Untitled
Abstract: No abstract text available
Text: 128Mb Synchronous DRAM based on 2M x 4Bank x16 I/O Document Title 4Bank x 2M x 16bits Synchronous DRAM Revision History Revision No. History Draft Date 1.0 First Version Release Dec. 2004 1.1 1. Corrected PIN ASSIGNMENT A12 to NC Jan. 2005 1.2 1. Changed IDD3P and IDD3PS 3mA to 5mA
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128Mb
16bits
-40oC
128Mbit
8Mx16bit)
HY57V281620E
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Untitled
Abstract: No abstract text available
Text: 128Mx64 bits Unbuffered DDR SO-DIMM HYMD512M646B L F8-J/M/K/H/L Document Title 128Mx64 bits Unbuffered DDR SO-DIMM Revision History No. History Draft Date 0.1 Initial Draft Jan. 2004 0.2 IDD3P Value Adjusted from 216 to 192 [mA] at Page 9 Apr. 2004 Remark
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128Mx64
HYMD512M646B
200-pin
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HY57V281620ELT
Abstract: HY57V281620ET
Text: 128Mb Synchronous DRAM based on 2M x 4Bank x16 I/O Document Title 4Bank x 2M x 16bits Synchronous DRAM Revision History Revision No. History Draft Date 1.0 First Version Release Dec. 2004 1.1 1. Corrected PIN ASSIGNMENT A12 to NC Jan. 2005 1.2 1. Changed IDD3P and IDD3PS 3mA to 5mA
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128Mb
16bits
-40oC
128Mbit
8Mx16bit)
HY57V281arge
HY57V281620E
400mil
HY57V281620ELT
HY57V281620ET
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DDR200
Abstract: DDR266 DDR266A DDR266B DDR333
Text: 128Mx64 bits Unbuffered DDR SO-DIMM HYMD512M646B L F8-J/M/K/H/L Document Title 128Mx64 bits Unbuffered DDR SO-DIMM Revision History No. History Draft Date 0.1 Initial Draft Jan. 2004 0.2 IDD3P Value Adjusted from 216 to 192 [mA] at Page 9 Apr. 2004 0.3 Reflected a “notational” change in module thickness on page 17 - Not Real ! -
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128Mx64
HYMD512M646B
DDR200
DDR266
DDR266A
DDR266B
DDR333
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K4H560838D-TCC4
Abstract: K4H560838D-TCCC DDR333 DDR400 K4H561638D-TCC4 K4H561638D-TCCC
Text: DDR SDRAM 256Mb D-die x8, x16 DDR SDRAM 256Mb D-die DDR400 SDRAM Specification Revision 1.1 Rev. 1.1 Feb. 2003 DDR SDRAM 256Mb D-die (x8, x16) DDR SDRAM 256Mb D-die Revision History Revison 0.0 (June. 2002) 1. First release Revison 0.1 (Aug. 2002) - Changed IDD3P value from 40mA to 55m
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256Mb
DDR400
200MHz
400Mbps
K4H560838D-TCC4
K4H560838D-TCCC
DDR333
K4H561638D-TCC4
K4H561638D-TCCC
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hy57v281620etp
Abstract: 35A11 HY57V281620ELT HY57V281620ET
Text: 128Mb Synchronous DRAM based on 2M x 4Bank x16 I/O Document Title 4Bank x 2M x 16bits Synchronous DRAM Revision History Revision No. History Draft Date 1.0 First Version Release Dec. 2004 1.1 1. Corrected PIN ASSIGNMENT A12 to NC Jan. 2005 1.2 1. Changed IDD3P and IDD3PS 3mA to 5mA
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128Mb
16bits
-40oC
500uA
128Mbit
8Mx16bit)
HY57V281620E
400mil
54pin
hy57v281620etp
35A11
HY57V281620ELT
HY57V281620ET
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Untitled
Abstract: No abstract text available
Text: DDR SDRAM 256Mb D-die x8, x16 DDR SDRAM 256Mb D-die DDR400 SDRAM Specification Revision 1.0 Rev. 1.0 Feb. 2003 DDR SDRAM 256Mb D-die (x8, x16) DDR SDRAM 256Mb D-die Revision History Revison 0.0 (June. 2002) 1. First release Revison 0.1 (Aug. 2002) - Changed IDD3P value from 40mA to 55m
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256Mb
DDR400
200MHz
400Mbps
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Untitled
Abstract: No abstract text available
Text: 240PIN DDR2 667 Unbuffered DIMM 1GB With 64Mx8 CL5 TS128MLQ64V6J Description Placement The TS128MLQ64V6J is a 128M x 64bits DDR2-667 Unbuffered DIMM. The TS128MLQ64V6J consists of 16pcs 64Mx8bits DDR2 SDRAMs in 60 ball FBGA packages and a 2048 bits serial EEPROM on a 240-pin
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240PIN
64Mx8
TS128MLQ64V6J
TS128MLQ64V6J
64bits
DDR2-667
16pcs
64Mx8bits
240-pin
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Untitled
Abstract: No abstract text available
Text: 240PIN DDR2 533 Registered DIMM 1024MB With 64Mx8 CL4 TS128MQR72V5J Placement Description The TS128MQR72V5J is a 128M x 72bits DDR2-533 Registered DIMM. The TS128MQR72V5J consists of 18 pcs 64Mx8 bits DDR2 SDRAMs in 60 ball FBGA package, 2 pcs register in 96 ball uBGA package, 1 pcs
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240PIN
1024MB
64Mx8
TS128MQR72V5J
TS128MQR72V5J
72bits
DDR2-533
240-pin
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Untitled
Abstract: No abstract text available
Text: 200PIN DDR2 400 SO-DIMM 256MB With 32Mx16 CL3 TS32MSQ64V4M Description Placement The TS32MSQ64V4M is a 32M x 64bits DDR2-400 SO-DIMM. The TS32MSQ64V4M consists of 4pcs 32Mx16its DDR2 SDRAMs in 84 ball FBGA packages and a 2048 bits serial EEPROM on a 200-pin printed
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200PIN
256MB
32Mx16
TS32MSQ64V4M
TS32MSQ64V4M
64bits
DDR2-400
32Mx16its
200-pin
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Untitled
Abstract: No abstract text available
Text: 214PIN DDR2 533 Micro-DIMM 256MB With 32Mx16 CL4 TS32MMQ64V5M Description Placement The TS32MMQ64V5M is a 32M x 64bits DDR2-533 J Micro-DIMM. The TS32MMQ64V5M consists of 4pcs 32Mx16bits DDR2 SDRAMs in 84 ball FBGA packages and a 2048 bits serial EEPROM on printed circuit board
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214PIN
256MB
32Mx16
TS32MMQ64V5M
TS32MMQ64V5M
64bits
DDR2-533
32Mx16bits
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Untitled
Abstract: No abstract text available
Text: 240PIN DDR2 800 Unbuffered DIMM 512MB With 64Mx8 CL5 TS64MLQ64V8J Description Placement The TS64MLQ64V8J is a 64M x 64bits DDR2-800 Unbuffered DIMM. The TS64MLQ64V8J consists of 8 pcs 64Mx8bits DDR2 SDRAMs in 60 ball FBGA packages and a 2048 bits serial EEPROM on a 240-pin printed
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240PIN
512MB
64Mx8
TS64MLQ64V8J
TS64MLQ64V8J
64bits
DDR2-800
64Mx8bits
240-pin
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Untitled
Abstract: No abstract text available
Text: 184PIN DDR333 Unbuffered DIMM 1024MB With 64Mx8 CL2.5 TS128MLD64V3J Description Placement The TS128MLD64V3J is a 64Mx64bits Double Data Rate SDRAM high-density Module for DDR333. The TS128MLD64V3J consists of 16pcs CMOS 64Mx8 bits Double Data Rate SDRAMs in 66 pin TSOP-II 400mil
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184PIN
DDR333
1024MB
64Mx8
TS128MLD64V3J
TS128MLD64V3J
64Mx64bits
DDR333.
16pcs
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Untitled
Abstract: No abstract text available
Text: 240PIN DDR2 800 Unbuffered DIMM 1GB With 64Mx8 CL5 TS128MLQ64V8J Description Placement The TS128MLQ64V8J is a 128M x 64bits DDR2-800 Unbuffered DIMM. The TS128MLQ64V8J consists of 16pcs 64Mx8bits DDR2 SDRAMs in 60 ball FBGA packages and a 2048 bits serial EEPROM on a 240-pin
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240PIN
64Mx8
TS128MLQ64V8J
TS128MLQ64V8J
64bits
DDR2-800
16pcs
64Mx8bits
240-pin
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SM81600E
Abstract: IS42SM16800E IS42SM81600E IS42SM16800E-7TLI IS42SM32400E IS42SM32400E-7T IS42SM16800E-7BLI
Text: IS42SM81600E / IS42SM16800E / IS42SM32400E IS42RM81600E / IS42RM16800E / IS42RM32400E 16Mx8, 8Mx16, 4Mx32 128Mb Mobile Synchronous DRAM APRIL 2011 DESCRIPTION FEATURES • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access and precharge
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IS42SM81600E
IS42SM16800E
IS42SM32400E
IS42RM81600E
IS42RM16800E
IS42RM32400E
16Mx8,
8Mx16,
4Mx32
128Mb
SM81600E
IS42SM16800E-7TLI
IS42SM32400E-7T
IS42SM16800E-7BLI
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IS43DR81280B
Abstract: IS46DR16640B IS43DR16640B-25DBL IS46DR16640B-3DBLA IS43DR16640B IS43DR16640B-3DBL
Text: IS43/46DR81280B/L, IS43/46DR16640B/L PRELMINARY INFORMATION AUGUST 2012 1Gb x8, x16 DDR2 SDRAM FEATURES • Clock frequency up to 400MHz 8 internal banks for concurrent operation
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IS43/46DR81280B/L,
IS43/46DR16640B/L
400MHz
cycles/64
60ball
60-ball
IS43DR81280B
IS46DR16640B
IS43DR16640B-25DBL
IS46DR16640B-3DBLA
IS43DR16640B
IS43DR16640B-3DBL
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CMS3216LAF
Abstract: CMS3216LAG CMS3216LAH
Text: CMS3216LAx-75xx 32M 2Mx16 Low Power SDRAM Revision 0.2 January, 2007 Rev0.2, Jan. 2007 CMS3216LAx-75xx Document Title 32M(2Mx16) Low Power SDRAM Revision History Revision No. History Draft date Remark 0.0 Initial Draft Mar.3rd, 2005 Preliminary 0.1 Add H(Pb-Free & Halogen Free) descriptions
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CMS3216LAx-75xx
2Mx16)
CMS3216LAF
CMS3216LAG
CMS3216LAH
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Untitled
Abstract: No abstract text available
Text: CMS4A16LAx–75Ex 128M 8Mx16 Low Power SDRAM Revision 0.5 May. 2007 Rev. 0.5, May. ‘07 CMS4A16LAx–75Ex Document Title 128M(8Mx16) Low Power SDRAM Revision History Revision No. History Draft date Remark Preliminary 0.0 Initial Draft Apr.25th, 2005 0.1
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CMS4A16LAx
8Mx16)
160ns
350uA
400uA
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W9825G6JH
Abstract: A-04 w9825g6jh-6l w9825g6jh-6
Text: W9825G6JH 4 M 4 BANKS 16 BITS SDRAM Table of Contents1. GENERAL DESCRIPTION . 3 2. FEATURES . 3
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W9825G6JH
A-04
w9825g6jh-6l
w9825g6jh-6
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Untitled
Abstract: No abstract text available
Text: Rev. 1.21. Apr. 2012 M474B5173BH0 M474B1G73BH0 204pin Unbuffered ECC SODIMM based on 4Gb B-die 78FBGA with Lead-Free & Halogen-Free RoHS compliant datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE.
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M474B5173BH0
M474B1G73BH0
204pin
78FBGA
K4B4G0846B
512Mbx8
1Gx72
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W9425G6JH
Abstract: No abstract text available
Text: W9425G6JH 4 M 4 BANKS 16 BITS DDR SDRAM Table of Contents1. GENERAL DESCRIPTION . 4 2. FEATURES . 4
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W9425G6JH
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Untitled
Abstract: No abstract text available
Text: 4GB x72, ECC, DR 240-Pin 1.35V DDR3L VLP RDIMM Features 1.35V DDR3L SDRAM VLP RDIMM MT18KDF51272PDZ – 4GB Features Figure 1: 240-Pin RDIMM (MO-269 R/C L) • DDR3L functionality and operations supported as defined in the component data sheet • 240-pin, very low profile, 18.75mm, registered dual
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240-Pin
MT18KDF51272PDZ
240-pin,
PC3-12800,
PC3-10600,
PC3-8500,
PC3-6400
09005aef83aa70c0
kdf18c512x72pdz
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Untitled
Abstract: No abstract text available
Text: 8GB x72, ECC, SR 240-Pin DDR3 RDIMM Features DDR3 SDRAM RDIMM MT18JSF1G72PZ – 8GB Features Figure 1: 240-Pin RDIMM (MO-269 R/C C2) • DDR3 functionality and operations supported as per the component data sheet • 240-pin, registered dual in-line memory module
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240-Pin
MT18JSF1G72PZ
240-pin,
PC3-14900,
PC3-12800,
PC3-10600,
PC3-8500,
PC3-6400
09005aef84854d35
jsf18c1gx72pz
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Untitled
Abstract: No abstract text available
Text: M2S1G64CBH4B5P / M2S2G64CB88B5N / M2S4G64CB8HB5N 1GB: 128M x 64 / 2GB: 256M x 64 / 4GB: 512M x 64 PC3-8500 / PC3-10600 / PC3-12800 Unbuffered DDR3 SO-DIMM Based on DDR3-1066/1333/1600 128Mx16 1GB / 256Mx8 (2GB) / 256Mx8 (4GB) SDRAM B-Die Features •Performance:
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M2S1G64CBH4B5P
M2S2G64CB88B5N
M2S4G64CB8HB5N
PC3-8500
PC3-10600
PC3-12800
DDR3-1066/1333/1600
128Mx16
256Mx8
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