TSOP-48 pcb LAYOUT
Abstract: str 6654 pin details of str f 6654 pin details of str W 6654 amd socket 940 pinout str W 6654 land pattern tsop 66 56-Lead TSOP Package 28F002BC 28F010
Text: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions
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land pattern for TSOP 2-44
Abstract: Wells programming adapter TSOP 48 intel 44-lead psop land pattern for TSOP 56 pin F9232 E28F016SA70 tsop tray matrix outline wells 648-0482211 memory card thickness 29f200 tsop adapter
Text: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions
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pioneer PAL 007 A
Abstract: PAL 007 pioneer str 6654 PAL 008 pioneer pin details of str W 6654 sem 2106 Yamaichi Electronics ic197 648-0482211 TSOP56 jackson
Text: D Small Outline Package Guide 1999 3/25/99 4:28 PM cvrpg.doc Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions
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PAL 007 pioneer
Abstract: pioneer PAL 007 A PAL 008 pioneer sn 7600 n 648-0482211 sem 2106 Trays tsop56 TSOP 86 land pattern amd socket 940 pinout Meritec 980020-56
Text: D Small Outline Package Guide 1999 3/25/99 4:28 PM cvrpg.doc Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions
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ic 6116 datasheet from texas instruments
Abstract: intel date code marking 28f160 SMT pitch roadmap intel 6116 uBGA device MARKing intel intel 04195 intel 28f160 SMT roadmap 28f800 56 pin csp process flow diagram
Text: D Comprehensive User’s Guide for µBGA* Packages 1998 NOTE: For the most current µBGA* package related information, please refer to Intel's Website at http://www.intel.com/design/flcomp/packdata Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any
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f82c836
Abstract: F65535A F82C836B F65548A F82C735A F65550B F65545B2 F65510A T65550B F82C721
Text: Product Change Notification Change Notification #: 882 Please respond to your distributor if you have any issues with the timeline or content of this change. No response from customers will be deemed as acceptance of the change and the change will be implemented pursuant to the key milestones set forth in this attached PCN.
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intel pentium 4 motherboard schematic diagram
Abstract: pentium 4 motherboard schematic diagram intel pentium 3 motherboard schematic diagram intel MOTHERBOARD pcb CIRCUIT diagram 40 pin zif socket free circuit diagram of motherboard 423 motherboard intel schematics diagram ATX MOTHERBOARD schematic intel MOTHERBOARD pcb design in pentium 4 motherboard CIRCUIT diagram
Text: 423 Pin Socket PGA423 Design Guidelines November, 2000 Order Number: 249207-001 ® 423 Pin Socket Design Guidelines Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and
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PGA423)
IEC60
intel pentium 4 motherboard schematic diagram
pentium 4 motherboard schematic diagram
intel pentium 3 motherboard schematic diagram
intel MOTHERBOARD pcb CIRCUIT diagram
40 pin zif socket
free circuit diagram of motherboard
423 motherboard intel schematics diagram
ATX MOTHERBOARD schematic
intel MOTHERBOARD pcb design in
pentium 4 motherboard CIRCUIT diagram
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RETURN LOSS IN FAST ETHERNET
Abstract: intel date code format LXT975 LXD974A LXT974 LXT974A LXT974B LXT975A LXT975B intel DOC
Text: LXT974/975 Fast Ethernet 10/100 Quad Transceivers Specification Update March 2001 Notice: The LXT974 and LXT975 Four-Port Fast Ethernet PHY Transceivers may contain design defects or errors known as errata which may cause the product to deviate from published
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LXT974/975
LXT974
LXT975
LXT974B
LXT975B.
RETURN LOSS IN FAST ETHERNET
intel date code format
LXD974A
LXT974A
LXT975A
LXT975B
intel DOC
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b982
Abstract: b1676 b896 SP 1191 B1328 B3045 FLASH TRANSLATION LAYER FTL 5498 transistor X28F008SA-120 b3305
Text: 28F008SA 8-MBIT 1-MBIT x 8 FLASH MEMORY SmartDie Product Specification Y Y Y Y High-Density Symmetrically Blocked Architecture Sixteen 64-Kbyte Blocks Extended Cycling Capability 100K Block Erase Cycles 1 6M Block Erase Cycles per Chip Automated Byte Write and Block Erase
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28F008SA
64-Kbyte
X28F008SA-120
AP-359
AP-360
25F008SA
AP-364
b982
b1676
b896
SP 1191
B1328
B3045
FLASH TRANSLATION LAYER FTL
5498 transistor
X28F008SA-120
b3305
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B5589-01
Abstract: UCLXT312E b5589 LXT315ANE LXT312ANE PDLXT312ANE.A2 INTEL LOT NUMBER code label LXT315ANE-A2 PDLXT315ANE PDLXT315ANE.A2
Text: Intel LXT312A/LXT315A Low Power T1 PCM Repeaters/Transceivers Datasheet The LXT312A and LXT315A are integrated repeater/transceiver circuits for T1 carrier systems. The LXT312A is a dual repeater/transceiver and the LXT315A is a single repeater/transceiver.
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LXT312A/LXT315A
LXT312A
LXT315A
B5589-01
B5589-01
UCLXT312E
b5589
LXT315ANE
LXT312ANE
PDLXT312ANE.A2
INTEL LOT NUMBER code label
LXT315ANE-A2
PDLXT315ANE
PDLXT315ANE.A2
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intel 04195
Abstract: BGA package tray 40 x 40 uBGA device MARKing intel F800B3 T1234567 04195 Material Handling Systems Shipping Trays 28F008S3 28F160B3
Text: 4.0 4.1 THE µBGA* PACKAGE SHIPPING MEDIA, HANDLING, AND DEVICE MARKINGS Shipping Media Overview NOTE: Please refer to the web-based Mechanical Spec for most up to date information at: 4.2 Shipping Media 4.2.1 Tape and Reel The µBGA package shipped in Tape and Reel
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paC/85
intel 04195
BGA package tray 40 x 40
uBGA device MARKing intel
F800B3
T1234567
04195
Material Handling Systems
Shipping Trays
28F008S3
28F160B3
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B1560
Abstract: B1560 equivalent 28f020 transistor B1560 294005 B1205 b1770 b439 AP-316 AP-325
Text: 28F020 2048K 256K x 8 FLASH MEMORY SmartDie Product Specification Y Flash Electrical Chip Erase 2 Second Typical Chip Erase Y Quick-Pulse Programming Algorithm 10 ms Typical Byte Program 4 Second Chip Program Y 100K Erase Program Cycles Typical Y 12 0V g 5% VPP
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28F020
2048K
8F020
X28F020-90
ER-20
ER-24
RR-60
AP-316
B1560
B1560 equivalent
transistor B1560
294005
B1205
b1770
b439
AP-325
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ssqa
Abstract: intel QUALITY ASSURANCE MANUAL
Text: E 4 Manufacturing Quality System 4/1/98 10:30 AM CHAP4.DOC INTEL CONFIDENTIAL until publication date E CHAPTER 4 MANUFACTURING QUALITY SYSTEM INTRODUCTION With defect levels that are the lowest or among the lowest in the industry, we are proud of the product we manufacture at Intel. Continuous improvement methodologies are such an
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b998
Abstract: B83 004 1024K b1545 28F010 b83 006 b1257 b175 transistor B1545 AP-325
Text: 28F010 1024K 128K x 8 FLASH MEMORY SmartDie Product Specification Y Flash Electrical Chip Erase 1 Second Typical Chip Erase Y Quick-Pulse Programming Algorithm 10 ms Typical Byte Program 2 Second Chip Program Y 100K Erase Program Cycles Typical Y 12 0V g 5% VPP
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28F010
1024K
X28F400BX-T80
ER-20
ER-24
RR-60
b998
B83 004
1024K
b1545
b83 006
b1257
b175
transistor B1545
AP-325
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intel 28F001BXT
Abstract: SmartDie 29040 28F001BX-T AP-341 Designing an Updatable BIOS
Text: intei. 28F001BX-T/B 1M 128K x 8 CMOS FLASH MEMORY SmartDie Product Specification m High Integration Blocked Architecture — One 8 KByte Boot Block with Lock Out — Two 4 KByte Parameter Blocks — One 112 KByte Main Block — T = Top Boot, B = Bottom Boot
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28F001BX-T/B
28F001B
28F001BX-T/28F001BX-B
ER-20,
RR-60,
AP-316,
AP-341,
intel 28F001BXT
SmartDie
29040
28F001BX-T
AP-341 Designing an Updatable BIOS
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Untitled
Abstract: No abstract text available
Text: ß R lIÜ M M tf In te l 28F020 2048K 256K x 8 FLASH MEMORY SmartDie Product Specification Flash Electrical Chip Erase — 2 Second Typical Chip Erase Quick-Pulse Programming Algorithm — 10 ¡xs Typical Byte Program — 4 Second Chip Program 100K Erase/Program Cycles Typical
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28F020
2048K
X28F020-90
ER-20,
ER-24,
RR-60,
AP-316,
AP-325,
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Intel 4001
Abstract: 4001 intel rom
Text: in tj 28F400BX-T 4-MBIT 256K x 16,512K x 8 BOOT BLOCK FLASH MEMORY SmartDie Product Specification m x8/x16 Input/Output Architecture • ■ ■ ■ ■ ■ — 28F400BX-T — For High-Performance and HighIntegration 16-Bit and 32-Bit CPUs Optimized High-Density Blocked
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28F400BX-T
x8/x16
16-Bit
32-Bit
X28F010-90
28F200BX-T/B,
28F200BX-T/B
28F400BX-T/B,
28F004BX-T/B
Intel 4001
4001 intel rom
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Untitled
Abstract: No abstract text available
Text: in te l 28F010 1024K 128K x 8 FLASH MEMORY SmartDie Product Specification Flash Electrical Chip Erase — 1 Second Typical Chip Erase Quick-Pulse Programming Algorithm — 10 |as Typical Byte Program — 2 Second Chip Program 100K Erase/Program Cycles Typical
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28F010
1024K
28F400B
EFt-20,
ER-24,
RR-60,
AP-316,
AP-325,
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SmartDie
Abstract: 28F010
Text: intel PEHHLOIMOIiMIERf 28F010 1024K 128K x 8 FLASH MEMORY SmartDie Product Specification Flash Electrical Chip Erase — 1 Second Typical Chip Erase Quick-Pulse Programming Algorithm — 10 jas Typical Byte Program — 2 Second Chip Program 100K Erase/Program Cycles Typical
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28F010
1024K
ER-20,
ER-24,
RR-60,
AP-316,
AP-325,
SmartDie
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2046K
Abstract: 28F020 SmartDie 29024
Text: in t e * 28F020 2048K 256K x 8 FLASH MEMORY SmartDie Product Specification Flash Electrical Chip Erase — 2 Second Typical Chip Erase Quick-Pulse Programming Algorithm — 10 /xs Typical Byte Program — 4 Second Chip Program 100K Erase/Program Cycles Typical
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28F020
2048K
X28F020-90
ER-20,
ER-24,
RR-60,
AP-316,
AP-325,
2046K
SmartDie
29024
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ER-27
Abstract: 5498 transistor Intel Corporation esd testing flash memory SmartDie F008S
Text: in te i 28F008SA 8-MBIT 1-MBIT x 8 FLASH MEMORY SmartDie Product Specification High-Density Symmetrically Blocked Architecture — Sixteen 64-Kbyte Blocks Extended Cycling Capability — 100K Block Erase Cycles — 1.6M Block Erase Cycles per Chip Automated Byte Write and Block Erase
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28F008SA
64-Kbyte
F008S
120ns
AP-359,
AP-360,
25F008SA
AP-364,
ER-27
5498 transistor
Intel Corporation esd testing flash memory
SmartDie
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Untitled
Abstract: No abstract text available
Text: in te i • 28F001BX-T/B 1M 128K x 8 CMOS FLASH MEMORY SmartDie Product Specification • High Integration Blocked Architecture — One 8 KByte Boot Block with Lock Out — Two 4 KByte Parameter Blocks — One 112 KByte Main Block — T = Top Boot, B = Bottom Boot
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28F001BX-T/B
X28F001BX-T70
X28F001BX-B70
X28F001BX-T90
X28F001BX-B90
X28F001BX-T120
X28F001BX-B120
28F001BX-T/28F001BX-B
ER-20,
RR-60,
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Sample form for INCOMING Inspection of RAW MATERIAL
Abstract: INCOMING RAW MATERIAL INSPECTION format raw data job satisfaction INCOMING RAW MATERIAL INSPECTION report format intel traceability INCOMING RAW MATERIAL INSPECTION procedure INCOMING RAW MATERIAL INSPECTION report INTEL LOT NUMBER code label
Text: E 4 Manufacturing Quality System 11/25/96 10:50 AM CHAP4.DOC INTEL CONFIDENTIAL until publication date E CHAPTER 4 MANUFACTURING QUALITY SYSTEM INTRODUCTION With defect levels that are the lowest or among the lowest in the industry, we are proud of the product we manufacture at Intel. Continuous improvement methodologies are such an
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INTEL LOT NUMBER code label
Abstract: 80524KX266256 intel traceability code pentium II intel mark marking Zzz Mini-Cartridge 80523TX233512 80523TX266512 80524KX300256
Text: Product Change Notification Change Notification #: 747 Please respond to your distributor if you have any issues with the timeline or content of this change. No response from customers will be deemed as acceptance of the change and the change will be implemented pursuant to the key milestones set forth in this attached PCN.
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