L-932
Abstract: No abstract text available
Text: PDF: 2000 Feb 02 Philips Semiconductors Package outline HTQFP32: plastic, heatsink thin quad flat package; 32 leads; body 5 x 5 x 1.0 mm SOT547-1 c y heathsink side X Dh 24 17 25 A 16 ZE e E HE Eh A 3 A A2 A1 w M θ bp pin 1 index Lp L 9 32 detail X 1 8
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HTQFP32:
OT547-1
L-932
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sot547
Abstract: No abstract text available
Text: PDF: 1999 Jun 15 Philips Semiconductors Package outline HTQFP32: plastic, heatsink thin quad flat package; 32 leads; body 5 x 5 x 1 mm SOT547-2 c y heathsink side X Dh 24 17 25 A 16 ZE e E HE Eh A 3 A A2 A1 w M θ bp Lp pin 1 index 32 L 9 detail X 1 8 ZD
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HTQFP32:
OT547-2
OT547-2
sot547
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SOT547
Abstract: No abstract text available
Text: PDF: 2003 Apr 07 Philips Semiconductors Package outline HTQFP32: plastic thermal enhanced thin quad flat package; 32 leads; body 5 x 5 x 1 mm; exposed die pad SOT547-1 c y exposed die pad side X Dh 24 17 25 A 16 ZE e E HE Eh A 3 A A2 A1 w M θ bp pin 1 index
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HTQFP32:
OT547-1
SOT547
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Untitled
Abstract: No abstract text available
Text: PDF: 2000 Feb 02 Philips Semiconductors Package outline HTQFP32: plastic, heatsink thin quad flat package; 32 leads; body 5 x 5 x 1.0 mm SOT547-2 c y heathsink side X Dh 24 17 25 A 16 ZE e E HE Eh A 3 A A2 A1 w M θ bp Lp pin 1 index 32 L 9 detail X 1 8
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HTQFP32:
OT547-2
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sot547
Abstract: No abstract text available
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline HTQFP32: plastic, heatsink thin quad flat package; 32 leads; body 5 x 5 x 1 mm SOT547-1 c y heathsink side X Dh 24 17 25 A 16 ZE e E HE Eh A 3 A A2 A1 w M θ bp pin 1 index Lp L 9 32 detail X 1 8 ZD
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HTQFP32:
OT547-1
OT547-1
sot547
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R114426
Abstract: BLM11P300S dipsw_4 232270296001 433003036301 Philips 2322-702-96001 BLM11P300 AN99071 STM16 TP97036
Text: APPLICATION NOTE OM5808 demoboard negative supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package AN99071 TP97036.2/F5.5 Philips Semiconductors OM5808 demoboard negative supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package Application Note AN99071 Abstract
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OM5808
TZA3014
TZA3019
AN99071
TP97036
OM5808.
R114426
BLM11P300S
dipsw_4
232270296001
433003036301
Philips 2322-702-96001
BLM11P300
AN99071
STM16
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HTQFP100
Abstract: LQFP48 HBCC32 DB4042 CGY2110 TZA3001 TZA3013 TZA3023 TZA3031 TZA3033
Text: MSD818 Philips Semiconductors Input Fiber Optic Interface ICs Line Card Part number Datarate Mb/s Package Type Bare Die TRANSIMPEDANCE AMPLIFIERS TZA3033 TZA3023 TZA3043 TZA3013 CGY2102 CGY2110 CGY2140 155 622 1250 2488 3250 10700 39813 SO8 SO8 SO8 HVQFN24
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MSD818
TZA3033
TZA3023
TZA3043
TZA3013
CGY2102
CGY2110
CGY2140
2-12mV
HTQFP100
LQFP48
HBCC32
DB4042
CGY2110
TZA3001
TZA3013
TZA3023
TZA3031
TZA3033
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8b 10b m-phy
Abstract: cgy2141 LQFP32 LQFP48 QFP64 TSSOP16 TZA3014 TZA3034 TZA3044 BARE die
Text: Chip sets for optical networking Delivering the broadband revolution Introduction: As a result of the Internet revolution in communications infrastructure the demand for data transmission bandwidth is expanding tenfold each year. Fiber optic transmission is the
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155Mb/s
40Gb/s.
IEEE1149
8b 10b m-phy
cgy2141
LQFP32
LQFP48
QFP64
TSSOP16
TZA3014
TZA3034
TZA3044
BARE die
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2222916
Abstract: B45196H1107M9 AN99072 OC48 STM16 TP97036 TZA3014 TZA3019 TZA3019A AN9907
Text: APPLICATION NOTE OM5809 demoboard positive supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package AN99072 TP97036.2/F5.5 Philips Semiconductors OM5809 demoboard positive supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package Application Note AN99072 Abstract
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OM5809
TZA3014
TZA3019
AN99072
TP97036
OM5809.
2222916
B45196H1107M9
AN99072
OC48
STM16
TZA3019A
AN9907
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SOT411
Abstract: SnAg25Sb10 zirconium acetate AgCu28 Transistors smd mark code CuZn15 QFP100 Quad Flat Pack dimensions 271 Ceramic Disc Capacitors SOT538 smd led 5050
Text: Environmental Information ENVIRONMENTAL SAFETY Offering maximum benefit – minimum impact New technologies result in shared benefits for you our customers, balancing maximum technological benefits with minimum environmental impact. This starts with clever chip designs, which
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MGT028
Abstract: TZA3019 TZA3019AHT TZA3019AVH TZA3019BHT TZA3019BVH TZA3019CHT TZA3019CVH
Text: INTEGRATED CIRCUITS DATA SHEET TZA3019 2.5 Gbits/s dual postamplifier with level detectors and 2 x 2 switch Product specification Supersedes data of 2000 Apr 10 File under Integrated Circuits, IC19 2001 Jun 25 Philips Semiconductors Product specification
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TZA3019
403510/200/02/pp32
MGT028
TZA3019
TZA3019AHT
TZA3019AVH
TZA3019BHT
TZA3019BVH
TZA3019CHT
TZA3019CVH
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TZA3019
Abstract: TZA3019AHT TZA3019AV TZA3019BHT TZA3019BV TZA3019CHT TZA3019CV INV137 MGT028
Text: INTEGRATED CIRCUITS DATA SHEET TZA3019 2.5 Gbits/s dual postamplifier with level detectors and 2 x 2 switch Preliminary specification File under Integrated Circuits, IC19 2000 Apr 10 Philips Semiconductors Preliminary specification 2.5 Gbits/s dual postamplifier with level
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TZA3019
403510/50/01/pp32
TZA3019
TZA3019AHT
TZA3019AV
TZA3019BHT
TZA3019BV
TZA3019CHT
TZA3019CV
INV137
MGT028
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GAC 928
Abstract: TZA3014 TZA3014HT TZA3014U TZA3014VH
Text: INTEGRATED CIRCUITS DATA SHEET TZA3014 2.5 Gbits/s postamplifier with level detector Product specification Supersedes data of 2000 Aug 09 File under Integrated Circuits, IC19 2001 Jun 25 Philips Semiconductors Product specification 2.5 Gbits/s postamplifier with level detector
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TZA3014
403510/200/02/pp28
GAC 928
TZA3014
TZA3014HT
TZA3014U
TZA3014VH
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Untitled
Abstract: No abstract text available
Text: This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in
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HTQFP32
OT547-2
HTQFP48
OT545-2
HTQFP80
OT513-1
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JEDEC TRAY DIMENSIONS
Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package
Text: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors
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manuf86
TQFP80
OT357
TQFP64
OT543
TFBGA64
JEDEC TRAY DIMENSIONS
HSSOP20
ic packages
TRAY TSSOP20 14 X 35
SO16 package trays
BGA304
HLQFP100
MSD504
LQFP64 reel size
PLCC84 package
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CGY2144
Abstract: CGY2141 Ultrafast Photodiode InGaAs MSD828 photodiode germanium STM-64 for FTTH LQFP32 QFP64 TZA3005 TZA3047
Text: Network Infrastructure Delivering the broadband revolution Philips Semiconductors More information, interaction and better quality of service.These are the challenges that face us with today’s Internet-driven broadband revolution.To meet these challenges,
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Wavelength Converter
Abstract: No abstract text available
Text: INTEGRATED CIRCUITS DATA SHEET TZA3014 2.5 Gbits/s postamplifier with level detector Preliminary specification File under Integrated Circuits, IC19 2000 Aug 09 Philips Semiconductors Preliminary specification 2.5 Gbits/s postamplifier with level detector TZA3014
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TZA3014
403510/200/01/pp28
Wavelength Converter
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