IGC189T120T8RL Search Results
IGC189T120T8RL Price and Stock
Infineon Technologies AG IGC189T120T8RLX1SA1IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: IGC189T120T8RLX1SA1) |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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IGC189T120T8RLX1SA1 | Waffle Pack | 20 Weeks | 1,125 |
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IGC189T120T8RLX1SA1 | 21 Weeks | 1 |
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IGC189T120T8RL Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
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Contextual Info: IGC189T120T8RL IGBT4 Low Power Chip Features: • 1200V Trench & Field stop technology low switching losses positive temperature coefficient easy paralleling Qualified according to JEDEC for target applications Recommended for: low / medium power modules |
Original |
IGC189T120T8RL L7703V, L7703P, | |
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Contextual Info: IGC189T120T8RL IGBT4 Low Power Chip Features: • 1200V Trench & Field stop technology low switching losses positive temperature coefficient easy paralleling Qualified according to JEDEC for target applications Recommended for: low / medium power modules |
Original |
IGC189T120T8RL L7703V, L7703P, | |
FS200R12PT4
Abstract: L7703V
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Original |
IGC189T120T8RL L7703V, L7703P, FS200R12PT4 L7703V |