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    Text: PD - 96295 IRGC2B60KB Die in Wafer Form Features • • • • • C Non Punch Through NPT Technology Low VCE(on) 10µs Short Circuit Capability Square RBSOA Positive VCE(on) Temperature Coefficient G Benefits • • • • E Benchmark Efficiency for Motor Control Applications


    Original     		PDF IRGC2B60KB 150mm