INTEL MARK 164997 Search Results

INTEL MARK 164997 Result Highlights (5)

Part	ECAD Model	Manufacturer	Description	Download	Buy
EN80C188XL-12		Rochester Electronics LLC	80C188XL - MPU Intel 186 CISC 16-Bit
EN80C188XL-20		Rochester Electronics LLC	80C188XL - MPU Intel 186 CISC 16-Bit
MG8097/B		Rochester Electronics LLC	8097 - Math Coprocessor - Dual marked (8506301ZA)
5490/BCA		Rochester Electronics LLC	5490 - Decade Counter - Dual marked (M38510/01307BCA)
5405/BCA		Rochester Electronics LLC	5405 - Gate - Dual marked (M38510/00108BCA)

INTEL MARK 164997 Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
intel g31 chipset motherboard Abstract: BB17 foxconn motherboard ls 36 Motherboard Foxconn LS 36 AY21 intel marking STD 164997 AC4 honeywell g31 motherboard g31 Chipset Platform Design Guide AJ33 AJ34 AJ35 AJ36 AJ37 AJ38 AJ39 AJ40 AJ41 AJ42 Text: Intel G35 Express Chipset Thermal and Mechanical Design Guidelines — For the Intel® 82G35 Graphics and Memory Controller Hub GMCH August 2007 Document Number: 317609-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR	Original	PDF	82G35 OTH97; D29081 intel g31 chipset motherboard BB17 foxconn motherboard ls 36 Motherboard Foxconn LS 36 AY21 intel marking STD 164997 AC4 honeywell g31 motherboard g31 Chipset Platform Design Guide AJ33 AJ34 AJ35 AJ36 AJ37 AJ38 AJ39 AJ40 AJ41 AJ42
foxconn g41 Abstract: g2100c888 Motherboard Foxconn LS 36 BTX 82G41 foxconn motherboard ls 36 Motherboard Foxconn LS 36 TIM-PCM45F intel g41 82Q45 3EE77-002 Text: Intel 4 Series Chipset Thermal and Mechanical Design Guidelines September 2008 Document Number: 319972-004 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT	Original	PDF	D29081 foxconn g41 g2100c888 Motherboard Foxconn LS 36 BTX 82G41 foxconn motherboard ls 36 Motherboard Foxconn LS 36 TIM-PCM45F intel g41 82Q45 3EE77-002
d9258 Abstract: d92580 Loctite 7452 82X38 AVC cool indium paste TT-T-36 5SRTC-TT-T36-72 FLUKE 79 42SN Text: Intel X38 Express Chipset Thermal and Mechanical Design Guidelines — For the Intel® 82X38 Memory Controller Hub MCH September 2007 Revision -001 Document Number: 317612-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR	Original	PDF	82X38 d9258 d92580 Loctite 7452 AVC cool indium paste TT-T-36 5SRTC-TT-T36-72 FLUKE 79 42SN
E11663-001 Abstract: Loctite 7452 honeywell pcm45 DDR2-667 DDR2-800 PCM45F FLUKE 79 intel chipset g 41 motherboard no display chipset dual core intel BGA heatsink compressive force Text: Intel 3210 and 3200 Chipset Thermal/Mechanical Design Guide November 2007 Reference Number: 318465 Revision: 001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS	Original	PDF	5M-1994 E11663-001 Loctite 7452 honeywell pcm45 DDR2-667 DDR2-800 PCM45F FLUKE 79 intel chipset g 41 motherboard no display chipset dual core intel BGA heatsink compressive force
UL1439 Abstract: intel mark 164997 intel marking 00C863501A Text: gX 58.6 47 NDTESi FULL ROUND- \ / D n s \ A X ;e e d e t a il b EE DETAIL A 1. THIS DRAWING TD BE USED IN CONJUNCTION WITH SUPPLIED 31] DATABASE FILE. ALL DIMENSIONS AND TOLERANCES ON THIS DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE AND ARE APPLICABLE AT PART FREE, UNCONSTRAINED STATE UNLESS	OCR Scan	PDF	6063-T5 UL1439 00C863501A intel mark 164997 intel marking 00C863501A
intel mark 164997 Abstract: TDP 245 Y Text: NOTES' 1. CLIP MUST STAY ATTACHED TD HEATSINK 2. CLIP SHDULD BE ABLE TD ROTATE 360 DEGREES AFTER CRIMPING PROCESS. 3. CRIMPING FEATURES SHDULD BE EQUAL DISTANCE FROM CENTERLINE DF HEATSINK. Ld I- 1 1 1 3 2 1 TDP 335C872401A 334C872401A 333C872401A 00C872401	OCR Scan	PDF	335C872401A 334C872401A 333C872401A 00C872401 PCM45F 20X20 00C872401A 334C87E401A intel mark 164997 TDP 245 Y
intel mark 164997 Abstract: PCM45F c623 marking UL1439 Text: NOTES: 1, CLIP MUST STAY ATTACHED TD HEATSINK 2. CLIP SHDULD NDT BE ABLE TD ROTATE 360 DEGREES AFTER CRIMPING PRDCESS, 3. CRIMPING FEATURES SHDULD BE EQUAL DISTANCE FRDM CENTERLINE DF HEATSINK, 4, TD LERANCEi U N LESS OTHERW ISE S P E C IF IE D Ld IC PI >m	OCR Scan	PDF	335C877001A 334C877001A 333C877001A PCM45F intel mark 164997 c623 marking UL1439