HY 4.4 Search Results

Contextual Info: D a ta S h e e t , V0 . 8 , A u g . 2 0 0 3 HY S6 4T320 00GDL 2 56 M B y t e HY S6 4T640 20GDL ( 5 12 M B y t e) D DR 2 S m a l l O ut li ne D I M M M o du le s Mem ory P ro duc ts N e v e r s t o p t h i n k i n g . HYS64T32000GDL HYS64T64020GDL Preliminary Datasheet Rev. 0.8 (08.03)

CNS4785

Contextual Info: MICRO SPEAKER MODEL 40CS08P - 50ND1 Hy-Q International 4.4±0.2 Ø40.0±0.2 ALLOW AT LEAST 0.5 FOR DIAPHRAGM MOVEMENT 0.6±0.2 BAFFLE OPENING Ø37.0 1.5±0.2 2.3±0.2 Distance of Loudspeaker to Microphone:- 10cm 0.1 Watt 100 dB SPL 2.83 Volts 90 80 70 60 50

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TSSOP8 package SOT505-2 Hx Gx P2 0.125 Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land

RF-WNMP30DS-EG-HY

Contextual Info: SPECIFICATIONS FOR REFOND SURFACE MOUNT LED Model: RF-WNMP30DS-EG-HY Company Name: Confirmed By Customer: DATE: Feature ◆ ◆ ◆ ◆ Viewing angle:120 deg The materials of the LED dice is InGaN 3.50mmx2.80mm×1.90mm SMT-LED RoHS compliant lead-free soldering compatible

Contextual Info: PC board footprint NXP Semiconductors Footprint information for reflow soldering of TFBGA56 package SOT911-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: PC board footprint NXP Semiconductors Footprint information for reflow soldering of LFBGA49 package SOT1075-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: PC board footprint NXP Semiconductors Footprint information for reflow soldering of VFBGA48 package SOT1063-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: PC board footprint NXP Semiconductors Footprint information for reflow soldering of TFBGA54 package SOT1065-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

3.6864MHz

Abstract: 4.433619 crystal 7.3728MHz 4.608MHZ 10.245MHz crystal 24.576MHZ QC49/CRYSTAL 92.16MHZ 16.000M CRYSTAL 92.16MHZ 16.384MHZ
Contextual Info: MICROPROCESSOR CRYSTAL QC49/S QC59/S Hy-Q International QC49/S QC59/S 3.9 MAX. 3.9 MAX. 12.7±0.2 12.7±0.2 Ø0.50±0.05 TYP. Ø0.50±0.05 TYP. 11.1±0.2 11.1±0.2 4.7±0.2 4.7±0.2 SPECIFICATIONS 1.00 MHz to 200 MHz Refer note 1. NOMINAL FREQUENCY ±50ppm

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of HVSON16 package SOT1308-1 Gx D 0.105 P C SPx nSPx Hy SPy tot SPy Gy SLy nSPy By Ay SPx tot SLx Generic footprint pattern Refer to the package outline drawing for actual layout solder land

hy-q

Abstract: OSC 50.000MHZ CO21
Contextual Info: SURFACE MOUNT CRYSTALS QSMC - 2810, QSMC - 2820 Hy-Q International QSMC - 2810 1.6 4.0 0.8 2.0 1.3 1.3 1.3 2.5 0.4 0.7 1.3 Ceramic Ceramic Suggested Pad Layout Top View QSMC - 2820 1.6 0.7 4.0 2.0 1.3 1.3 1.3 0.4 0.7 2.5 1.3 Metal Suggested Pad Layout Ceramic

74573 buffer

Abstract: 159744 16257 74.573
Contextual Info: PROGRAMMABLE CRYSTAL OSCILLATOR EXO - 3 SERIES Hy-Q International MAXIMUM ABSOLUTE RATING 12.8 MAX. 8 7 6 ITEM 5 SYMBOL POWER SUPPLY VOLTAGE 7.0 MAX. INPUT VOLTAGE 1 2 3 OUTPUT VOLTAGE 4 STORAGE TEMPERATURE RANGE ø1.6 VDD -0.5 to +7.0 Volts VI -0.03 to VDD +0.3 Volts

3.2768MHz crystal

Abstract: 14.7456MHz crystal smd 7.9872mhz crystal 11.0592mhz 10.245MHz crystal CRYSTAL 92.16MHZ crystal 18.432mhz 5.120MHZ QC49/QC49/SMD 3728MHZ
Contextual Info: MICROPROCESSOR CRYSTAL QC49/U QC49/S QC49/SMD Hy-Q International QC49/S QC49/U QC49/SMD 11.05±0.2 10.3±0.2 3.9 MAX. 4.65±0.2 5.0±0.2 12.7±0.2 12.3±0.2 13.46±0.2 ø0.5±0.05 TYP. 11.4±0.2 11.1±0.2 1.0±0.2 TYP. 12.7±0.2 4.7±0.2 4.83±0.2 4.88±0.2

2N5250

Abstract: 2N5251 mug 14 431 NIL-S-19500 2N4865 2N5151 FSC5961 2N5250 JAN Xelerated SAA 1006
Contextual Info: I I I IWE-FQUND I HIL-s-19500/380B 4 June 1991 SVPSl!5EDItK MIL-s-19500/180A( SLl 17 Septerber 1968 N2L2TARY SPECIP3CATICN SSN203N3WXUR DSV2CE, TWSISIWR,NPN,S2LIIXN,m TYPES 2N4865,2N5250,2N5251,JAIWX, JAN2’XV, ~ JANS MS s~ification is approvedfor w hy e21 Ceptusxts and lq~cies of the Deprt.uentof Defense.

QSMC-206

Abstract: QSMC-306
Contextual Info: SURFACE MOUNT CRYSTALS QSMC - 206 QSMC - 306 Hy-Q International QSMC-206 QSMC-306 7.3 MAX. 3 4 2.5±0.2 1 0.9±0.1 TYP. 8.0 MAX. 3 4 3.8±0.2 4.1±0.2 3.2±0.2 1 2 1.8±0.2 2.0 MAX. 5.08±0.2 1.9±0.2 2 2.38±0.2 2.54 MAX. 0.0 MIN. 5.5±0.2 0.4±0.1 TYP. 0.0 MIN.

Contextual Info: -HY UND AI HYM532200A M-Series 2M X 32-bit CMOS DRAM MODULE DESCRIPTION The HYM532200A is a 2M x 32-bit Fast page mode CMOS DRAM module consisting of sixteen HY514400A in 20/26 pin SOJ on a 72 pin glass-epoxy printed circuit board. 0.22^F decoupling capacitor is mounted fo r each DRAM.

bridge rectifier SSC

Contextual Info: <z?\ roaucti, Una. TELEPHONE: 973 376-2922 (212)227-6005 FAX: (973) 376-8960 20 STERN AVE. SPRINGFIELD, NEW JERSEY 07081 U.S.A. MDA2500 series RECTIFIER ASSEMBLY . . . u t i l i z i n g individual vo'd free molded r e c t i f i e r s , interconnected and mounted on an viectricaily uolaied aluniinum heat sink hy

Contextual Info: H Y U N D A I • HY M 5 V 72 A 1604 F-Series Unbuffered 16Mx72 bit C M O S DRAM MODULE based on 8Mx8 DRAM, EDO, ECC, 4K/8K-Refresh DESCRIPTION The H Y M 5 V 7 2 A 1 6 0 4 is a 16M x 72-bit E D O mode C M O S D R A M module consisting of eighteen 8M x8 S O J

500 mh inductor

Abstract: 62212 62352 HY 400 hy 750 64134 107D 202E 62132 MH200
Contextual Info: Ultra-miniature HIGH "Q" Inductors Specifications: z z z z z z z z z z z Inductance Tolerance ± 4% at 0.1V-100KHZ Inductance Stability vs. Temperature ± 2% -55ºC to 105ºC Weight: 2 Grams Thermal Shock 100 Cycles, method 107D MIL-STD 202E Test Condition A3

6887

Contextual Info: Ultra­miniature HIGH "Q" Inductors Specifications: Inductance Tolerance ± 4% at 0.1V­100KHZ Inductance Stability vs. Temperature ± 2% ­55ºC to 105ºC Weight: 2 Grams Thermal Shock 100 Cycles, method 107D MIL­STD 202E Test Condition A3

Contextual Info: “63000" SERIES PICO’s miniature A P P R O X . S E LF HIGH “ Q ” INDUCTORS • • • • • N U M BER ± 2% inductance stability vs temperature Smallest possible size Extreme resistance to thermal shock Manufactured to MIL-PRF-27 Grade 5, Class S

ac inductor 14 mH 1.05 a

Abstract: TF5R20ZZ 500 mh inductor 107D MIL-T-27 hy600 MH38 66298 inductor 220 mh inductor 73 mh
Contextual Info: PICO*s miniature HIGH “Q” INDUCTORS • ± 1% inductance stability vs temperature • Smallest possible size • Extreme resistance to thermal shock • Manufactured to Mil-T-27 TF5R20ZZ • All units are magnetically shielded «63000” SERIES PART

kmz10a1

Abstract: SOT195 KMZ10 MLC716 SC17
Contextual Info: DISCRETE SEMICONDUCTORS DATA SHEET handbook, halfpage M3D329 KMZ10A1 Magnetic field sensor Product specification Supersedes data of 1996 Nov 14 File under Discrete Semiconductors, SC17 1998 Apr 06 Philips Semiconductors Product specification Magnetic field sensor

land pattern for sot109-1

Abstract: TSSOP-8 footprint and soldering sot-23 SOD87 footprint
Contextual Info: Packages Package cross reference 88 Packing methods 90 Minimized outline drawings and reflow soldering footprint 96 Package overview 86 107 87 Package cross reference Package cross reference 88 types in bold represent new products types in bold represent new products