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    INTEL 28F160 S5 Search Results

    INTEL 28F160 S5 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    952601EGLFT Renesas Electronics Corporation SPRINGDALE - CK409 clock, Intel Yellow Cover part Visit Renesas Electronics Corporation
    954101DFLFT Renesas Electronics Corporation GRANTSDALE - CK410 clock, Intel Yellow Cover part Visit Renesas Electronics Corporation
    954201BFLFT Renesas Electronics Corporation ALVISO - CK410M clock, Intel Yellow Cover part Visit Renesas Electronics Corporation
    9LPRS525AGILFT Renesas Electronics Corporation 56-pin CK505 for Intel Systems Visit Renesas Electronics Corporation
    9FGP204BKLF Renesas Electronics Corporation CK-MNG+ Peripheral Synthesizer for Intel Servers Visit Renesas Electronics Corporation

    INTEL 28F160 S5 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    intel 28f160

    Abstract: 28F320 AP-646 96hcc AP-645 28F016SA 28F016SV 28F160S3 28F160S5 28F320S3
    Text: E AP-645 APPLICATION NOTE 3 Volt and 5 Volt FlashFile Memory Migration Guide December 1998 NOTE: This document formerly known as Word-Wide FlashFile™ Memory 28F160S3, 28F320S3, 28F160S5, 28F320S5 Migration Guide. Order Number: 292203-003 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or


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    AP-645 28F160S3, 28F320S3, 28F160S5, 28F320S5) 28F016SV 16-Mbit 28F016SA intel 28f160 28F320 AP-646 96hcc AP-645 28F160S3 28F160S5 28F320S3 PDF

    96hcc

    Abstract: AP-645 intel 28f160 s5 28F160SV 28F016SA 28F016SV 28F160S3 28F160S5 28F320S3 28F320S5
    Text: E AP-645 APPLICATION NOTE Word-Wide FlashFile Memory 28F160S3, 28F320S3, 28F160S5, 28F320S5 Migration Guide December 1997 Order Number: 292203-002 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or


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    AP-645 28F160S3, 28F320S3, 28F160S5, 28F320S5) AP-393 28F016SV 28F016SA AP-375 28F008SA 96hcc AP-645 intel 28f160 s5 28F160SV 28F016SA 28F160S3 28F160S5 28F320S3 28F320S5 PDF

    EIGHT p-channel MOSFET ARRAY

    Abstract: mosfet price AP-617 28f800b5 28F320 2172 28F001BX 28F008S3 28F010 28F016
    Text: E AP-617 APPLICATION NOTE Additional Flash Data Protection Using VPP, RP#, and WP# December 1998 Order Number: 292172-002 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of


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    AP-617 28F800C3, 28F160C3, 28F320C3 28F200B5, 28F004/400B5, 28F800B5 28F004S3, 28F008S3, 28F016S3 EIGHT p-channel MOSFET ARRAY mosfet price AP-617 28f800b5 28F320 2172 28F001BX 28F008S3 28F010 28F016 PDF

    5 ball csp drawing

    Abstract: intel i5 top mark e5 intel 28f160 s5 3020 h3 28F008B3 28F008S3 28F016B3 28F016S3 28F160B3
    Text: 3.0 section will show some sample package dimensions. Please refer to the mechanical specification document on Intel’s website, or contact your Intel representative for the latest, complete package dimensions and schematics. PACKAGE PHYSICAL DIMENSIONS NOTE:


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    28F008Sckness 5 ball csp drawing intel i5 top mark e5 intel 28f160 s5 3020 h3 28F008B3 28F008S3 28F016B3 28F016S3 28F160B3 PDF

    28F016SA

    Abstract: AP-645 28F160S570 96hcc 28F016SV 28F160S3 28F160S5 28F320S5 28F016SV70 29212* intel
    Text: E AP-645 APPLICATION NOTE 28F160S3/S5 Compatibility with 28F016SA/SV June 1997 Order Number: 292203-001 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of


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    AP-645 28F160S3/S5 28F016SA/SV 56-lead 56-bump 56-lead 28F016SA AP-645 28F160S570 96hcc 28F016SV 28F160S3 28F160S5 28F320S5 28F016SV70 29212* intel PDF

    28F160

    Abstract: 28F160B3 BGA thermal resistance 6x8 intel 28f160 s5 SOP JEDEC tray A576 ubga package BOARD SOLDER REFLOW PROCESS RECOMMENDATIONS TRANSPORT MEDIA AND PACKING
    Text: The Micro Ball Grid Array µBGA* Package 15.1 15 Introduction The Micro Ball Grid Array package (µBGA*) is considered a “chip size” package (CSP). A chip size package is generally defined as a package which does not exceed the die size by greater than


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    PDF

    SDP-UNIV-48TS

    Abstract: GDP-f016-56ts sdp-6811-52b SDP-UNIV-44TQ SDP-UNIV-44PSO SDP-UNIV-44 sDP-st064-56ts 29DL640D 87C552 xc68hc11k1
    Text: Dataman-48UXP Intelligent Universal Programmer User′′s Manual Copyright Notice This document is copyrighted, 2000, 2001, 2002 by DATAMAN PROGRAMMERS LTD. All rights are reserved. DATAMAN PROGRAMMERS LTD. reserves the right to make improvements to the products described in this manual at any time without notice.


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    Dataman-48UXP Dataman-48UXP SDP-UNIV-48TS GDP-f016-56ts sdp-6811-52b SDP-UNIV-44TQ SDP-UNIV-44PSO SDP-UNIV-44 sDP-st064-56ts 29DL640D 87C552 xc68hc11k1 PDF

    28F016SA

    Abstract: 28F016SV 28F160S3 28F160S5 28F320S3
    Text: E ADVANCE INFORMATION WORD-WIDE FlashFile MEMORY FAMILY 28F160S3, 28F320S3 Includes Extended Temperature Specifications n n n n n n Two 32-Byte Write Buffers  2.7 µs per Byte Effective Programming Time Low Voltage Operation  2.7 V or 3.3 V V CC  2.7 V, 3.3 V or 5 V V PP


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    28F160S3, 28F320S3 32-Byte 64-Kbyte SC16SV 28F016SA AP-607 AP-610 28F016SA 28F016SV 28F160S3 28F160S5 28F320S3 PDF

    28F016SA

    Abstract: 28F016SV 28F160S3 28F160S5 28F320S3 TSOP 56 LAYOUT CG-041493 32MB SIMM
    Text: E ADVANCE INFORMATION WORD-WIDE FlashFile MEMORY FAMILY 28F160S3, 28F320S3 Includes Extended Temperature Specifications n n n n n n Two 32-Byte Write Buffers  2.7 µs per Byte Effective Programming Time Low Voltage Operation  2.7 V or 3.3 V V CC  2.7 V, 3.3 V or 5 V V PP


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    28F160S3, 28F320S3 32-Byte 64-Kbyte SC16SV 28F016SA AP-607 AP-610 28F016SA 28F016SV 28F160S3 28F160S5 28F320S3 TSOP 56 LAYOUT CG-041493 32MB SIMM PDF

    ic 6116 datasheet from texas instruments

    Abstract: intel date code marking 28f160 SMT pitch roadmap intel 6116 uBGA device MARKing intel intel 04195 intel 28f160 SMT roadmap 28f800 56 pin csp process flow diagram
    Text: D Comprehensive User’s Guide for µBGA* Packages 1998 NOTE: For the most current µBGA* package related information, please refer to Intel's Website at http://www.intel.com/design/flcomp/packdata Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any


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    PDF

    29060

    Abstract: DT28F320S3-110
    Text: intei ADVANCE INFORMATION WORD-WIDE FlashFile MEMORY FAMILY 28F160S3, 28F320S3 Includes Extended Temperature Specifications • Two 32-Byte Write Buffers — 2.7 |_is per Byte Effective Programming Time ■ Low Voltage Operation — 2.7 V or 3.3 V Vcc — 2.7 V , 3.3 V or 5 V V p p


    OCR Scan
    28F160S3, 28F320S3 32-Byte 64-Kbyte AP-610 28F160S5, 28F320S3, 28F320S5 29060 DT28F320S3-110 PDF

    Untitled

    Abstract: No abstract text available
    Text: WORD-WIDE FlashFile MEMORY FAMILY 28F160S3, 28F320S3 Includes Extended Temperature Specifications • Two 32-Byte Write Buffers — 2.7 us per Byte Effective Programming Time ■ Low Voltage Operation — 2.7 V or 3.3 V Vcc — 2.7 V , 3.3 V or 5 V V p p


    OCR Scan
    28F160S3, 28F320S3 32-Byte 64-Kbyte 00Filem AP-610 28F160S5, 28F320S3, PDF