HSUPA 2 MBPS Search Results

HSUPA 2 MBPS Result Highlights (5)

Part	ECAD Model	Manufacturer	Description	Download	Buy
TLP2304		Toshiba Electronic Devices & Storage Corporation	Photocoupler (photo-IC output), High-speed / IPM driver, 1 Mbps, 3750 Vrms, 5pin SO6
TLP2766A		Toshiba Electronic Devices & Storage Corporation	Photocoupler (photo-IC output), High-speed, 20 Mbps, 5000 Vrms, SO6L
TLP2710		Toshiba Electronic Devices & Storage Corporation	Photocoupler (photo-IC output), High-speed, 5 Mbps, 5000 Vrms, SO6L
TLP2719		Toshiba Electronic Devices & Storage Corporation	Photocoupler (photo-IC output), High-speed / IPM driver, 1 Mbps, 5000 Vrms, SO6L
AM79C971AVC\\W		Rochester Electronics	AM79C971 - Single-Chip Full-Duplex 10/100 Mbps Ethernet Controller for PCI Local Bus

HSUPA 2 MBPS Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
"power scheduling" Abstract: HSDPA TM500 logger l1 l2 HSDPA packet scheduling 1/BMC 2709 Text: TM500 Test Mobile 3GPP Release 6 HSUPA Option The Layer 1 / Layer 2 and Higher Layer options extend the capabilities of the TM500 test mobile to support the latest 3GPP Release 6 High Speed Uplink Packet Access HSUPA technology • Full Layer 1 / Layer 2 implementation of	Original	PDF	TM500 76Mbps "power scheduling" HSDPA logger l1 l2 HSDPA packet scheduling 1/BMC 2709
3g hsdpa usb modem 7.2 Abstract: datacard GTM501 gsm Simultaneous voice and data module hsdpa receiver in1800 HSPA Module gsm sim 900 3G HSDPA circuits UMTS gsm Text: GTM501 World’s Smallest HSPA module • Easy to integrate WAN module • 25 mm High speed: up to 7.2 Mbps downlink and 5.76 Mbps uplink • 2.5 mm Most Advanced Receiver Technologies: Equalization and Rx Diversity • TOP VIEW Multimode HSUPA, HSDPA, UMTS, EDGE, GPRS and GSM	Original	PDF	GTM501 GTM501 3g hsdpa usb modem 7.2 datacard gsm Simultaneous voice and data module hsdpa receiver in1800 HSPA Module gsm sim 900 3G HSDPA circuits UMTS gsm
BCM2155 Abstract: BCM4750 GPS chip BCM4750 usb 3g modem circuit BCM59055 Broadcom bcm4750 BCM21551 3g hsdpa signal antenna Diagram Broadcom BCM21331 BCM4325 Text: BCM21551 Brief Single-Chip 65-nm HSUPA + RF + BT + FM + Multimedia SoC SUMMARY OF BENEFITS FEATURES • • • • General Characteristics • Single-chip, single-die, HSPA System On a Chip SoC with integrated RF, Bluetooth®, FM, multimedia acceleration, high-speed USB, full	Original	PDF	BCM21551 65-nm 621-pin 21551-PB02-R BCM2155 BCM4750 GPS chip BCM4750 usb 3g modem circuit BCM59055 Broadcom bcm4750 BCM21551 3g hsdpa signal antenna Diagram Broadcom BCM21331 BCM4325
BCM2155 Abstract: usb 3g modem circuit 3g hsdpa signal antenna Diagram BCM59055 BCM4750 BCM21551 3g modem circuit mipi csi receiver h.264 encode mipi Transceiver Broadcom 3G RF Text: BCM21551 Brief Single-Chip 65-nm HSUPA + RF + BT + FM + Multimedia SoC SUMMARY OF BENEFITS FEATURES • • • • General Characteristics • Single-chip, single-die, HSPA System On a Chip SoC with integrated RF, Bluetooth®, FM, multimedia acceleration, high-speed USB, full	Original	PDF	BCM21551 65-nm 468-MHz ARM11TM 21551-PB03-R BCM2155 usb 3g modem circuit 3g hsdpa signal antenna Diagram BCM59055 BCM4750 BCM21551 3g modem circuit mipi csi receiver h.264 encode mipi Transceiver Broadcom 3G RF
3g call flow with message Abstract: 3g call flow EN61010-1 EN61326-1 3g data call flow Text: Protocol Test WCDMA ACE 3G Protocol Analysis Test System • Powerful network emulator for integration, regression and pre-conformance testing of WCDMA terminals • Full protocol decode and debugging tools • 3GPP Release 99, Rel-5 HSDPA and Rel-6 HSUPA capable	Original	PDF
PXA1801 Abstract: No abstract text available Text: Marvell PXA1801 LTE World Modem for Global Cellular Designs PRODUCT OVERVIEW The Marvell PXA1801 LTE world modem combines Marvell’s leading communications and silicon expertise to enable global smartphone and tablet design. The Marvell PXA1801 enables high-performance, low-power smartphones	Original	PDF	PXA1801 PXA1801 PXA1801-001
Untitled Abstract: No abstract text available Text: Protocol Test WCDMA ACE 3G Protocol Analysis Test System • Powerful network emulator for integration, regression and pre-conformance testing of WCDMA terminals • Full protocol decode and debugging tools • 3GPP Release 99, Rel-5 HSDPA and Rel-6 HSUPA capable	Original	PDF	test441
TM500 Abstract: 3G HSDPA HSDPA 3G HSDPA circuits Text: For more information, contact: Debra Seifert Debra Seifert Communications LLC 503 626-7539 debra@debraseifert.com James E. De Broeck Aeroflex Incorporated (316) 522-4981 jim.debroeck@aeroflex.com FOR PRINT AND ONLINE RELEASE: July 29, 2010 Aeroflex Launches 3GPP WCDMA Release 9, 84 Mbps Support for the	Original	PDF	TM500 2010--Aeroflex TM500 3G HSDPA HSDPA 3G HSDPA circuits
3g router Abstract: GCF-CC 3G HSDPA circuits CONNECTOR SMa barrel GSM router GSM 3G HSDPA NAPRD03 RS232 GPRS GSM Module protocol conversion module Wireless Router Text: Digi Connect WAN Family Cellular Gateways/Routers/VPN Devices Small, cost-optimized cellular routers utilize global cellular networks for secure connectivity to remote sites and devices. Overview Digi Connect WAN cellular routers provide secure highspeed wireless connectivity to remote sites and devices. These	Original	PDF	D3/1209 3g router GCF-CC 3G HSDPA circuits CONNECTOR SMa barrel GSM router GSM 3G HSDPA NAPRD03 RS232 GPRS GSM Module protocol conversion module Wireless Router
3g call flow Abstract: 3g data call flow 3G HSDPA cell capacity planning EN61010-1 EN61326-1 3g call flow with message Text: Protocol Test WCDMA ACE 3G Protocol Analysis Test System • Powerful network emulator for integration, regression and pre-conformance testing of WCDMA terminals • Full protocol decode and debugging tools • 3GPP Release 99, Rel-5 HSDPA and Rel-6 HSUPA capable	Original	PDF
PC8229-333 Abstract: mindspeed femtocell ARM11 datasheet mindspeed arm PC302 Text: PC333 Features Description • The Mindspeed PC333 is a single chip 3GPP Local Area Basestation Femtocell baseband and host processor SoC solution. It is part of Mindspeed’s complete baseband platform family of chips that drives femtocell cost models from residential through to	Original	PDF	PC333 21Mbps PC333-BRF-0012-A PC8229-333 mindspeed femtocell ARM11 datasheet mindspeed arm PC302
mindspeed femtocell Abstract: ARM1176EJ pc3x PICOCHIP PC5300 ARM11 datasheet Text: PC323 Features Description • The Mindspeed PC323 is a single chip 3GPP Enterprise Femtocell baseband and host processor SoC solution. It is part of Picochip’s complete baseband platform family of chips that drives femtocell cost models from residential through to enterprise, metro and picocells.	Original	PDF	PC323 ARM11 PC323-BRF-0012-A mindspeed femtocell ARM1176EJ pc3x PICOCHIP PC5300 ARM11 datasheet
PICOCHIP Abstract: Rake search accelerator IEEE1588 phy DesignWare SPI PC312 Text: PC312 Features •        Description Implements a complete 3GPP Release 6 WCDMA Femto Access Point FAP SoC supporting 8 user - 8 users - Up to 14Mbps HSDPA - Up to 5.7Mbps HSUPA Programmable architecture allows reconfiguration to network monitoring	Original	PDF	PC312 14Mbps ARM11 ARM1176JZ-S 400MHz PC312-BRF-0012-A PICOCHIP Rake search accelerator IEEE1588 phy DesignWare SPI
3G HSDPA circuits diagram Abstract: microcontroller based GPRS IP Modem projects i-300 gsm modem HSDPA receiver MXC300-30 sim 300 processor gsm modem for project CIRCUIT DIAGRAM FOR gsm modem with sim 300 UMTS receiver 3G HSDPA circuits ARM1136 Text: Freescale HSDPA Solutions White Paper Freescale Semiconductor, Inc. Document Number # HSDPASOLUTNSWP Rev #0 09/2005 OVERVIEW High Speed Downlink Packet Access HSDPA is a Third Generation Partnership Project (3GPP) Release 5 standard that promises to make Wideband CDMA networks faster and smarter. Network operators should	Original	PDF	ARM11, ARML210TM 3G HSDPA circuits diagram microcontroller based GPRS IP Modem projects i-300 gsm modem HSDPA receiver MXC300-30 sim 300 processor gsm modem for project CIRCUIT DIAGRAM FOR gsm modem with sim 300 UMTS receiver 3G HSDPA circuits ARM1136

MC8790 Abstract: MC8795V mC5728V applications of Mobile Train Radio Communication MC8700 MC8790V C5728 Mobile Train Radio Communication audio echo ic dtmf wireless Text: Sierra Wireless AirPrime Intelligent Embedded Modules MC Series Air Interface Innovation Sierra Wireless AirPrime™ MC Series embedded modules deliver reliable, high-quality mobile broadband connectivity with a variety of advanced air interfaces. The AirPrime MC Series can turn any mobile computing or mobile	Original	PDF	MC5728V MC5728V MC8790 MC8795V applications of Mobile Train Radio Communication MC8700 MC8790V C5728 Mobile Train Radio Communication audio echo ic dtmf wireless
Untitled Abstract: No abstract text available Text: Agilent N8993A GS-8800 Series 8960 Wireless Communication Design Verification (DV) Bench-top System Data Sheet N8993A A platform for • GSM, GPRS, and EGPRS (Bands GSM 850, GSM 900, DCS 1800, and PCS 1900) • 3GPP TS51.010-01. Sections 12, 13, 14, 21, and 22	Original	PDF	N8993A GS-8800 N8993A cdma2000Â S0011 S0033 5990-5806EN cdma2000
MC8790 Abstract: MC8795V mC5728V mc8705 MC8700 MC8704 applications of Mobile Train Radio Communication MC8801 Gpsone Mobile Train Radio Communication Text: Sierra Wireless AirPrime Intelligent Embedded Modules MC Series Air Interface Innovation Sierra Wireless AirPrime™ MC Series embedded modules deliver reliable, high-quality mobile broadband connectivity with a variety of advanced air interfaces. The AirPrime MC Series can turn any mobile computing or mobile	Original	PDF	MC5728V MC5728V mc8704) MC8790 MC8795V mc8705 MC8700 MC8704 applications of Mobile Train Radio Communication MC8801 Gpsone Mobile Train Radio Communication
Qualcomm qsc6055 Abstract: QSC6055 Q26 extreme QSC6055 chipset Q2687 Q2686 XM0110 Q2686 COMMANDS qualcomm gpsOne qualcomm aT commands Text: Sierra Wireless AirPrime Wireless Embedded Modules Q Series A Single Form Factor for Multiple Technologies Conceived for rapid mounting in electronic machine-to-machine equipment, the Sierra Wireless AirPrime Q Series of intelligent embedded modules allows	Original	PDF