HPMX5001 Search Results

mn 6912

Abstract: SCHEMATIC DIAGRAM oscop oscop HPMX-5001 HPMX-5002 HPMX-5002-STR HPMX-5002-TR1 HPMX-5002-TY1 TQFP-48
Contextual Info: IF Modulator/Demodulator IC Technical Data HPMX-5002 Features Plastic TQFP-48 Package • Use with HPMX-5001 Up/Down Converter Chip for DECT Telephone Applications – MX P H 33 94 5 643 • 2.7– 5.5 V Single Supply Voltage • >75 dB RSSI Range 2 500 019

clapp oscillator

Abstract: HPMX-5001 5965-9105E HPMX-5001-TR1
Contextual Info: What HEW LETT* m L liM P A C K A R D 1.5-2.5 GHz Upconverter/ Downconverter Technical Data HPMX-5001 Features • 2.7 V Single Supply Voltage • Low Power Consumption 60 niA in Transmit Mode, 39 mA in Receive Mode Typical • 2 dBm Typical Transmit Power at 1900 MHz

mn 6912

Abstract: DECT telephone schematic HPMX-5002-TR1
Contextual Info: IF Modulator/Demodulator IC Technical Data HPMX-5002 Features Plastic TQFP-48 Package • Use with HPMX-5001 Up/Down Converter Chip for DECT Telephone Applications X– HPM 3 943 5 643 • 2.7– 5.5 V Single Supply Voltage • >75 dB RSSI Range 2 500 019

HMMC-2006

Abstract: 9x-series in 3003 TRANSISTOR HMMC-1002 HMMC-2007 HMMC-2027 HP-25 HPMX-3003 HPMX-5001 HPMX-5002
Contextual Info: RFIC Mixers, Modulators, Switches, Attenuators, Frequency Dividers, and Other Functions Characteristics Hewlett-Packard manufactures a broad line of innovative microwave and RF integrated circuits for use in the communications marketplace. Our product offering

04B SOT363

Abstract: 35 micro-X Package MARKING CODE F
Contextual Info: PACKAGE OUTLINES All dimensions in millimeters inches , except where noted. For complete package specifications, as well as chip dimensions, refer to individual product specification sheets. Drawings are not to scale. 4 .42 .265 10.7 6.73 12.39 ± 0.76 (0.488 ± 0.030)

JESD22-A114A

Abstract: HPMX-5001 JESD22-A114-A
Contextual Info: HPMX-5001, HPMX-5002 Integrated Circuits Reliability Data HPMX-5001 HPMX-5002 Description The following cumulative test results have been obtained from testing performed at HewlettPackard. Data was gathered from the product qualification, reliability monitor, and engineering

SSOP-16

Abstract: BPSK MODULATORS IAM-81028 HPMX-2006 IAM-81008 HPMX-2003 HPMX-2005 IAM-82008 IAM-82028 IAM-91563
Contextual Info: RFIC Mixers, Modulators, Switches, Attenuators, Frequency Dividers, and Other Functions Selection Guides Mixers Part Number Description HPMX-2006 IAM-81008 IAM-81028 IAM-82008 IAM-82028 IAM-91563 Package F in GHz F out IP 3 Vcc Ic Page (GHz) (dBm) (V) (mA) No.

Contextual Info: W h a ì H EW LETT W L'E M PACKARD IF Modulator/Demodulator IC Technical Data HPMX 5002 Features Plastic TQFP-48 Package • Use with HPMX-5001 Up/Down Converter Chip for DECT Telephone Applications • 2 .7 -5 .5 V Single Supply Voltage • >75 dB RSSI Range

Contextual Info: IF Modulator/Demodulator IC Technical Data HPMX-5002 Features Plastic TQFP-48 Package • Use with HPMX-5001 Up/Down Converter Chip for DECT Telephone Applications X– HPM 3 943 5 643 • 2.7– 5.5 V Single Supply Voltage • >75 dB RSSI Range 2 500 019

5001 LOOP

Abstract: it 5001 HP-25 HPMX-5001 HPMX-5001-STR HPMX-5001-TR1 HPMX-5001-TY1 HPMX-5002 T4-1-X65
Contextual Info: 1.5 – 2.5 GHz Upconverter/ Downconverter Technical Data HPMX-5001 Plastic TQFP-32 Package Features • 2.7 V Single Supply Voltage • Low Power Consumption 60␣ mA in Transmit Mode, 39 mA in Receive Mode Typical • 2 dBm Typical Transmit Power at 1900 MHz

Contextual Info: Thn% HEWLETT W lfÎM PACKARD 1 .5 -2 .5 GHz Upconverter/ Downconverter Technical Data HPMX-5001 F eatures Plastic TQFP-32 Package • 2.7 V Single Supply Voltage • Low Pow er Consumption 6 0 mA in Transmit Mode, 39 mA in R eceive Mode Typical • 2 dBm Typical Transmit

Contextual Info: i m HEW LETT* PACKARD IF M odulator/Demodulator IC Technical Data HPMX-5002 Features P lastic TQFP-48 Package • Use with HPMX-5001 Up/Down Converter Chip for DECT Telephone Applications • 2 .7 -5 .5 V Single Supply Voltage • >75 dB RSS1 Range • Internal Data Slicer

micro-x marking code E1

Abstract: 0004E4 SOT 86 MARKING E4
Contextual Info: PACKAGE OUTLINES All dimensions in millimeters inches , except where noted. For complete package specifications, as well as chip dimensions, refer to individual product specification sheets. Drawings are not to scale. 4 .42 .265 10.7 6.73 12.39 ± 0.76 (0.488 ± 0.030)

micro-x marking code E1

Abstract: SOT363 marking 12X DRR1-23XX DRR1-38XX DRT1-23XX HSCH-9101 HSCH-9161 HSCH-9201 SOT 86 MARKING E4 sot-23 6121
Contextual Info: PACKAGE OUTLINES All dimensions in millimeters inches , except where noted. For complete package specifications, as well as chip dimensions, refer to individual product specification sheets. Drawings are not to scale. 4 .42 .265 10.7 6.73 12.39 ± 0.76 (0.488 ± 0.030)

HPMX-5001

Abstract: HPMX-3002 HPMX-3003 HPMX-5002 SSOP-28 TQFP-48 PA 3002
Contextual Info: Multi-Function RFICs Part Number Description Package Vcc V Ic (mA) Page No. HPMX-3002 HPMX-3003 HPMX-5001 HPMX-5002 SO-8 SSOP-28 TQFP-32 TQFP-48 6 3 3 3 160 5 / - / 450 39, 60 21 6-76 7-82 7-90 7-105 900 MHz integrated driver amplifier 1.5 - 2.5 GHz LNA / switch / PA

HPMX-5001

Abstract: HPMX-5002 HPMX-5002-STR HPMX-5002-TR1 HPMX-5002-TY1 TQFP-48 IC 7108 DIAGRAM OF IC 7106
Contextual Info: IF Modulator/Demodulator IC Technical Data HPMX-5002 Features Plastic TQFP-48 Package • Use with HPMX-5001 Up/Down Converter Chip for DECT Telephone Applications X– HPM 3 943 5 643 • 2.7– 5.5 V Single Supply Voltage • >75 dB RSSI Range 2 500 019

DECT RF Transceiver 1.9 ghz

Contextual Info: 1.5 – 2.5 GHz Upconverter/ Downconverter Technical Data HPMX-5001 Features Plastic TQFP-32 Package • 2.7 V Single Supply Voltage • Low Power Consumption 60 mA in Transmit Mode, 39 mA in Receive Mode Typical • 2 dBm Typical Transmit Power at 1900 MHz

Contextual Info: That HEWLETT mLfiM P a c k a r d 1 .5 - 2 .5 G H z U p c o n v e r te r/ D o w n c o n v e r te r Technical Data HPMX-5001 F eatures P lastic TQFP-32 Package • 2.7 V Single Supply Voltage • Low Power Consumption 60 mA in Transmit Mode, 39 mA in Receive Mode

Contextual Info: HEWLETT W hat mL'fim P a c k a r d IF M odulator/Dem odulator IC Technical Data HPMX-5002 Features Plastic TQFP-48 Package • Use with HPMX-5001 Up/Down Converter Chip for DECT Telephone Applications \0 • 2.7-5.5 V Single Supply Voltage • >75 dB RSSI Range

CMOS Gilbert Cell

Abstract: signal path designer
Contextual Info: V%fV H E W L E T T “ I S S I PACKARD IF Modulator/Demodulator IC Technical Data HPMX-5002 Features Plastic TQFP-48 Package • Use with HPMX-5001 Up/Down Converter Chip for DECT Telephone Applications • 2.7-5.5 V Single Supply Voltage • >75 dB RSSI Range

T4-1-X65

Abstract: HP-25 HPMX-5001 HPMX-5001-STR HPMX-5001-TR1 HPMX-5001-TY1 HPMX-5002 AO 6912
Contextual Info: 1.5 – 2.5 GHz Upconverter/ Downconverter Technical Data HPMX-5001 Features Plastic TQFP-32 Package • 2.7 V Single Supply Voltage • Low Power Consumption 60 mA in Transmit Mode, 39 mA in Receive Mode Typical • 2 dBm Typical Transmit Power at 1900 MHz

HMMC202

Abstract: MSA-0770 Hewlett-Packard MSA-0836 MGA-641 ina-02170 Hewlett-Packard MICRO-X
Contextual Info: RFIC Selection Guide GaAs Fixed Gain Amplifiers Frequency Range GHz NF (dB @ GHz) Gain (dB @ GHz) P1dB (dBm @ GHz) IP 3 (dBm @ GHz) Supply Voltage (V) Supply Current (mA) HPMX-3003 (PA only) 1.5 - 2.5 - 24 @ 1.9 +27.5 @ 1.9 - 3.6/-1 450 SSOP-28 HPMX-3003

low frequency bpsk modulator ic

Abstract: DIVIDE - BY - 4 PRESCALER iam-81008 package 3008 so8 bpsk modulator ic IAM-82008 bpsk modulator demodulator
Contextual Info: RFIC Mixers, Modulators, Switches, Attenuators, Frequency Dividers, and Other Functions Selection Guides Mixers Part Number Description Package F in GHz F out (GHz) HPMX-2006 double balanced upconverter (with integrated post amplifier) 3-port double balanced mixer

HPMX-5001

Abstract: MTTF test data
Contextual Info: HPMX-5001, HPMX-5002 Integrated Circuits Reliability Data HPMX-5001 HPMX-5002 Description The following cumulative test results have been obtained from testing performed at HewlettPackard. Data was gathered from the product qualification, reliability monitor, and engineering