint Switch
    Text: 19-1854; Rev 4; 12/05 +3.3V, 2.7Gbps Dual 2 ✕ 2 Crosspoint Switch The MAX3840 is a dual 2 ✕ 2 asynchronous crosspoint switch for SDH/SONET DWDM and other high-speed data switching applications where serial data stream loop-through and protection channel switching are


    Original     		PDF MAX3840 OC-48 32 pins tqfn 5x5 footprint 32 pins qfn 5x5 footprint T3255-3 MAX3840ETJ D CML Crosspoint Switch

    Untitled

    Abstract: No abstract text available
    Text: 19-1854; Rev 3; 5/05 +3.3V, 2.7Gbps Dual 2 ✕ 2 Crosspoint Switch The MAX3840 is a dual 2 ✕ 2 asynchronous crosspoint switch for SDH/SONET DWDM and other high-speed data switching applications where serial data stream loop-through and protection channel switching are


    Original     		PDF MAX3840 OC-48

    Untitled

    Abstract: No abstract text available
    Text: CHS2411-QDG 23-26GHz Reflective SP4T Switch GaAs Monolithic Microwave IC in SMD leadless package Description The CHS2411-QDG CHS2412-QDG, see Note is a monolithic reflective SP4T switch in K-Band. Positive supply voltage only is required. The circuit is manufactured with a standard


    Original     		PDF CHS2411-QDG 23-26GHz CHS2412-QDG, S2411 0525G 24L-QFN DSCHS2411-QDG3163

    Untitled

    Abstract: No abstract text available
    Text: Si5018 SiPHY OC-48/STM-16 C LOCK AND D ATA R ECOVERY IC W ITH FEC Features Complete high-speed, low-power, CDR solution includes the following:  Supports OC-48 /STM-16 & FEC  Low power—270 mW typ OC-48   Small footprint: 4x4 mm  DSPLL Eliminates external 


    Original     		PDF Si5018 OC-48/STM-16 OC-48 /STM-16 OC-48)

    jedec package MO-220 VGGD-1 QFN

    Abstract: No abstract text available
    Text: Si5018 SiPHY OC-48/STM-16 C LOCK AND D ATA R ECOVERY IC W ITH FEC Features Complete high-speed, low-power, CDR solution includes the following: Supports OC-48 /STM-16 & FEC „ Low power—270 mW typ OC-48 „ „ Small footprint: 4x4 mm „ DSPLL™ Eliminates external „


    Original     		PDF Si5018 OC-48/STM-16 OC-48 /STM-16 power--270 OC-48) jedec package MO-220 VGGD-1 QFN

    Untitled

    Abstract: No abstract text available
    Text: Si5018 SiPHY OC-48/STM-16 C LOCK AND D ATA R ECOVERY IC W ITH FEC Features Complete high-speed, low-power, CDR solution includes the following: „ Supports OC-48 /STM-16 & FEC „ Low power—270 mW „ typ OC-48 „ Small footprint: 4x4 mm „ DSPLL™ Eliminates external „


    Original     		PDF Si5018 OC-48/STM-16 OC-48 /STM-16 power--270 OC-48) Si5018 OC-48/STl