JEDEC KOSTAT COMPONENT TRAY Search Results

JEDEC KOSTAT COMPONENT TRAY Result Highlights (5)

Part	ECAD Model	Manufacturer	Description	Download	Buy
DFE2016CKA-2R2M=P2		Murata Manufacturing Co Ltd	Fixed IND 2.2uH 1400mA NONAUTO
GCM033M8ED104KE07D		Murata Manufacturing Co Ltd	0201 (0603M) X8M (Murata) 10Vdc 0.1μF±10%
GRT155C80G106ME13D		Murata Manufacturing Co Ltd	0402 (1005M) X6S (EIA) 4Vdc 10μF±20%
GRT31CC71C226ME13L		Murata Manufacturing Co Ltd	1206 (3216M) X7S (EIA) 16Vdc 22μF±20%
KC355QD7LG134KH01L		Murata Manufacturing Co Ltd	X7T (EIA) 1250Vdc 0.13μF±10%

JEDEC KOSTAT COMPONENT TRAY Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
Kostat Abstract: JEDEC Kostat AN101094-1 Kostat tray J-STD-013 AN-1126 pcb design 0,5 mm pitch Shipping Trays kostat 10 x 10 Kostat tray 3.0 JEDEC Kostat component tray Contextual Info: National Semiconductor Application Note 1126 September 1999 Printed Circuit Board PCB Layout Guidelines NSMD defined pads enhance vision registration of copper fiducials compared to the SMD defined pad. For SMD defined pads, any misregistration of the solder mask will contribute	Original	AN-1126 Kostat JEDEC Kostat AN101094-1 Kostat tray J-STD-013 AN-1126 pcb design 0,5 mm pitch Shipping Trays kostat 10 x 10 Kostat tray 3.0 JEDEC Kostat component tray	PDF
TAIYO PSR 4000 Abstract: manual PACE PSR 800 CCL-HL-832 fbga Substrate design guidelines JEDEC Kostat FBGA CCL-HL832 ablebond esec 3018 operation kostat bga 6mm x 6mm nitto hc100 Contextual Info: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).	Original		PDF
TAIYO PSR 4000 Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY Contextual Info: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).	Original		PDF
taiyo PSR4000 Abstract: Shipping Trays kostat 10 x 10 nitto hc100 Kostat tray PSR4000 aus5 EPAK EPAK TRAY JEDEC Kostat PSR4000 aus5 Contextual Info: Table of Contents Introduction . 2 CHIP SCALE PACKAGES . 2	Original		PDF
fBGA package tray 12 x 19 Abstract: EPAK TRAY FBGA THICK TRAY fbga Substrate design guidelines JEDEC Kostat FBGA EPAK Kostat PSR4000 SLB128B AN-1125 Contextual Info: Table of Contents Introduction . 2 CHIP SCALE PACKAGES . 2	Original		PDF
IC TRAY DATASHEETS KOSTAT Abstract: Voice-Direct-364 Kostat Kostat tray SPEECH DIALER SD 2000 IC TRAY KOSTAT JEDEC Kostat Speech Recognition IC block diagram of speech recognition 24C65 Contextual Info: Voice Direct 364 Data Book  Sensory, Inc. P/N 80-0179-F Table of Contents Copyright  Copyright 2000, Sensory, Inc. You may not copy, modify, or translate this document or any part of this document. Nor can you reduce any part of it to any machine-readable form.	Original	80-0179-F 1N4148 IC TRAY DATASHEETS KOSTAT Voice-Direct-364 Kostat Kostat tray SPEECH DIALER SD 2000 IC TRAY KOSTAT JEDEC Kostat Speech Recognition IC block diagram of speech recognition 24C65	PDF