JEDEC 32 PIN MS-026 FOOTPRINT Search Results

Contextual Info: APT-QF^19K^9 Hinh QnppH Mv i oi u i faixOfa m y ii o|JvvU - 1512Kx32 SRAM / 512Kx32 Flash 1 1 1 | | | Multichip Module | | | Q eroflex CIRCUIT TECHNOLOGY www.aeroflex.com FEATURES • 4 - 512K x 8 SRAMs & 4 - 512K x 8 Flash Die in One MCM ■ Access Times of 25ns, 35ns SRAM and

68L SOT 353

Abstract: tip 3035 transistor C04-067 footprint jedec MS-026 TQFP SP-750 footprint jedec MS-026 TQFP 128 C0421 30014 c04090 transistor wm
Contextual Info: SECTION 11 PACKAGING Outlines and Parameters . 1 Product Tape and Reel Specifications . 58

Contextual Info: Hinh 9nppd nw 1 w r4 1Uü£ 1 ll^ll OpCCU m 128Kx32 SRAM / 512Kx32 FlashI m i Multichip Module m m Q eroflex CIRCUIT TECHNOLOGY www.aeroflex.com FEATURES • 4 - 1 28K x 8 SRAMs & 4 - 512K x 8 Flash Die in One MCM ■ Access Times of 25ns, 35ns SRAM and

Contextual Info: M/HITE /MICROELECTRONICS □ WE32K32-XXX 32Kx32 EEPROM MODULE, SMD 5962-94614 FEATURES • Access Times of 90,120,150ns ■ Automatic Page Write Operation ■ MIL-STD-883 Compliant Devices Available ■ Page Write Cycle Time: 10ms Max ■ Packaging: ■ Data Polling for End of Write Detection

27C32

Abstract: tms27c32 pc3212 27c32-10
Contextual Info: • ÔTblVHS QQ77133 2 ■ TMS27C32 32,768BIT UV ERASABLE PROGRAMMABLE READ-ONLY MEMORY TMS27PC32 32,768-BIT PROGRAMMABLE READ ONLY MEMORY 2SE D . J & N PACKAGE TOP VIEW A7 Organization . . . 4K x 8 A6 C 1 '-'2 4 : 23 : Í 2 22 : Í 3 21 : c 4 A5 Single 6-V Power Supply

Contextual Info: ça WHITE /MICROELECTRONICS WF4M32-XXX5 4MX32 5V FLASH MODULE, SMD 5962-97531 pending PRELIMINARY* FEATURES • Access Times of 1 0 0 ,1 2 0 ,150ns ■ User configurable as 8Mx16 or 16Mx8 in HIP and G4T packages. ■ Packaging: • 66-pin, PGA Type, 1.385 inch square, Hermetic Ceramic

Contextual Info: m i >A_ym -AC?T- V S x x ê m Me i l bitr l y 1 cpip Mjoiu -4M Preliminary ÜEROFLEX Cl RCUIT TECHNOLOGY www.aeroflex.com/act1 .htm Features • 4 Low Voltage/Power AMD 2M x 8 FLASH Die in One MCM Package ■ Overall Configuration is 2M x 32 ■ Ready/Busy output RY/BY - Hardware method for

Contextual Info: a WE32K32-XXX WHITE /MICROELECTRONICS 32Kx32 EEPROM MODULE, SM D 5962-94614 FEATURES • Access Times of 90 ,1 2 0 ,1 50ns ■ Commercial, Industrial and M ilitary Temperature Ranges ■ MIL-STD-883 Compliant Devices Available ■ Automatic Page W rite Operation

4L64

Abstract: DS21930 MARKING CODE l1nn DS21930A MARKING 207 24c001 marking 205 24xx eeprom 4A32A 4A256
Contextual Info: 24AA00/24LC00/24C00 24AA014/24LC014 24AA02/24LC02B 24AA024/24LC024 24AA04/24LC04B 24AA16/24LC16B 24AA64/24LC64 24AA256/24LC256/24FC256 24AA01/24LC01B 24C01C 24C02C 24AA025/24LC025 24AA08/24LC08B 24AA32A/24LC32A 24AA128/24LC128/24FC128 24AA512/24LC512/24FC512

5LABI

Abstract: 25L160 25L160BI I628 25L16 5AAB SCK 058 thermistor 25AA160A 25AA160B 25LC160A
Contextual Info: 25AA160A/B, 25LC160A/B 16K SPI Bus Serial EEPROM Device Selection Table Part Number VCC Range Page Size Temp. Ranges Packages 25LC160A 2.5-5.5V 16 Byte I,E P, SN, ST, MS 25AA160A 1.8-5.5V 16 Byte I P, SN, ST, MS 25LC160B 2.5-5.5V 32 Byte I,E P, SN, ST, MS

MCP6231

Abstract: MCP6231R MCP6231U MCP6232 MCP6234 6234E 6232E
Contextual Info: MCP6231/2/4 20 µA, 300 kHz Rail-to-Rail Op Amp Features Description • • • • • • The Microchip Technology Inc. MCP6231/2/4 operational amplifiers op amps provide wide bandwidth for the quiescent current. The MCP6231/2/4 family has a 300 kHz Gain Bandwidth Product (GBWP) and 65°

Transistor Bq25

Abstract: 6242E MCP6241 MCP6241R MCP6241U MCP6242 MCP6244 373 markings st micro
Contextual Info: MCP6241/2/4 50 µA, 550 kHz Rail-to-Rail Op Amp Features Description • • • • • • The Microchip Technology Inc. MCP6241/2/4 operational amplifiers op amps provide wide bandwidth for the quiescent current. The MCP6241/2/4 has a 550 kHz Gain Bandwidth Product (GBWP) and

G5AA

Abstract: G5Laa 5LABI
Contextual Info: 25AA160A/B, 25LC160A/B 16K SPI Bus Serial EEPROM Device Selection Table Part Number VCC Range Page Size Temp. Ranges Packages 25LC160A 2.5-5.5V 16 Byte I,E P, SN, ST, MS 25AA160A 1.8-5.5V 16 Byte I P, SN, ST, MS 25LC160B 2.5-5.5V 32 Byte I,E P, SN, ST, MS

5L8A

Abstract: 25LC080B G5L8 25AA080A 25AA080B 25LC080A
Contextual Info: 25AA080A/B, 25LC080A/B 8K SPI Bus Serial EEPROM Device Selection Table Part Number VCC Range Page Size Temp. Ranges Packages 25LC080A 2.5-5.5V 16 Byte I, E P, SN, ST, MS 25AA080A 1.8-5.5V 16 Byte I P, SN, ST, MS 25LC080B 2.5-5.5V 32 Byte I, E P, SN, ST, MS

ic g4t

Contextual Info: WF4M32-XXX5 •lì Hi-R£LiASIÜTY PRODUCT 4MX32 5V FLASH MODULE, SMD 5962-97612 pending P R E L IM IN A R Y * FEATURES ■ A cce ss T im e s o f 1 0 0 , 1 2 0 ,150ns ■ P ackaging: U ser c o n fig u ra b le as 8 M x 1 6 o r 1 6 M x 8 in HIP and G4T packages.

Contextual Info: a M/HITE /M ICRO ELECTRO N ICS 128Kx32 5V FLASH MODULE WF128K32-XXX5 PRELIMINARY* FEATURES • 100,000 Erase/Program Cycles Typical, 0°C to +70°C ■ Access Times of 60, 70, 90,120 and 150nS ■ Organized as 128Kx32 ■ Packaging • 66 pin, PGA Type, 1.075 inch square. Hermetic

SDA2006

Abstract: 24LC32AI/SN 1 TO 4 CLOCK BUFFER 8-pin SOIC marking code 8 lead msop package SM 5271 24AA32A 24LC32A
Contextual Info: 24AA32A/24LC32A 32K I2C Serial EEPROM Device Selection Table Description: Part Number VCC Range Max. Clock Frequency Temp. Ranges 24AA32A 1.8-5.5 400 kHz 1 I 2.5-5.5 400 kHz I, E 24LC32A Note 1: 100 kHz for VCC <2.5V Features: • Single supply with operation down to 1.8V

4L32AI

Abstract: 24LC32AT 4l32a 24AA32A 24LC32A soic 208 mil sn0327 0000-0FFFF g4la I327
Contextual Info: 24AA32A/24LC32A 32K I2C Serial EEPROM Device Selection Table Description Part Number VCC Range Max Clock Frequency Temp Ranges 24AA32A 1.8-5.5 400 kHz 1 I 2.5-5.5 400 kHz I, E 24LC32A Note 1: 100 kHz for VCC <2.5V Features Package Types PDIP/SOIC/TSSOP/MSOP

24AA32A

Abstract: 24LC32A
Contextual Info: 24AA32A/24LC32A 32K I2C Serial EEPROM Device Selection Table Description: Part Number VCC Range Max. Clock Frequency Temp Ranges 24AA32A 1.8-5.5 400 kHz 1 I 2.5-5.5 400 kHz I, E 24LC32A Note 1: 100 kHz for VCC <2.5V Features: • Single supply with operation down to 1.8V

TF-128

Abstract: O031
Contextual Info: I =1? ip £ 3 - 4 i yc 1 il c P>T ps UHHMifht - IJ* 1 4 \k * Q eroflex Cl RCUITTBCHNOLOGY Features • 4 Low Power 128K x 8 FLASH Die in One MCM Package ■ Organized as 128K x 32 • User Configurable to 256K x 16 or 512K x 8 • Upgradable to 512K x 32 in same Package Style

Memory

Contextual Info: 24AA32A/24LC32A 32K I2C Serial EEPROM Device Selection Table Description Part Number VCC Range Max Clock Frequency Temp Ranges 24AA32A 1.8-5.5 400 kHz 1 I 24LC32A 2.5-5.5 400 kHz I, E Note 1: 100 kHz for VCC <2.5V Features Package Types PDIP/SOIC/TSSOP/MSOP

4A32A

Abstract: 24AA32A 24LC32A
Contextual Info: 24AA32A/24LC32A 32K I2C Serial EEPROM Device Selection Table Description: Part Number VCC Range Max. Clock Frequency Temp. Ranges 24AA32A 1.8-5.5 400 kHz 1 I 2.5-5.5 400 kHz I, E 24LC32A Note 1: 100 kHz for VCC <2.5V Features: • Single-supply with operation down to 1.8V

Contextual Info: H ig h S p e e d 3 . 3 V CM O S q s 74l c x 4x 374 3 2 - B it R e g is te r Qtm o t S m ra n ro n m .Iir c . FEATURES/BENEFITS DESCRIPTION •32-bit function compatible to the QS74LCX374 •5V tolerant inputs and outputs •10p.A I CCQ quiescent power supply current

Contextual Info: T I I I I I I I I I I I I I I I I r ACT-E128K32 High Speed 4 Megabit EEPROM Multichip Module J I I I I I I I I I I Q I I I I I I I I I I I L er o flex CIRCUIT TECHNOLOGY Features www.aeroflex.com • 4 Low Power 128K x 8 EEPROM Die in One MCM Package ■ Packaging - Hermetic Ceramic