IGC89T170S8RM Search Results
IGC89T170S8RM Price and Stock
Infineon Technologies AG IGC89T170S8RMX1SA1- Gel-pak, waffle pack, wafer, diced wafer on film (Alt: IGC89T170S8RMX1SA1) |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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IGC89T170S8RMX1SA1 | Waffle Pack | 111 Weeks | 2,655 |
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IGC89T170S8RMX1SA1 | 71 Weeks | 1 |
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IGC89T170S8RM Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
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Contextual Info: IGC89T170S8RM IGBT3 Power Chip Features: • 1700V Trench + Field stop technology low switching losses soft turn off positive temperature coefficient easy paralleling This chip is used for: power modules C Applications: drives G Chip Type |
Original |
IGC89T170S8RM L7773O, L7773T, L7773E, | |
IGC89T170S8RMContextual Info: IGC89T170S8RM IGBT3 Power Chip Features: • 1700V Trench + Field stop technology • low switching losses • soft turn off • positive temperature coefficient • easy paralleling This chip is used for: • power modules C Applications: • drives G Chip Type |
Original |
IGC89T170S8RM L7773O, IGC89T170S8RM |