Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    INCOMING INSPECTION SOLDER PASTE Search Results

    INCOMING INSPECTION SOLDER PASTE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CN-AC3MMDZBAU Amphenol Cables on Demand 3-Pin XLR Male Panel Mount Connector - Amphenol AC3MMDZB-AU - Solder Type (Black + Gold Contacts) Datasheet
    CN-DSUB50PIN0-000 Amphenol Cables on Demand Amphenol CN-DSUB50PIN0-000 D-Subminiature (DB50 Male D-Sub) Connector, 50-Position Pin Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD62PN-000 Amphenol Cables on Demand Amphenol CN-DSUBHD62PN-000 High-Density D-Subminiature (HD62 Male D-Sub) Connector, 62-Position Pin Contacts, Solder-Cup Terminals Datasheet
    CN-DSUB25SKT0-000 Amphenol Cables on Demand Amphenol CN-DSUB25SKT0-000 D-Subminiature (DB25 Female D-Sub) Connector, 25-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD26SK-000 Amphenol Cables on Demand Amphenol CN-DSUBHD26SK-000 High-Density D-Subminiature (HD26 Female D-Sub) Connector, 26-Position Socket Contacts, Solder-Cup Terminals Datasheet

    INCOMING INSPECTION SOLDER PASTE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    INCOMING RAW MATERIAL INSPECTION procedure

    Abstract: 5962-8867001LA MIL-STD-883 Method 2010 Mil-Std-883 Wire Bond Pull Method 2011 Sample form for INCOMING Inspection of RAW MATERIAL CY7C122 PALC22V10 plate INCOMING RAW MATERIAL INSPECTION procedure outgoing raw material inspection procedure visual inspection of raw materials
    Text: fax id: 8509 Quality, Reliability, and Process Flows Quality, Reliability, and Process Flows Corporate Views on Quality and Reliability Product Testing Categories Cypress believes in product excellence. Excellence can only be defined by how the users perceive both our product quality


    Original     		PDF

    5962-8867001LA cypress

    Abstract: INCOMING RAW MATERIAL INSPECTION procedure PALC22V10-25PI 5962-8867001LA Mil-Std-883 Wire Bond Pull Method 2011 cypress part marking CY7C122 PALC22V10 visual inspection of raw materials MIL-STD-883 Method 2010
    Text: Quality, Reliability, and Process Flows Corporate Views on Quality and Reliability Product Testing Categories Cypress believes in product excellence. Excellence can only be defined by how the users perceive both our product quality and reliability. If you, the user, are not satisfied with every


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: THE NEW VALUE FRONTIER Date : March 19, 2014 M Messrs. I t Integrated t d Tracking T ki Technologies T h l i < Comparison Data > Model ：KT3225R vs. KT3225K KYOCERA Crystal Device Corporation Oscillator Division O ill t Engineering Oscillator E i i Department


    Original     		PDF KT3225R KT3225K TKY1D-C3-14094-00 KT3225K 25deg 100Hz 10KHz 100KHz

    visual inspection of raw materials

    Abstract: cutting paste INCOMING INSPECTION solder paste
    Text: Quality Assurance 1 Manufacturing process and quality assurance of chip capacitors Process control Production steps Quality assurance Raw materials QG 1. Viscosity, 2. Density Slurry preparation 1. Sheet thickness, 2. Extrusion rate, 3. Air permeability, 4. Slurry temperature, 5. Dryness


    Original     		PDF

    CC0805 yageo

    Abstract: Yageo CC0402 Yageo CC1210 CC1812 x7r yageo footprint dimension of MLCC capacitor 2220 CC0603 yageo INCOMING INSPECTION solder paste Yageo CC0805 CC1210 Yageo 470 PF 5 100V 0805 YAGEO
    Text: YAGEO CORPORATION 1. SUBJECT: This specification applies on the chip capacitor made by Yageo Corporation. 2. PART NUMBER: Part number of the chip capacitor is identified by the size, tolerance, packing, material and capacitor value. Example: CC 0805 K K X7R


    Original     		PDF

    LT1D90A

    Abstract: S-10
    Text: PREPARED BY: %JU APPROVED BY: DATE: “$J /J/&J b+ DATE: sHARp.-:; DG-001006 ,_ 13 pages y=g Jan/WOO ELECTRONIC COMPONENTS GROUP SHARP CORPORATION SPECIFICATION RE&-T.ATIVE DIVISIGN: ,. . ‘“\, _ Opto-ElectronicDevices &ision ‘.\ j., ;: 1 ,‘. .


    Original     		PDF DG-001006 40kI-I~ LT1D90A, LT1D90A S-10

    understanding vishay date codes

    Abstract: vishay sprague Sprague sprague date code ORANGE DROP SPRAGUE sprague capacitor vishay capacitor marking CAPACITOR SPRAGUE EIA-535BAAC defect ppm
    Text: Total Quality Commitment Vishay Sprague Tantalum Capacitors ’’We are dedicated to partnership with our customers.assuring continuously improved quality of the products and services we offer." About the manufacture of tantalum capacitors at Vishay Sprague.


    Original     		PDF 535BAAC. CWR06 CWR11 MIL-C-55365. EIA-481 21-Jul-06 understanding vishay date codes vishay sprague Sprague sprague date code ORANGE DROP SPRAGUE sprague capacitor vishay capacitor marking CAPACITOR SPRAGUE EIA-535BAAC defect ppm

    ZE40

    Abstract: No abstract text available
    Text: A- PREPARED BY: DATE: APPROVED BY: DATE: B /‘YY Jd t SPEC.No: ELECTRONIC COMPONENTS GROUP SHARP CORPORATION SPECIFICATION DG-996011 REPRESENTATIVE 1 DIVISION: Opto-Electronic Devices Division Y / DEVICE SPECIFICATION FOR . Light Emitting Diode MODEL No.


    Original     		PDF DG-996011 ZE40

    Untitled

    Abstract: No abstract text available
    Text: GP2W0001YP IrDA Data Sheet FEATURES • Built-in Photodiode • Operating voltage 2.7 V to 5.5 V • In circuit design, allow for the degradation of light emitting diode output that results from long continuous operation 50% degradation/5 years . • This product shall not contain the following materials, and these materials shall not be used in the production process for this product.


    Original     		PDF GP2W0001YP SMA00011

    GP2W0001YP

    Abstract: No abstract text available
    Text: GP2W0001YP IrDA Data Sheet FEATURES • Built-in Photodiode • Operating voltage 2.7 V to 5.5 V • In circuit design, allow for the degradation of light emitting diode output that results from long continuous operation 50% degradation/5 years . • This product shall not contain the following materials, and these materials shall not be used in the production process for this product.


    Original     		PDF GP2W0001YP SMA00011 GP2W0001YP

    ACTEL CCGA 624 mechanical

    Abstract: CCGA ACTEL CCGA 1152 mechanical CG1152 pogo pin cleaning CGS624 a440 ceramic actel package mechanical drawing RTAX2000 90Pb 10Sn solder paste
    Text: Application Note AC190 Ceramic Column Grid Array Introduction Ceramic Column Grid Array CCGA packages are becoming increasingly popular as an alternative to Ceramic Ball Grid Array (CBGA) packages for applications requiring very high-density interconnections


    Original     		PDF AC190 624-pin CG624) CG1152) 1272-pin ACTEL CCGA 624 mechanical CCGA ACTEL CCGA 1152 mechanical CG1152 pogo pin cleaning CGS624 a440 ceramic actel package mechanical drawing RTAX2000 90Pb 10Sn solder paste

    INCOMING RAW MATERIAL INSPECTION procedure

    Abstract: receiving inspection procedure INCOMING MATERIAL INSPECTION procedure INCOMING RAW MATERIAL INSPECTION report RAW MATERIAL INSPECTION instruction RAW MATERIAL INSPECTION procedure INCOMING RAW MATERIAL specification outgoing raw material inspection procedure INCOMING RAW MATERIAL INSPECTION reference sample for incoming quality control
    Text: QUALITY ASSURANCE SYSTEM 1. Policy on the Quality “Contributing to the prosperity of society with much pride through the creation of innovation and unique products for every sector”, this is the goal we strive to fulfill. And “Our company provides product and services with high quality which satisfy our


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: BY: PREPARED .-_ -.-. !r-., - SPEC.No. .- _ *’ DATE: hat-/ /W% SW\ I 8. t3&cMrw APPROVED BY: ry/Bty”/“y; 7 ‘$f .‘I ISSUE il . ._ -,@E- ELECTRONIC COMPONENTS GROUP SHARP CORPORATION ~ Nov/iOi%l * . _. ,’ 15 pa& -!’ ;.?;: REkESE~i%T=WEJX@IO+


    Original     		PDF DG989001 1ZR95A

    SMD CODE 9Z

    Abstract: 80C251 PLCC44 J-STD-20 SMD CODE 9T Smd parts identification 14x14x1.4mm PLCC18 Temic PART DATE CODE moisture sensitive handling and packaging temic ulc products
    Text: Information about SMD Plastic Packages Prepared by: Elisabeth Lamarti Pierre Houzé Quality Department SMD Packaging Contents 1. INTRODUCTION -2 2. GENERALITIES -2


    Original     		PDF 300mm SMD CODE 9Z 80C251 PLCC44 J-STD-20 SMD CODE 9T Smd parts identification 14x14x1.4mm PLCC18 Temic PART DATE CODE moisture sensitive handling and packaging temic ulc products

    PRF38534

    Abstract: MIL-PRF-38534 d452 TRANSISTOR equivalent d331 TRANSISTOR equivalent EQUIVALENT transistor D446 d472 TRANSISTOR equivalent D471 TRANSISTOR equivalent EQUIVALENT transistor D446 SMD transistor D613 equivalent transistor D331 circuit diagram application
    Text: INCH-POUND This document and process conversion measures necessary to comply with this revision shall be completed by 13 March 2011 MIL-PRF-38534H 13 September 2010 SUPERSEDING MIL-PRF-38534G 9 March 2009 PERFORMANCE SPECIFICATION HYBRID MICROCIRCUITS, GENERAL SPECIFICATION FOR


    Original     		PDF MIL-PRF-38534H MIL-PRF-38534G 38534H PRF38534 MIL-PRF-38534 d452 TRANSISTOR equivalent d331 TRANSISTOR equivalent EQUIVALENT transistor D446 d472 TRANSISTOR equivalent D471 TRANSISTOR equivalent EQUIVALENT transistor D446 SMD transistor D613 equivalent transistor D331 circuit diagram application

    INCOMING RAW MATERIAL INSPECTION procedure

    Abstract: INCOMING RAW MATERIAL INSPECTION RAW MATERIAL INSPECTION procedure RAW MATERIAL INSPECTION instruction INCOMING RAW MATERIAL INSPECTION method receiving inspection procedure outgoing raw material inspection procedure INCOMING IC INSPECTION INCOMING RAW MATERIAL INSPECTION report quality assurance for semiconductor devices
    Text: QUALITY ASSURANCE SYSTEM 1. Policy on the Quality “Contributing to the prosperity of society with much pride through the creation of innovation and unique products for every sector”, this is the goal we strive to fulfill. And “We, New Japan Radio Co., Ltd., continually creativity to improve our business


    Original     		PDF

    MIL-M-55565

    Abstract: 60024 apex PA02 Transistors smd mark code 883U MIL-PRF-38534 PA02M
    Text: M and /883 SCREENING PROGRAM M I C R O T E C H N O L O G Y HTTP://WWW.APEXMICROTECH.COM 800 546-APEX (800) 546-2739 DESCRIPTION 1.4 PERFORMANCE SPECIFICATIONS These Apex Microtechnology power hybrids have been screened to MIL-PRF-38534, Class H and manufactured in a DESC Certified


    Original     		PDF 546-APEX MIL-PRF-38534, MIL-STD-883, MIL-M-55565 /883U MIL-M-55565 60024 apex PA02 Transistors smd mark code 883U MIL-PRF-38534 PA02M

    Nihon handa rx303-92skho

    Abstract: RX303-92SKHO VMMK-125 0402 land pattern INCOMING INSPECTION solder paste recommended land pattern for 0402 cap WLCSP stencil design VMMK-1225 AV02-1078EN land pattern for WLCSP
    Text: VMMK-1225 production assembly process Application Note 5378 Description Package Features Avago Technologies has combined our industry leading EpHEMT technology with a revolutionary wafer level chip scale package design WLCSP . This wafer level chip scale


    Original     		PDF VMMK-1225 VMMK-125 AV02-1078EN Nihon handa rx303-92skho RX303-92SKHO 0402 land pattern INCOMING INSPECTION solder paste recommended land pattern for 0402 cap WLCSP stencil design land pattern for WLCSP

    MODEL550

    Abstract: LT1E90A
    Text: DG-001019 PREPARED BY: SHAR!FW$~~~~~;~., APPROVED BY: ELECTRONIC COMPONENTS GROUP SHARP CORPORATION SPECIFICATION Jan/19/00 ‘. . 13 pages .: ‘-*+E’~SE~~T~ DMSION: .\.\” ;r y ,o’:.>.r.b\, optbE~~~~~c~e\i~ion -.,b? :;” !,f&%\ \ DEVICE SPECIFICATION


    Original     		PDF DG-001019 Jan/19/00 LT1E90A, MODEL550 LT1E90A

    ISO-2859-1

    Abstract: ultrasonic flaw detector PT200MC0NP 40KHZ ULTRASONIC Power
    Text: — - - _ SHARP Mm m l S P E C . N o. DG 018025B IS S U E j u n /2 i/0 2 COMPOUND SEMICONDUCTOR DIVISION ELECTRONIC COMPONENTS GROUP SHARP CORPORATION SPECIFICATION DEVICE SPECIFICATION FOR P h oto T ransistor MODEL No. PT200MC0NP CUSTOMERS’ APPROVAL PRESENTED


    OCR Scan     		PDF DG018025B Jun/21/02 PT200MC0NP 40kHz, ISO-2859-1 ultrasonic flaw detector PT200MC0NP 40KHZ ULTRASONIC Power

    ISO-2859-1

    Abstract: PT202MR0MP1 EIAJ C-3
    Text: SPEC. No. SH AR P ISSUE DG036004A Oct/28/03 CONPOUND SEMICONDUCTOR DIVISION ELECTRONIC COMPONENTS GROUP SHARP CORPORATION TECHNICAL LITERATURE DEVICE TECHNICAL LITERATURE FOR Photo Transistor MODEL No. PT202MR0MP1 * The technical literature is subject to be changed without notice *


    OCR Scan     		PDF DG036004A Oct/28/03 PT202MR0MP1 DG036004A 40kHz, ISO-2859-1 PT202MR0MP1 EIAJ C-3

    rf sealer circuit

    Abstract: C0806 GM1BC55250AC
    Text: SPEC. No. SH ARP ISSUE DG-021010 Jan-29-02 COMPOUND SEMICONDUCTOR DIVISION ELECTRONIC COMPONENTS GROUP SHARP CORPORATION SPECIFICATION DEVICE SPECIFICATION FOR Light Emitting Diode MODEL No. „ GM1BC55250AC CUSTOMERS' APPROVAL PRESENTED Date_ _


    OCR Scan     		PDF GM1BC55250AC DG-021010 Jan-29-02 DG-021010 40kHz, rf sealer circuit C0806 GM1BC55250AC

    IR sensor for 40khz

    Abstract: 200a liu GM5WT95200A
    Text: tfil'Hi I ? I''*. I : .* I I !• [• I- ^ I U:, ri I No. SHARP CORPORATION M : T' I F\ 0 1 I 1 DG-991015 . -—• \ DATE 28-Jan-99 1. These Techincal literature include materials protected under the copyright of Sharp Corporation "Sharp" . Please do not reproduce or cause anyone to reproduce them without Sharp's consent.


    OCR Scan     		PDF DG-991015 GM5WT95200Ã 28-Jan-99 40KHz, IR sensor for 40khz 200a liu GM5WT95200A

    induction cooker coil design

    Abstract: HD44102CH* application
    Text: R eliability and Q u a lity A ssu ran ce 1. VIEWS ON QUALITY AND RELIABILITY Basic views on quality in Hitachi are to meet individual user's purchase purpose and quality required, and to be at the satisfied quality level con­ sidering general marketability.


    OCR Scan     		PDF