IPC-SM-782
Abstract: IPCSM-782 IPC-782 IPC782 SOJ 44 PCB land MELF "Land Pattern" land pattern for TSOP J-Lead, QFP ceramic
Text: Number One Systems IPC-SM-782 Library Supplementary Surface Mount Library for Easy-PC For Windows IPC-SM-782 Library The optional IPCSM-782 library contains supplementary component IPC782.CML and PCB symbol (IPC782.PSL) libraries for use with any variant of Easy-PC For Windows,
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IPC-SM-782
IPCSM-782
IPC782
IPC-SM-782,
IPC782"
IPC-782
SOJ 44 PCB land
MELF "Land Pattern"
land pattern for TSOP
J-Lead, QFP ceramic
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2225 capacitor footprint dimension
Abstract: ipc-SM-782 IPC-SM-782 0805 2211 size footprint 0603 footprint IPC 1206 footprint IPC ceramic capacitor footprint 0402 dimension 1825 footprint dimension 3530 novacap 0402 capacitor ipc-SM-782
Text: Ceramic Surface Mount Mounting Pad Dimensions and Considerations The objective of this document is to introduce the IPC-SM-782 methodology for solder reflow land patterns. The methodology will be extended to all NOVACAP standard and non-standard part sizes including assumptions for pick & place
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IPC-SM-782
2225 capacitor footprint dimension
IPC-SM-782 0805
2211 size footprint
0603 footprint IPC
1206 footprint IPC
ceramic capacitor footprint 0402 dimension
1825 footprint dimension
3530 novacap
0402 capacitor ipc-SM-782
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1206 land pattern
Abstract: NOMCA MPMA HTRN
Text: Land Patterns www.vishay.com Vishay Dale Thin Film Vishay Dale Thin Film Land Patterns 1. Scope This technical note provides sample land patterns for Vishay Dale Thin Film SMT resistive products. The following drawings are based on IPC-SM-782 Surface Mount Design and Land Pattern Standard. These drawings are for reference only Vishay Thin
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IPC-SM-782
M/D55342
12-Jun-15
1206 land pattern
NOMCA
MPMA
HTRN
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ipc-SM-782
Abstract: MELF "Land Pattern" MiniMELF land pattern land pattern for TO 92 MELF pad layout SOD-323 land pattern ipc SMB SMC IPCSM-782 sod323 wave soldering
Text: Suggested Pad Layout Based on IPC-SM-782 Figure 1 Dimensions MiniMELF QuadroMELF MicroMELF MELF SOD-323 SOD-123 SMA SMB SMC Z 3.0 4.8 6.3 3.75 4.9 6.6 6.7 9.3 G 1.4 2.1 3.3 1.05 2.5 1.5 1.8 4.4 X 1.5 1.7 2.7 0.65 0.7 1.7 2.3 3.3 Y 0.8 ref. 1.3 ref. 1.5 ref.
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IPC-SM-782
OD-323
OD-123
OT-323
OT-23
SC-59
OT-363
IPC-SM-782,
AP02001
ipc-SM-782
MELF "Land Pattern"
MiniMELF land pattern
land pattern for TO 92
MELF pad layout
SOD-323 land pattern
ipc SMB SMC
IPCSM-782
sod323 wave soldering
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Untitled
Abstract: No abstract text available
Text: 78250J Series www.murata-ps.com MAX250/MAX251 Compatible Converter SM Transformers CHARACTERISTICS 78250JC FEATURES J-STD-020D reflow RoHS compliant Maxim MAX250/MAX251 compatible Isolation to 4kVrms Industry-standard pinout Surface mount option UL 94 V-0 package materials
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78250J
MAX250/MAX251
78250JC
10kHz,
100mV
100kHz,
J-STD-020D
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MAX251
Abstract: No abstract text available
Text: 78250J Series www.murata-ps.com MAX250/MAX251 Compatible Converter SM Transformers CHARACTERISTICS 78250JC FEATURES n J-STD-020D reflow n RoHS compliant n Maxim MAX250/MAX251 compatible n Isolation to 4kVrms n Industry-standard pinout n Surface mount option
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78250J
MAX250/MAX251
78250JC
10kHz,
100mV
100kHz,
J-STD-020D
MAX251
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78253JC
Abstract: 78253/55JVC-R
Text: 78253J Series MAX253 Compatible Converter SM Transformers SELECTION GUIDE Order Code 78253/35JC 78253/55JC 78253/35JVC 78253/55JVC V Output Voltage V Max. Output Current mA Isolation Voltage VDC Turns Ratio 3.3 5.0 3.3 5.0 5.0 5.0 5.0 5.0 100 200 100 200 1500
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78253J
MAX253
78253/35JC
78253/55JC
78253/35JVC
78253/55JVC
J-STD-020D
500kHZ
78253/XXJC
78253JC
78253/55JVC-R
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Untitled
Abstract: No abstract text available
Text: 78253J Series MAX253 Compatible Converter SM Transformers SELECTION GUIDE Order Code 78253/35JC 78253/55JC 78253/35JVC 78253/55JVC V Output Voltage V Max. Output Current mA Isolation Voltage VDC Turns Ratio 3.3 5.0 3.3 5.0 5.0 5.0 5.0 5.0 100 200 100 200 1500
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78253J
MAX253
78253/35JC
78253/55JC
78253/35JVC
78253/55JVC
J-STD-020D
500kHz
78253JC
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Kemet Flex Solutions
Abstract: f2105 IPC-782A 198D IPC-SM-782 EIA-198 method 103 F-2100E F211
Text: Surface Mount Mounting Pad Dimensions and Considerations Ceramic Capacitors including 0603, 0402, 0201 and ceramic arrays Tantalum Capacitors (including low profile and large case (X & E) sizes and R case sizes) Aluminum Capacitors (including D, V, & X case sizes)
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F-2100E
IPC-SM-782,
Kemet Flex Solutions
f2105
IPC-782A
198D
IPC-SM-782
EIA-198 method 103
F211
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IPC-7095
Abstract: J-STD-013 SM-782A
Text: AND8075/D Board Mounting Considerations for FCBGA Packages Prepared by: Phill Celaya, Packaging Manager Mark D. Barrera, Broadband Knowledge Engineer http://onsemi.com APPLICATION NOTE APPLICATION NOTE USAGE Resin Seal Package Board Organic ÈÈÈÈÈÈÈÈÈÈÈÈÈÈ
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AND8075/D
r14525
IPC-7095
J-STD-013
SM-782A
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fuse smd code ud
Abstract: kc-1206 EB smd code marking tantalum capacitor cf750 2824 footprint dimension JK-110 CAP SMD 2.2uF 50V 10 CERAMIC X7R 0603 TANTALUM smd capacitor 685 35K 1808 footprint IPC Commercial "L", SnPb Termination, X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)
Text: Surface Mount Multilayer Ceramic Chip Capacitors Commercial Grade Surface Mount Multilayer Ceramic Chip Capacitors One world. One KEMET. Surface Mount Multilayer Ceramic Chip Capacitors Commercial Grade Table of Contents Page Why Choose KEMET. 4
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15bis
fuse smd code ud
kc-1206
EB smd code marking tantalum capacitor
cf750
2824 footprint dimension
JK-110
CAP SMD 2.2uF 50V 10 CERAMIC X7R 0603
TANTALUM smd capacitor 685 35K
1808 footprint IPC
Commercial "L", SnPb Termination, X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)
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MRF1507
Abstract: thermal analysis pld 1.5 "thermal via" AN4005 EB209
Text: MOTOROLA Order this document by AN4005/D SEMICONDUCTOR APPLICATION NOTE AN4005 Thermal Management and Mounting Method for the PLD 1.5 RF Power Surface Mount Package Prepared by: Jeanne Pavio and Mike McCloskey Motorola SPS Communications Technology Center
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AN4005/D
AN4005
MRF1507
thermal analysis pld 1.5
"thermal via"
AN4005
EB209
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AN4005
Abstract: MRF1507 EB209
Text: MOTOROLA Freescale Semiconductor, Inc. SEMICONDUCTOR APPLICATION NOTE Order this document by AN4005/D AN4005 Thermal Management and Mounting Method for the PLD 1.5 RF Power Surface Mount Package Prepared by: Jeanne Pavio and Mike McCloskey Motorola SPS Communications Technology Center
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AN4005/D
AN4005
AN4005
MRF1507
EB209
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MLX75030
Abstract: No abstract text available
Text: MLX75030 Universal Active Light Sensor Interface Features & Benefits Two independent simultaneously operating active light measurement channels Integrated DC light cancellation circuitry for active light channel DC light suppression Two logarithmic ambient light channels
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MLX75030
16Bit
ISO14001
Dec/12
MLX75030
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Untitled
Abstract: No abstract text available
Text: MLX75308 Rain-/Light-Sensor IC for Automotive Features and Benefits Two independent simultaneously operating Rain measurement channels Integrated DC light cancellation circuitry for Rain channel DC light suppression Integrated compensation for DC light induced
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MLX75308
32Bit
16Bit
ISO14001
Sep/12
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microcontroller based rain detector
Abstract: MLX75308 SFH2701 rain light sensor IR rain light sensor digital IC 7411 for three input AND GATE rain detector circuit diagram voltage regulator diode 7228 windshield rain sensor SFH2400
Text: MLX75308 Rain-/Light-Sensor IC for Automotive Features and Benefits Two independent simultaneously operating Rain measurement channels Integrated DC light cancellation circuitry for Rain channel DC light suppression Integrated compensation for DC light induced
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MLX75308
32Bit
16Bit
ISO14001
Jun/11
microcontroller based rain detector
MLX75308
SFH2701
rain light sensor
IR rain light sensor
digital IC 7411 for three input AND GATE
rain detector circuit diagram
voltage regulator diode 7228
windshield rain sensor
SFH2400
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smd diode code F46
Abstract: Lightsensor 19 bddf
Text: MLX75308 Rain-/Light-Sensor IC for Automotive Features and Benefits 1 Two independent simultaneously operating Rain measurement channels 1 Integrated DC light cancellation circuitry for Rain channel DC light suppression 1 Integrated compensation for DC light induced
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MLX75308
32Bit
16Bit
ISO14001
Nov/11
smd diode code F46
Lightsensor
19 bddf
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LPCC-16
Abstract: recommended land pattern for soic qfn 32 land pattern LPCC16 ipc-SM-782 narrow body SOIC 8 pcb pattern Discrete Semiconductors qfn32 land pattern SOIC 8 pcb pattern SOIC 8 narrow body pcb pattern
Text: GaAs RFICs and Modules Footprints Surface Mount Land Patterns Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and Packaging Electronic Circuits surface mount design and land pattern standard: IPC-SM-782.
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IPC-SM-782.
QFN-32
LPCC-16
recommended land pattern for soic
qfn 32 land pattern
LPCC16
ipc-SM-782
narrow body SOIC 8 pcb pattern
Discrete Semiconductors
qfn32 land pattern
SOIC 8 pcb pattern
SOIC 8 narrow body pcb pattern
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PLCC-124
Abstract: PLCC100 ipc-SM-782 plcc68 socket
Text: Date IPC-SM-782 _ Th e Instttute for . _ _ Surface Mount Design and Land Pattern Standard a n d P a cka g in g 5/96 Revision A Section 12.1 Subject PLCC Square E lectro nic Cir c u its 1.0 SCOPE This subsection provides the component and land pattern dimensions for plastic leaded chip carriers, square (PLCC
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IPC-SM-782
IPC-782-12-1-4
PLCC-124
PLCC100
ipc-SM-782
plcc68 socket
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Untitled
Abstract: No abstract text available
Text: SURFACE MOUNTED RESISTOR NETWORK WIDE BODY .300 INCH WIDE MOLDED SOL STYLE / 16 AND 20 PINS • JEDEC package compatible with automatic placement equipment ■ Compliant leads to reduce solder joint fatiguing ■ High temperature design suitable for all popular soldering techniques
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4400P
50ohms
100ppm/Â
250ppm/Â
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4816P-001
Abstract: 4816P-002 4820P-002 4814p-002 IR412 4814p-001 4800P 4820P002 4820P-003 4816P
Text: b3E D BO UR NS INC • 1SSL.573 naD D ^b M 433 H I B O U R THICK FILM SURFACE MOUNTED MEDIUM BODY 5.59MM SOM PACKAGE/ 14, 16, 18 AND 20 PINS ■ Standard E.I.A. (SOGN-0002) package compatible with automatic placement equipment ■ High temperature lead attachment to withstand reflow temperatures
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lSSbS73
SOGN-0002)
4800P
100ppm/Â
250ppm/Â
100ppm/1Kohms
4814P-003
4816P-003
4818P-003
4820P-003
4816P-001
4816P-002
4820P-002
4814p-002
IR412
4814p-001
4820P002
4816P
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4816P-002
Abstract: No abstract text available
Text: For technical assistance call the Networks Products number on the back cover. Features • Standard E.I.A. package com patible w ith au tom atic placem ent eq u ipm en t ■ Tape and reel packaging standard see page 2 8 6 fo r d im ensions C om pliant leads to reduce solder joint
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4800P
4816P-002
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Untitled
Abstract: No abstract text available
Text: THICK FILM SURFACE MOUNTED NARROW BODY 3.9MM SON PAC KAG E/8, 14 AND 16 PINS • Reduced board real estate requirements ■ Compatible with automatic placement equipment ■ Tape anc reel packaging standard p o u r e N S ■ Compliant copper leads Model 4900P
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4900P
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ipc sm 782
Abstract: 4420p-002
Text: THICK FILM SURFACE MOUNTED WIDE BODY 7.49MM MOLDED SOL STYLE / 16 AND 20 PINS • P ackage com patible with autom atic placem ent equipm ent ■ C om pliant leads to reduce solder joint fatiguing W ß P O U H N S ■ High tem perature lead attachm ent designed to withstand reflow
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4400P
50ohms
100ppm/
250ppm/
100ppm/V
50ppm/
ipc sm 782
4420p-002
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