IPC9701 Search Results

R-PDSO-G8 Package land pattern

Contextual Info: OPA OPA 347 OPA OPA 347 347 OPA OPA347 OPA2347 OPA4347 434 234 7 7 SBOS167C – NOVEMBER 2000– REVISED JUNE 2003 microPower, Rail-to-Rail Operational Amplifiers FEATURES DESCRIPTION ● LOW IQ: 20µA ● microSIZE PACKAGES: WCSP-8, SC70-5 SOT23-5, SOT23-8, and TSSOP-14

Contextual Info: OPA 347 OPA OPA 347 OPA347 OPA2347 OPA4347 347 OPA 434 7 OPA 234 7 SBOS167D – NOVEMBER 2000– REVISED JULY 2007 microPower, Rail-to-Rail Operational Amplifiers FEATURES DESCRIPTION ● LOW IQ: 20µA ● microSIZE PACKAGES: WCSP-8, SC70-5 SOT23-5, SOT23-8, and TSSOP-14

JESD22-A110-B HIGHLY ACCELERATED TEMPERATURE AND

Contextual Info: V•I Chip – BCM Bus Converter Module TM B048K480T30 + + –K – • >97% efficiency • 300 Watt 450 Watt for 1 ms • 125°C operation • High density – up to 1165 W/in3 • <1 µs transient response • Small footprint – 280 W/in • >3.5 million hours MTBF

transistor af 126

Abstract: JESD22-B-107-A J-STD-029 mount chip transistor 332
Contextual Info: V•I Chip – BCM Bus Converter Module TM B048K120T20 Vin = 42 - 53 V Vout = 10.5 - 13.25 V Iout = 17.0 A K = 1/4 Rout = 25 mΩ max • 48V to 12V V•I Chip Converter • >96% efficiency • 200 Watt 300 Watt for 1 mS • 125°C operation • High density – up to 800 W/in3

tssop 16 exposed pad stencil

Abstract: A47 SOT23
Contextual Info: OPA 347 OPA OPA 347 OPA347 OPA2347 OPA4347 347 OPA 434 7 OPA 234 7 SBOS167D – NOVEMBER 2000– REVISED JULY 2007 microPower, Rail-to-Rail Operational Amplifiers FEATURES DESCRIPTION ● LOW IQ: 20µA ● microSIZE PACKAGES: WCSP-8, SC70-5 SOT23-5, SOT23-8, and TSSOP-14

IPC-9592

Abstract: GR-1274-CORE
Contextual Info: 5:1 Intermediate Bus Converter Module: Up to 650 W Output IB048Q096T64N1-00 Features • Input: 38 – 55 Vdc • 98.1% peak efficiency • Output: 9.6 Vdc at 48 Vin • Low profile: 0.42” height above board • Output current: up to 64 A • Industry standard 1/4 Brick pinout

Contextual Info: IBC Module IB0xxQ096T64xx-xx 5:1 Intermediate Bus Converter Module: Up to 650 W Output Features • Input: 36 – 60 Vdc • 98.1% peak efficiency 38 – 55 Vdc for IB048x • Low profile: 0.42” height above board • Output: 9.6 Vdc at 48 Vin • Industry standard 1/4 Brick pinout

Contextual Info: IBC Module IB048Q096T64N1-00 5:1 Intermediate Bus Converter Module: Up to 650 W Output Features • Input: 38 – 55 Vdc • 98.1% peak efficiency • Output: 9.6 Vdc at 48 Vin • Low profile: 0.42” height above board • Output current: up to 64 A • Industry standard 1/4 Brick pinout

Contextual Info: IBC Module IB050Q096T64N1-00 5:1 Intermediate Bus Converter Module: Up to 650 W Output Features Size: 2.30 x 1.45 x 0.42 in 58,4 x 36,8 x 10,6 mm • Input: 36 – 60 Vdc • 98.1% peak efficiency • Output: 9.6 Vdc at 48 Vin • Low profile: 0.42” height above board

Contextual Info: IBC Module IB0xxQ096T80xx-xx 5:1 Intermediate Bus Converter Module: Up to 850 W Output Features • 98.1% peak efficiency • Input: 36 – 60 Vdc 38-55 Vdc for IB048x • Output: 9.6 Vdc at 48 Vin • Output current: up to 80 A Size: 2.30 x 1.45 x 0.42 in

Contextual Info: IBC Module IB054E120T40N1-00 4:1 Intermediate Bus Converter Module: Up to 500 W Output Features • Input: 36 – 60 Vdc • 98% peak efficiency • Output: 12.0 Vdc at 48 Vin • Low profile: 0.38” height above board • Output current up to 40 A • Industry standard 1/8 Brick pinout

Contextual Info: IBC Module IB054Q120T53N1-00 4:1 Intermediate Bus Converter Module: Up to 650 W Output Features • Input: 36 – 60 Vdc • 97.8% peak efficiency • Output: 12 Vdc at 48 Vin • Low profile: 0.42” height above board • Output current: up to 53 A Size:

Contextual Info: IBC Module IB050Q096T64N1-00 5:1 Intermediate Bus Converter Module: Up to 650 W Output Features Size: 2.30 x 1.45 x 0.42 in 58,4 x 36,8 x 10,6 mm • Input: 36 – 60 Vdc • 98.1% peak efficiency • Output: 9.6 Vdc at 48 Vin • Low profile: 0.42” height above board

Contextual Info: IBC Module IB048E096T40N1-00 5:1 Intermediate Bus Converter Module: Up to 300 W Output Features Size: 2.30 x 0.9 x 0.38 in 58,4 x 22,9 x 9,5 mm • Input: 38 – 55 Vdc • 97.4% peak efficiency • Output: 9.6 Vdc at 48 Vin • Low profile: 0.38” height above board

IPC-A-610D

Abstract: ipc 610D IPCA610D IPC-A610D IPC-9701 "IPC-9701" ipc 610 joint lineage power IPC-A-610-D
Contextual Info: Application Note August 28, 2009 PDF Name: block_pin_sj_guidelines.pdf Application Guidelines for Non-Isolated Converters AN09-002: Block Pin Solder Joint Guidelines Introduction Lineage Power Austin LynxTM SMT Point of Load power modules utilize block pins as interconnections between the

48V-to-12V

Abstract: smd TRANSISTOR marking T1
Contextual Info: V•I Chip – BCM Bus Converter Module TM B048K120T15 Vin = 42 - 53 V Vout = 10.5 - 13.25 V Iout = 12.5 A K = 1/4 Rout = 32 mΩ max • 48V to 12V V•I Chip Converter • >96% efficiency • 150 Watt 225 Watt for 1 ms • 125°C operation • High density – up to 600 W/in3

Contextual Info: IBC Module IB048Q120T53N1-00 4:1 Intermediate Bus Converter Module: Up to 650 W Output Features • Input: 38 – 55 Vdc • 97.8% peak efficiency • Output: 12 Vdc at 48 Vin • Low profile: 0.42” height above board • Output current: up to 53 A • Industry standard 1/4 Brick pinout

R-PDSO-G5 land pattern

Contextual Info: OPA OPA 347 OPA OPA 347 347 OPA OPA347 OPA2347 OPA4347 434 234 7 7 SBOS167C – NOVEMBER 2000– REVISED JUNE 2003 microPower, Rail-to-Rail Operational Amplifiers FEATURES DESCRIPTION ● LOW IQ: 20µA ● microSIZE PACKAGES: WCSP-8, SC70-5 SOT23-5, SOT23-8, and TSSOP-14

WLCSP stencil design

Abstract: ja 16201 WLCSP smt Texas SBVA017 wcsp wcsp reliability A104B IPC-7525 JESD22 S2062
Contextual Info: Application Report SBVA017 - February 2004 NanoStart & NanoFreet 300mm Solder Bump Wafer Chip-Scale Package Application Jim Rosson High Performance Analog—MAKE Packaging ABSTRACT The NanoStartWafer Chip-Scale Package WCSP is a family of bare die packages

R-PDSO-G5 land pattern

Abstract: R-PDSO-G5 LAND R-PDSO-G8 land pattern marking code FA sot23 sot23 marking code a42 AMP marking SA sot-23
Contextual Info: OPA OPA 347 OPA OPA 347 347 OPA OPA347 OPA2347 OPA4347 434 234 7 7 SBOS167C – NOVEMBER 2000– REVISED JUNE 2003 microPower, Rail-to-Rail Operational Amplifiers FEATURES DESCRIPTION ● LOW IQ: 20µA ● microSIZE PACKAGES: WCSP-8, SC70-5 SOT23-5, SOT23-8, and TSSOP-14

LTM4602

Abstract: LTM4600 LTM4601 15X15 0623 IPC-9701 IPC 9701 power one date code
Contextual Info: RELIABILITY DATA LTM4600 / LTM4601 / LTM4602 1/15/2007 • OPERATING LIFE TEST PACKAGE TYPE SAMPLE SIZE OLDEST DATE CODE NEWEST DATE CODE DEVICE HOURS 1 EQV to +100°C LGA 15X15 551 0452 0645 2,820,404 551 2,820,404 • J-STD-020 LEVEL 4 PRECONDITIONING4 (96 HOURS 30°C/60%RH + 3X IR REFLOW +245°C)

Contextual Info: IBC Module IB054Q120T53N1-00 4:1 Intermediate Bus Converter Module: Up to 650 W Output Features • Input: 36 – 60 Vdc • 97.8% peak efficiency • Output: 12 Vdc at 48 Vin • Low profile: 0.42” height above board • Output current: up to 53 A Size:

Contextual Info: IBC Module IB048E096T40N1-00 5:1 Intermediate Bus Converter Module: Up to 300 W Output Features Size: 2.30 x 0.9 x 0.38 in 58,4 x 22,9 x 9,5 mm • Input: 38 – 55 Vdc • 97.4% peak efficiency • Output: 9.6 Vdc at 48 Vin • Low profile: 0.38” height above board

Contextual Info: IBC Module IB050Q120T53N1-00 4:1 Intermediate Bus Converter Module: Up to 650 W Output Features Size: 2.30 x 1.45 x 0.42 in 58,4 x 36,8 x 10,6 mm • Input: 36 – 60 Vdc • 97.8% peak efficiency • Output: 12 Vdc at 48 Vin • Low profile: 0.42” height above board