HVQFN32 Search Results

110621

Abstract: SOT617-3
Contextual Info: Package outline HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm D B SOT617-3 A terminal 1 index area A A1 E detail X C e1 e 9 16 L y1 C C A B C v w 1/2 e b y 17 8 e e2 Eh 1/2 e 24 1 terminal 1 index area

hvqfn32

Abstract: HVQFN-32 solder paste SOT617-3
Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HVQFN32 package SOT617-3 Hx Gx D P C 0.105 SPx nSPx Hy SPy tot SPy Gy SLy nSPy By Ay SPx tot SLx Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout

Contextual Info: +9 4 1  SOT617-1 HVQFN32; Reel pack; SMD, 7"; standard product orientation Orderable part number ending, 115 or X Ordering code 12NC) ending 115 Rev. 1 — 16 May 2013 Packing information 1. Packing method Printed plano box Barcode label Reel Tape QA Seal

HVQFN32

Abstract: SOT617-3
Contextual Info: 4 1  SOT617-3 +9 HVQFN32; Reel pack, SMD, 13" Q1/T1 standard product orientation Orderable part number ending ,118 or J Ordering code 12NC) ending 118 Rev. 1 — 2 April 2014 Packing information 1. Packing method Printed plano box Barcode label Reel Tape

Contextual Info: Package outline HVQFN32R: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; resin based; body 7 x 7 x 0.8 mm B D SOT1152-1 A terminal 1 index area A E detail X e1 e ∅v ∅w b C A B C C 1/2 e L1 9 y y1 C 16 L 8 17 e Eh e2 1/2 e

SOT617-1

Abstract: HVQFN32 HVQFN-32 MO-220
Contextual Info: PDF: 2002 Oct 18 Philips Semiconductors Package outline HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm A B D SOT617-1 terminal 1 index area A A1 E c detail X C e1 e 1/2 e 9 16 y y1 C v M C A B w M C

Contextual Info: Package outline HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 7 x 7 x 0.85 mm B D SOT865-3 A terminal 1 index area E A c A1 detail X C e1 9 y1 C C A B C v w b e L y 16 17 8 e2 Eh e 1 24 terminal 1 index area 32

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of HVQFN32 package SOT617-9 Hx Gx D P 0.025 0.025 C nSPy Hy Gy SPx tot SPy tot 3.20 SLy By Ay SPy X nSPx SPx 0.80 3.10 SLx solder land Bx 0.6 Ax 0.3 detail X solder paste deposit solder land plus solder paste

Contextual Info: Package outline HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 7 x 7 x 0.85 mm D B SOT865-1 A terminal 1 index area E A A1 c detail X C e1 e b 1/2 e 9 v w 16 M M y y1 C C A B C L 17 8 e e2 Eh 1/2 e 1 24 terminal 1

HVQFN32

Abstract: sot617-3 MO-220 E241
Contextual Info: PDF: 2002 Oct 22 Philips Semiconductors Package outline HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm A B D SOT617-3 terminal 1 index area A A1 E c detail X C e1 e 1/2 e 9 y1 C v M C A B w M C b

HVQFN-32

Abstract: SOT617-2 HVQFN32 MO-220
Contextual Info: PDF: 2003 May 02 Philips Semiconductors Package outline HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm SOT617-2 B D D1 A terminal 1 index area A A4 E1 E c A1 detail X C e1 e 1/2 v M C A B w M C b

Contextual Info: Package outline HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 7 x 7 x 0.85 mm SOT865-2 B D D1 A terminal 1 index area E1 E A A2 c A1 detail X e1 C 1/2 e 9 y1 C C A B C v w b e L y 16 17 8 e2 Eh e 1 24 terminal 1

Contextual Info: Package outline HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm SOT617-2 B D D1 A terminal 1 index area A A4 E1 E c A1 detail X C e1 e v M C A B w M C b 1/2 e 9 16 y1 C y L 17 8 e e2 Eh 1/2 e 1 24

Contextual Info: Package outline HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 6 x 6 x 0.85 mm D B SOT866-1 A terminal 1 index area E A A1 c detail X C e1 e b 1/2 e 9 v w 16 L M M y y1 C C A B C 17 8 e e2 Eh 1/2 e 1 24 terminal 1

Contextual Info: +9 4 1  SOT617-1 HVQFN32; Reel pack; SMD, 13"; standard product orientation Orderable part number ending, 118 or J Ordering code 12NC) ending 118 Rev. 1 — 12 June 2013 Packing information 1. Packing method Printed plano box Barcode label Reel Tape QA Seal

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of HVQFN32 package SOT865-2 Hx Gx D P 0.025 0.025 C 0.105 SPx nSPx Hy SPy tot SPy Gy SLy nSPy By Ay SPx tot SLx Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HVQFN32 package SOT617-1 Hx Gx D P C 0.105 SPx nSPx Hy SPy tot SPy Gy SLy nSPy By Ay SPx tot SLx Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout

Contextual Info: Package outline HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm A B D SOT617-9 terminal 1 index area E A A1 c detail X e1 1/2 e e 9 16 C C A B C Øv Øw b y y1 C L 8 17 e e2 Eh 1/2 e 24 1 terminal 1

Contextual Info: Package outline HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm A B D SOT1030-1 terminal 1 index area E A A1 c detail X e1 1/2 e v w b e L 9 16 C C A B C M M y1 C y 17 8 e e2 Eh 1/2 e 1 24 terminal 1

Contextual Info: Package outline HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm A B D SOT617-5 terminal 1 index area A E A1 c detail X e1 1/2 e L1 C v w b e 9 16 M M C A B C y y1 C e L 17 8 e2 Eh b c 1/2 e 1 24 terminal 1

HVQFN32

Abstract: MO-220 sot866
Contextual Info: Package outline Philips Semiconductors HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 6 x 6 x 0.85 mm D B SOT866-1 A terminal 1 index area E A A1 c detail X C e1 e b 1/2 e 9 v w 16 M M y1 C C A B C y L 17 8 e e2

HVQFN32

Abstract: MO-220 Thin Quad flat package 44 mo-220 sot865
Contextual Info: Package outline Philips Semiconductors HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 7 x 7 x 0.85 mm D B SOT865-1 A terminal 1 index area E A A1 c detail X C e1 e b 1/2 e 9 v w 16 M M y1 C C A B C y L 17 8 e e2

Contextual Info: Package outline HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; 3 x 6 x 0.85 mm A B D SOT1185-1 terminal 1 index area E A A1 c detail X e e1 12 16 C C A B C v w b y y1 C L 17 11 e e2 Eh 27 1 terminal 1 index area 32 28

Contextual Info: Package outline HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm A B D SOT617-7 terminal 1 index area E A A1 c detail X e1 1/2 e e 9 16 C C A B C v w b y y1 C L 8 17 e e2 Eh 1/2 e 1 24 terminal 1 index area