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    JEDEC MO 225 Search Results

    JEDEC MO 225 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TMP139AIYAHR Texas Instruments JEDEC DDR5 temperature sensor with 0.5 °C accuracy 6-DSBGA -40 to 125 Visit Texas Instruments Buy
    SN74SSQEA32882ZALR Texas Instruments JEDEC SSTE32882 Compliant 28-Bit to 56-Bit Registered Buffer with Address-Parity Test 176-NFBGA 0 to 85 Visit Texas Instruments Buy
    SN74SSQE32882ZALR Texas Instruments JEDEC SSTE32882 Compliant 28-Bit to 56-Bit Registered Buffer with Address-Parity Test 176-NFBGA 0 to 85 Visit Texas Instruments
    SN74SSQEB32882ZALR Texas Instruments JEDEC SSTE32882 Compliant 28-Bit to 56-Bit Registered Buffer with Address-Parity Test 176-NFBGA 0 to 85 Visit Texas Instruments Buy
    SN74SSQEC32882ZALR Texas Instruments JEDEC SSTE32882 Compliant Low Power 28-Bit to 56-Bit Registered Buffer with Address-Parity Test 176-NFBGA 0 to 85 Visit Texas Instruments Buy

    JEDEC MO 225 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    mo-047 texas

    Abstract: 84XX MO-047 MO-052
    Text: 3M Chip Carrier Sockets Surfacemount 8400 Series • Accepts chip carriers conforming to JEDEC outline MO-047 for square and MO-052 for rectangular • High temperature insulator compatible with IR reflow and wave soldering • Compatible with automated loading equipment


    Original     		PDF MO-047 MO-052 TS-2147-04 mo-047 texas 84XX

    84XX

    Abstract: MO-047 MO-052 TS-2147-02
    Text: 3M Chip Carrier Sockets Surface Mount 8400 Series • Accepts chip carriers conforming to JEDEC outline MO-047 for square and MO-052 for rectangular • High temperature insulator compatible with IR reflow and wave soldering • Compatible with automated loading equipment


    Original     		PDF MO-047 MO-052 TS-2147-02 84XX TS-2147-02

    84XX

    Abstract: MO-047 MO-052 TS-2147-03
    Text: 3M Chip Carrier Sockets Surface Mount 8400 Series • Accepts chip carriers conforming to JEDEC outline MO-047 for square and MO-052 for rectangular • High temperature insulator compatible with IR reflow and wave soldering • Compatible with automated loading equipment


    Original     		PDF MO-047 MO-052 TS-2147-03 84XX TS-2147-03

    MO-047

    Abstract: MO-052 8444-11B1-RK-TP
    Text: 3M Chip Carrier Sockets Low Profile, Four-Row, Through-Hole 8400 Series • Accepts chip carriers conforming to JEDEC outline MO-047 for square and MO-052 for rectangular • Compatible with automated loading equipment • Open top design allows unrestricted air flow


    Original     		PDF MO-047 MO-052 TS-2148-03 8444-11B1-RK-TP

    MO-047

    Abstract: MO-052 8444-11B1-RK-TP 8420-11B1-RK-TP 8452
    Text: 3M Chip Carrier Sockets Low Profile, 4-Row, Thru-hole 8400 Series • Accepts chip carriers conforming to JEDEC outline MO-047 for square and MO-052 for rectangular • High temperature insulator compatible with IR reflow and wave soldering • Compatible with automated loading equipment


    Original     		PDF MO-047 MO-052 TS-2148-02 8444-11B1-RK-TP 8420-11B1-RK-TP 8452

    Untitled

    Abstract: No abstract text available
    Text: 3M Chip Carrier Sockets Low Profile, 4-Row, Thru-hole 8400 Series • Accepts chip carriers conforming to JEDEC outline MO-047 for square and MO-052 for rectangular • High temperature insulator compatible with IR reflow and wave soldering • Compatible with automated loading equipment


    Original     		PDF MO-047 MO-052 TS-2148-01

    48 ball VFBGA

    Abstract: 90 ball VFBGA LVTH162 micro pitch BGA tSSOP 56 socket TSSOP YAMAICHI SOCKET 48-PIN 56-PIN ALVCH16373 LVCH16244A
    Text: Application Report SZZA029B - May 2002 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch, Very Thin Fine-Pitch BGA VFBGA Packages Frank Mortan and Mark Frimann Standard Linear & Logic ABSTRACT TI’s 56-ball MicroStar Jr. package, registered under JEDEC MO-225, has demonstrated


    Original     		PDF SZZA029B 16-Bit 56-Ball, 65-mm 56-ball MO-225, 48-pin 56-pin 48 ball VFBGA 90 ball VFBGA LVTH162 micro pitch BGA tSSOP 56 socket TSSOP YAMAICHI SOCKET ALVCH16373 LVCH16244A

    VFBGA

    Abstract: 52-ball Vfbga package BA 9513
    Text: DOCUMENT CONTROL NO. PD - 2017 REVISION: A DATE: 03/09/05 1 Notes: 1 Controlling dimensions in millimeters 2) Ref: JEDEC MO-225B/BA Pericom Semiconductor Corporation 3545 N. 1st Street, San Jose, CA 95134 1-800-435-2335 • www.pericom.com DESCRIPTION: 52-Ball, Very Thin Profile Fine Pitch Ball Grid Array, VFBGA


    Original     		PDF MO-225B/BA 52-Ball, VFBGA 52-ball Vfbga package BA 9513

    VFBGA

    Abstract: BSC -23-01n15 45-ball
    Text: 2.00 BSC 3.00 ± 0.10 0.50 BSC 6.00 ± 0.10 5.00 BSC 0.50 BSC 0.50 BSC 1 0.18 MIN 0.60 MIN 1.00 MAX DATE: 05/25/05 Notes: 1 All dimensions are in millimeters 2) Ref JEDEC: MO-225B Ref.) DESCRIPTION: 45-Ball, Very Thin Profile Fine Pitch Ball Grid Array - VFBGA


    Original     		PDF MO-225B 45-Ball, VFBGA-45) PD-2041 VFBGA BSC -23-01n15 45-ball

    DDR DIMM pinout micron 184

    Abstract: No abstract text available
    Text: 128MB, 256MB x72, ECC , PC3200 184-Pin DDR SDRAM DIMM DDR SDRAM DIMM MT9VDDT1672A - 128MB MT9VDDT3272A - 256MB For the latest data sheet, please refer to the Micronâ Web site: www.micron.com/moduleds Features Figure 1: 184-Pin DIMM (MO-206) • JEDEC-standard 184-pin dual in-line memory


    Original     		PDF 128MB, 256MB PC3200 184-Pin PC3200A 128MB 09005aef80a43d77 DDA9C16 DDR DIMM pinout micron 184

    MT9VDDT1672A

    Abstract: MT9VDDT3272A PC2100 PC2700 DDR DIMM pinout micron 184
    Text: 128MB, 256MB x72, ECC 184-Pin DDR SDRAM DIMM DDR SDRAM DIMM MT9VDDT1672A - 128MB MT9VDDT3272A - 256MB For the latest data sheet, please refer to the Micronâ Web site: www.micron.com/moduleds Features Figure 1: 184-Pin DIMM (MO-206) • JEDEC-standard 184-pin dual in-line memory


    Original     		PDF 128MB, 256MB 184-Pin MT9VDDT1672A 128MB MT9VDDT3272A MO-206) PC2100 PC2700 DDR DIMM pinout micron 184

    Untitled

    Abstract: No abstract text available
    Text: 128MB, 256MB x72, ECC , PC3200 184-Pin DDR SDRAM DIMM DDR SDRAM DIMM MT9VDDT1672A - 128MB MT9VDDT3272A - 256MB For the latest data sheet, please refer to the Micronâ Web site: www.micron.com/moduleds Features Figure 1: 184-Pin DIMM (MO-206) • JEDEC-standard 184-pin dual in-line memory


    Original     		PDF 128MB, 256MB PC3200 184-Pin PC3200A 128MB 09005aef80a43d77 DDA9C16

    Untitled

    Abstract: No abstract text available
    Text: 128MB, 256MB x72, ECC , PC3200A 184-Pin DDR SDRAM DIMM DDR SDRAM DIMM MT9VDDT1672A - 128MB MT9VDDT3272A - 256MB For the latest data sheet, please refer to the Micronâ Web site: www.micron.com/moduleds Features Figure 1: 184-Pin DIMM (MO-206) • JEDEC-standard 184-pin dual in-line memory


    Original     		PDF 128MB, 256MB PC3200A 184-Pin PC3200A 128MB 09005aef80a43d77 DDA9C16

    4KA0

    Abstract: PC2100 PC2700 AY-202
    Text: 64MB, 128MB x72, ECC 184-PIN DDR SDRAM DIMM DDR SDRAM DIMM MT5VDDT872A – 64MB MT5VDDT1672A – 128MB For the latest data sheet, please refer to the Micronâ Web site: www.micron.com/moduleds Features Figure 1: 184-Pin DIMM (MO-206) • JEDEC-standard 184-pin, dual in-line memory


    Original     		PDF 128MB 184-PIN MT5VDDT872A MT5VDDT1672A MO-206) 184-pin, 333MT/s PC1600, 4KA0 PC2100 PC2700 AY-202

    Untitled

    Abstract: No abstract text available
    Text: 64MB, 128MB x72, ECC 184-PIN DDR SDRAM DIMM DDR SDRAM DIMM MT5VDDT872A – 64MB MT5VDDT1672A – 128MB For the latest data sheet, please refer to the Micronâ Web site: www.micron.com/moduleds Features Figure 1: 184-Pin DIMM (MO-206) • JEDEC-standard 184-pin, dual in-line memory


    Original     		PDF 128MB 184-PIN 184-pin, 333MT/s PC1600, PC2100, PC2700 09005aef806e1c40 16X72AG

    109 RAP

    Abstract: No abstract text available
    Text: 64MB, 128MB x72, ECC 184-PIN DDR SDRAM DIMM DDR SDRAM DIMM MT5VDDT872A – 64MB MT5VDDT1672A – 128MB For the latest data sheet, please refer to the Micronâ Web site: www.micron.com/moduleds Features Figure 1: 184-Pin DIMM (MO-206) • JEDEC-standard 184-pin, dual in-line memory


    Original     		PDF 128MB 184-PIN 184-pin, 333MT/s PC1600, PC2100, PC2700 09005aef806e1c40 16X72AG 109 RAP

    MT46V32M16P

    Abstract: No abstract text available
    Text: 128MB, 256MB x72, SR PC3200 184-PIN DDR SDRAM UDIMM DDR SDRAM DIMM MT5VDDT1672A – 128MB MT5VDDT3272A – 256MB For the latest data sheet, please refer to the Micron Web site: www.micron.com/products/modules Features Figure 1: 184-Pin DIMM (MO-206) • JEDEC standard 184-pin, dual in-line memory


    Original     		PDF 128MB, 256MB PC3200 184-PIN 184-pin, 400MT/s PC3200 128MB 09005aef80cb210c, MT46V32M16P

    Untitled

    Abstract: No abstract text available
    Text: 64MB, 128MB x72, ECC 200-PIN DDR SDRAM SODIMM SMALL-OUTLINE DDR SDRAM DIMM MT5VDDT872H – 64MB MT5VDDT1672H – 128MB For the latest data sheet, please refer to the Micronâ Web site: www.micron.com/moduleds Features Figure 1: 200-Pin SODIMM (MO-224) • JEDEC standard 200-pin, small-outline, dual in-line


    Original     		PDF 128MB 200-PIN 200-pin, PC1600, PC2100, PC2700 09005aef80a8e767 16x72HG

    DDR SDRAM Component Micron technology

    Abstract: MO-224 PC2100 PC2700 mt46v8m16
    Text: 64MB, 128MB x72, ECC 200-PIN DDR SDRAM SODIMM SMALL-OUTLINE DDR SDRAM DIMM MT5VDDT872H – 64MB MT5VDDT1672H – 128MB For the latest data sheet, please refer to the Micronâ Web site: www.micron.com/moduleds Features Figure 1: 200-Pin SODIMM (MO-224) • JEDEC standard 200-pin, small-outline, dual in-line


    Original     		PDF 128MB 200-PIN MT5VDDT872H MT5VDDT1672H MO-224) 200-pin, PC1600, PC2100, DDR SDRAM Component Micron technology MO-224 PC2100 PC2700 mt46v8m16

    JEC 0.1 SO

    Abstract: LA 5461 74081
    Text: I 5.550 +.0 O 5 /-.O I0 M B.97 +0 .I3 / - 0 .2 5 • 290 (7.37) 5. RECOMMENDED MODULE LAYOUT SHALL BE PER JEDEC MO-161. 6. RECOMMENDED PLATING ON MODULE PADS: 30 MICROINCH/(0.76 MICROMETER) MINIMUM HARD GOLD (Au) OVER 79 MICROINCH/(2.0 MICROMETER) MINIMUM NICKEL (Ni).


    OCR Scan     		PDF PS-71243-9999 MO-161 SD-7488I-QBI JEC 0.1 SO LA 5461 74081

    Untitled

    Abstract: No abstract text available
    Text: I 5.550 + .0 0 5 /-.0 1 0 140.97 + 0 .13/-0.25 5. RECOMMENDED MODULE LAYOUT SHALL BE PER JEDEC MO-161. 6. RECOMMENDED PLATING ON MODULE PADS: 30 MICROINCH/(0.76 MICROMETER) MINIMUM HARD GOLD (Au) OVER 79 MICROINCH/(2.0 MICROMETER) MINIMUM NICKEL (Ni). 7 . SEE CHART FOR FORK/HOLE PRESENCE AND PLATING OPTION.


    OCR Scan     		PDF MO-161 MICROIN/06/12 SD-7488I-QBI

    Untitled

    Abstract: No abstract text available
    Text: F R E E S C A L E SEMICONDUCTOR, ALL RI GH TS RESERVED. TITLE: INC. MECHANICAL OUTLINE T O —2 7 2 W B , 16 LEAD GULL WING P L A S T IC PRINT VERSION NOT TO SCALE DOCUMENT NO: 98ASA10532D REV: F CASE NUMBER: 1329A-04 20 JUN 2007 STANDARD: JEDEC MO-253 BA


    OCR Scan     		PDF 272WB, 98ASA10532D 329A-04 MO-253 5M-1994.

    Untitled

    Abstract: No abstract text available
    Text: CELESTICA» 16M x 64 EDO BUFFERED DIMM FEATURES • • • • • • • • 168-pin industry standard 8 -byte Dual-in-line memory module JEDEC compliant: 21 -C, Fig. 4-13 A,B,C,D,H Release 5 No. 95 MO-161 CAS, WE, OF and Address lines are buffered High performance, CMOS


    OCR Scan     		PDF 168-pin MO-161 20431C) 16135C

    BSV20A

    Abstract: 10n60m NS1110 BSX84 L51A NS1116 dm-58 550n 2N695 2N725
    Text: SYMBOLS & CODES EXPLAINED S YMBOL S & CODES C O M M O N TO MO RE T H A N ONE T E C H N I C A L SECTI ON LINE No. TYPE No. ▼ — New Type + — Revised Specifications # - Non-JEDEC type manufactured outside u :s .a . t Switching type, also listed in Section 12


    OCR Scan     		PDF diff00J B170024 4000n BSV20A 10n60m NS1110 BSX84 L51A NS1116 dm-58 550n 2N695 2N725