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    2331-ZX

    Abstract: Sn62Pb36Ag02 sn63pb37 solder wire Kester LIQUID FLUX IPC-TM650 sn63pb37 solder wire shelf life ZX 650
    Text: 331 Organic Cored W ire For Lead-bearing and Lead-free alloys Product Description Kester 331 Organic Flux is a water soluble formula for use in flux-cored solder wire. This cored solder version of the popular 2331-ZX Neutral Organic Water Soluble Liquid Flux is more effective than


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    2331-ZX 2331-ZX. J-STD-004, IPC-TM-650, 04Jun07 Sn62Pb36Ag02 sn63pb37 solder wire Kester LIQUID FLUX IPC-TM650 sn63pb37 solder wire shelf life ZX 650 PDF

    NORTHBRIDGE* reflow

    Abstract: pin diagram AMD phenom II - X4 RX980 990FX RD990 ATI RADEON reflow profile RD980 amd RADEON igp 215-0716046 AMD Phenom II x4
    Text: AMD 990FX/990X/970 Databook Technical Reference Manual Rev 3.00 P/N: 48691_990FX_ds_nda 2012 Advanced Micro Devices, Inc. Trademarks AMD, the AMD Arrow logo, AMD Phenom, AMD Cool'n'Quiet, and combinations thereof, ATI, the ATI logo, Radeon, and CrossFire are trademarks of Advanced


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    990FX/990X/970 RD990 NORTHBRIDGE* reflow pin diagram AMD phenom II - X4 RX980 990FX ATI RADEON reflow profile RD980 amd RADEON igp 215-0716046 AMD Phenom II x4 PDF

    SN62PB36AG02

    Abstract: sn63pb37 solder wire J-STD-004 solder wire rom1 sn63pb37 solder wire shelf life kester Sn62Pb36Ag02 J-STD-004 Rosin Activated Core Wire kester 44 rosin SN63PB37 IPC-TM-650
    Text: 44 Activated Rosin Cored Wire Product Description Reliability Properties Kester 44 Rosin Flux is an activated rosin formula for use in flux-cored solder wire. Kester 44 Rosin Flux has virtually dominated the field of activated rosin core solders for well over four decades. An


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    J-STD-004, IPC-TM-650, 26Mar10 SN62PB36AG02 sn63pb37 solder wire J-STD-004 solder wire rom1 sn63pb37 solder wire shelf life kester Sn62Pb36Ag02 J-STD-004 Rosin Activated Core Wire kester 44 rosin SN63PB37 IPC-TM-650 PDF

    bellcore GR-78

    Abstract: sn63pb37 solder wire sn63pb37 solder wire shelf life kester 245 solder wire GR-78 sn63pb37 Sn62Pb36Ag02 ROSIN FLUX TYPE ROL0 245 Rosin Flux Cored Solder Kester 245
    Text: 245 No-Clean Cored W ire Product Description Reliability Properties Kester 245 No-clean Cored Wire was developed to complement low residue liquid fluxes being used by the electronics industry. The chemistry is based on some of the same principles that have


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    MIL-F-14256. GR-78 J-STD-004, IPC-TM-650, J-STD-00ions 15Jun07 bellcore GR-78 sn63pb37 solder wire sn63pb37 solder wire shelf life kester 245 solder wire sn63pb37 Sn62Pb36Ag02 ROSIN FLUX TYPE ROL0 245 Rosin Flux Cored Solder Kester 245 PDF

    J-STD-004 solder wire rom1

    Abstract: kester 285 solder wire J-STD-004 Kester Kester* 1544 kester 245 solder wire kester Sn62Pb36Ag02 Sn62Pb36Ag02 IPC-TM-650 IPC-TM650
    Text: 48 Activated Rosin Cored W ire For Lead-bearing and Lead-free alloys Product Description Reliability Properties Kester 48 Activated Rosin Flux for cored solder wire was developed for lead-free applications to enable soldering of most common metals. Kester


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    J-STD-004, IPC-TM-650, J-STD-00ions 14Jun07 J-STD-004 solder wire rom1 kester 285 solder wire J-STD-004 Kester Kester* 1544 kester 245 solder wire kester Sn62Pb36Ag02 Sn62Pb36Ag02 IPC-TM-650 IPC-TM650 PDF

    RS600ME

    Abstract: amd athlon 64 x2 motherboard schematic block diagram RS600ME-SB600-DDR2 ATI SB460 218S6ECLA21FG 8254 TIMER amd SB600 218S6ECLA21FG sb600 amd RADEON igp SB460
    Text: SB600 Databook Technical Reference Manual Rev. 3.05 P/N: 42119_sb600_ds_3.05 2007-2008 Advanced Micro Devices, Inc. Trademarks AMD, the AMD Arrow logo, Athlon, and combinations thereof, ATI, ATI logo, Radeon, and CrossFire are trademarks of Advanced Micro Devices, Inc.


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    SB600 RS600ME amd athlon 64 x2 motherboard schematic block diagram RS600ME-SB600-DDR2 ATI SB460 218S6ECLA21FG 8254 TIMER amd SB600 218S6ECLA21FG amd RADEON igp SB460 PDF

    astm D150

    Abstract: D412 ASTM D412 ASTM D5470 ASTM D2240, D412 ASTM D2240 T-Flex 200 Outgassing CVCM ASTM
    Text: Laird Technologies Web site: www.LairdTech.com Item # Tflex 2130 V0, Tflex 200 V0 Series Gap Filler Material Tflex™ 200 V0 Series Gap Filler Material The Tflex™ 200 V0 Series is a very soft, free standing gap filler that is more compressible than most gap fillers. Tflex™


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    D5470 IPC-TM-650 astm D150 D412 ASTM D412 ASTM D5470 ASTM D2240, D412 ASTM D2240 T-Flex 200 Outgassing CVCM ASTM PDF

    H9723

    Abstract: h9740 l9718 L9712 L9709 L9727 T9934 l9731 L9706 l9735
    Text: INTEGRATED DEVICE TECHNOLOGY, INC. QUALITY & RELIABILITY MONITORS April 1998 2975 Stender Way, Santa Clara, CA 95054 TEL: 800 345-7015 FAX: (408) 492-8674 QUALITY & RELIABILITY MONITOR REPORT April 1998 TABLE OF CONTENTS Section I: Introduction Section II:


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    9808M 9806M 9807M H9723 h9740 l9718 L9712 L9709 L9727 T9934 l9731 L9706 l9735 PDF

    RO4403

    Abstract: Rogers RO4003 rt/duroid 5880 RO4450F rogers 5880 RO3006 RO4350B rogers laminate materials RO4450B RO3210
    Text: Ordering Information: Standard Thickness, Tolerance and Panel Size Rogers’ high frequency laminates can be purchased by contacting a Rogers Customer Service Representative at 480 961-1382 or one of our international offices listed below. To ensure that you receive the material for your application, please include order information for each of the


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    6010LM, RO3003 RO3035 RO3203 RO3006 RO3206 RO3010 RO3210 RO4003C RO4350B RO4403 Rogers RO4003 rt/duroid 5880 RO4450F rogers 5880 RO3006 rogers laminate materials RO4450B RO3210 PDF

    IPC-SM-786A

    Abstract: BGA and QFP Altera Package mounting profile JESD22-A113 J-STD-020A GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE IPC-SM-780 altera board
    Text: Reflow Soldering Guidelines January 1999, ver. 3 Introduction for Surface-Mount Devices Application Note 81 Altera’s surface-mount products include quad flat pack QFP , ceramic and plastic J-lead chip carriers (JLCC and PLCC, respectively), ball-grid


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    PDF

    Thermal Gap Filler

    Abstract: D149 D2240 D257 D412 E595
    Text: TflexTM 200 V0 Series Thermal Gap Filler Innovative Technology for a Connected World SOFT, FREESTANDING GAP FILLER Tflex 200 V0 is a very soft, freestanding gap filler that is more compliant than most other gap fillers. Combining good thermal conductivity of 1.1 W/mK with high conformability, this


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    A14175-00 Thermal Gap Filler D149 D2240 D257 D412 E595 PDF

    Untitled

    Abstract: No abstract text available
    Text: TflexTM 300 Series Thermal Gap Filler Innovative Technology for a Connected World UNIQUE SILICONE GEL OFFERS COMPLIANCY, THERMAL RESISTANCE Tflex 300, at pressures of 50psi, will deflect to over 50% the original thickness. This high rate of compliancy allows the material to “totally blanket” the component, enhancing


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    50psi, 300-H A15293-00 PDF

    Untitled

    Abstract: No abstract text available
    Text: TflexTM HR200 Series Thermal Gap Filler Innovative Technology for a Connected World PRELIMINARY MID-PERFORMANCE GAP FILLER WITH 1.6 W/MK Tflex HR200 is a cost-effective and compliant gap filler thermal interface material with excellent thermal performance and great handling for mass-production applications.


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    HR200 A16503-00 PDF

    D149

    Abstract: D150 D2240 D257 D412 E595
    Text: T-flex 600 Series Thermal Gap Filler global solutions : local support ™ T-flexTM 600 Series Thermal Gap Filler Exceptionally soft, highly compressible gap filler T-flex™ 600 is an exceptionally soft, highly compressible gap filling interface pad with a thermal conductivity of 3 W/mK. These


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    Untitled

    Abstract: No abstract text available
    Text: Easy Profile 256 No-Clean Solderpaste Product Description Physical Properties Data given for Sn63Pb37 90% metal, -325+500 mesh Easy Profile® 256 is a no-clean, air or nitrogen reflowable, solder paste specifically designed for maximum robustness in reflow profiling and stencil


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    Sn63Pb37 EP256 21Sep09 PDF

    Untitled

    Abstract: No abstract text available
    Text: SMT International, LLC P.O. Box 989 Deep River, CT 06417 Toll Free: 800.435.0317 Phone: 860.526.8243 Fax: 860.526.8243 AMTECH Advanced SMT Solder Products www.amtechsolder.com An ISO 9001 Certified Company Product Data Sheet for Chip Quik Pt # SMD4300AX10 w/lead


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    SMD4300AX10 900Kcps 450Kcps IPC-TM-650 PDF

    Untitled

    Abstract: No abstract text available
    Text: Flame Retardant Epoxy Encapsulating & Potting Compound 833FRB Technical Data Sheet 833FRB Encapsulating and Potting Epoxy Description The 833FRB Flame Retardant Epoxy Encapsulating and Potting Compound is a UL 94V-0 recognized electric grade epoxy in the QMFZ2 category. This two-part epoxy provides a black, self-extinguishing finish


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    833FRB 833FRB PDF

    Untitled

    Abstract: No abstract text available
    Text: 3M Moisture Barrier Bag Dri-Shield 2000 Product Data Sheet Product Data Sheet 3M™ Moisture Barrier Bag Dri-Shield 3000 This foil moisture barrier bag is designed to provide a static safe environment for sensitive electronic devices. A nylon layer helps to strengthen the bag. The bags are


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    F1249 MIL-STD-3010C IPC-TM-650 051A/3052. PDF

    Untitled

    Abstract: No abstract text available
    Text: CHEMTRONICS TDS #CW 8300 Technical Data Sheet CircuitWorks Water Soluble Flux Pen PRODUCT DESCRIPTION CircuitWorks Water Soluble Flux Pen is designed specifically to apply water soluble flux with precision control. The Water Soluble Flux consists of a neutral pH organic


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    PDF

    Untitled

    Abstract: No abstract text available
    Text: Product Data Sheet Product Data Sheet 3M Moisture Barrier Bag 3370 This aluminized moisture barrier bag is designed to provide a static safe environment for sensitive electronic devices. The bags are heat sealable and suitable for vacuum packaging. Bags are printed with ESD and moisture warning symbols and a lot code for traceability.


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    grams/100 051A/3052. PDF

    Untitled

    Abstract: No abstract text available
    Text: Product Data Sheet Product Data Sheet 3M Metal-Out Static Shielding Bag 1500 This transparent metal-out static shielding bag is designed to provide a static safe environment for sensitive electronic devices. Bags are printed with an ESD warning symbol and a lot code for traceability. Open top and ZipTop styles are available. The


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    Bag1500 MIL-STD-3010C IPC-TM-650 PDF

    jedec package MO-247

    Abstract: qfn 88 stencil QN180 IEC-68-2-32 QFN PCB Layout guide QN108 Amkor TSCSP qfn 32 land pattern IPC-TM-650 2.6.9 QN180 outline
    Text: Application Note AC322 Assembly and PCB Layout Guidelines for QFN Packages Introduction The dual-row or multi-row QFN package is a near Chip Scale, plastic-encapsulated package with a copper leadframe substrate. The exposed die attach paddle on the bottom efficiently conducts heat to the PCB


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    AC322 jedec package MO-247 qfn 88 stencil QN180 IEC-68-2-32 QFN PCB Layout guide QN108 Amkor TSCSP qfn 32 land pattern IPC-TM-650 2.6.9 QN180 outline PDF

    kester 245 solder wire

    Abstract: bellcore GR-78 kester 245 sn63pb37 solder wire ROSIN FLUX TYPE ROL0 GR-78 sn63pb37 solder wire shelf life J-STD-004 Kester IPC-TM650
    Text: 245 No-Clean Cored W ire Product Description Reliability Properties Kester 245 No-clean Cored Wire was developed to complement low residue liquid fluxes being used by the electronics industry. The chemistry is based on some of the same principles that have


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    MIL-F-14256. GR-78 12Jul06 kester 245 solder wire bellcore GR-78 kester 245 sn63pb37 solder wire ROSIN FLUX TYPE ROL0 sn63pb37 solder wire shelf life J-STD-004 Kester IPC-TM650 PDF

    SMD-291AX

    Abstract: No abstract text available
    Text: SMT International, LLC P.O. Box 989 AMTECH D e e p R ive r , C T 0 6 4 1 7 Toll free: 800.435.0317 Phone: 860.526.8300 Fax: 860.526.8243 Advanced SMT Solder Products www.amtechsolder.com An ISO 9001 Certified Company Product Data Sheet for Chip Quik Pt#


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    SMD291AX SMD291AX10 900Kcps IPC-TM-650 SMD-291AX PDF