HP16091A
Abstract: HP16092 LMCI1005-R10 HP16092A LMCI1005-39N VP-2811 HP16193A LMCI0201-3N9
Text: Low Value Multilayer Chip Inductors Features • Low inductance — down to 1.0 nH • Suitable for high frequency applications • Monolithic structure • Excellent solderability for either flow or reflow soldering Unit: mm inch Dimensions SERIES W L T
|
Original
|
PDF
|
|
Untitled
Abstract: No abstract text available
Text: Low Value Multilayer Chip Inductors Features • Low inductance — down to 1.0 nH • Suitable for high frequency applications • Monolithic structure • Excellent solderability for either flow or reflow soldering Unit: mm inch Dimensions SERIES W L T
|
Original
|
PDF
|
|
VP-2811A
Abstract: No abstract text available
Text: Low Value Multilayer Chip Inductors Features • Low inductance — down to 1.0 nH • Suitable for high frequency applications • Monolithic structure • Excellent solderability for either flow or reflow soldering Unit: mm inch Dimensions SERIES W L T
|
Original
|
PDF
|
|
N 250
Abstract: 2811A LMCI2012-FR47
Text: Low Value Multilayer Chip Inductors Features • Low inductance — down to 1.2 nano Henry’s. • Suitable for high frequency applications. • Monolithic structure. • Excellent solderability for either flow or reflow soldering. Dimensions Polarity marking
|
Original
|
PDF
|
|
HP8753A
Abstract: HP-8753A capacitor 681 signal path designer
Text: Cal-Chip Electronics, Incorporated CHQ SERIES Surface Mount Chip Capacitors: Ultra High Frequency High Frequency Measurement and Performance of High ‘Q’ Multilayer Ceramic Capacitors INTRODUCTION Capacitors used in High Frequency applications are generally
|
Original
|
PDF
|
|
Untitled
Abstract: No abstract text available
Text: Miniature RF Chip Inductors Features • High Q values. • High SRF. • Wide inductance range, 1nH to 3.3 µH • Excellent solderability and resistance to soldering heat suitable for flow or reflow soldering. • High reliability and high speed surface mount assembly.
|
Original
|
PDF
|
|
Untitled
Abstract: No abstract text available
Text: Low Value Multilayer Chip Inductors Features • Low inductance — down to 1.2 nano Henry’s. • Suitable for high frequency applications. • Monolithic structure. • Excellent solderability for either flow or reflow soldering. Dimensions Unit: mm inch
|
Original
|
PDF
|
|
GRM230Y5V475Z16
Abstract: GR42-6 hr r 681k- 1kv GR40 MURATA HR R 221k 2kv GR42-2 grh110 GHM1540 GHM2143 B 473 M AC250 PT GHM3145
Text: This is the PDF file of catalog No.C02E-5. No.C02E5.pdf 99.8.13 Chip Monolithic Ceramic Capacitor CHIP MONOLITHIC CERAMIC CAPACITOR Murata Manufacturing Co., Ltd. Cat.No.C02E-5 This is the PDF file of catalog No.C02E-5. No.C02E5.pdf 99.8.13 Chip Monolithic Ceramic Capacitor
|
Original
|
PDF
|
C02E-5.
C02E5
C02E-5
GRM33
GRM36YGRM44-1
GRM39YGRM44-1
GRM36-019
GR36YGR44-1
GRM230Y5V475Z16
GR42-6
hr r 681k- 1kv
GR40 MURATA
HR R 221k 2kv
GR42-2
grh110
GHM1540
GHM2143 B 473 M AC250 PT
GHM3145
|
HP16091A
Abstract: Metalized
Text: Miniature RF Chip Inductors Features • High Q values • High SRF • Wide inductance range, 1nH to 47µH •E xcellent solderability and resistance to soldering heat suitable for flow or reflow soldering • High reliability and high speed surface mount assembly
|
Original
|
PDF
|
|
Untitled
Abstract: No abstract text available
Text: Miniature RF Chip Inductors Features • High Q values • High SRF • Wide inductance range, 1nH to 47µH •E xcellent solderability and resistance to soldering heat suitable for flow or reflow soldering • High reliability and high speed surface mount assembly
|
Original
|
PDF
|
|
Untitled
Abstract: No abstract text available
Text: Miniature RF Chip Inductors Features • High Q values • High SRF • Wide inductance range, 1nH to 47µH •E xcellent solderability and resistance to soldering heat suitable for flow or reflow soldering • High reliability and high speed surface mount assembly
|
Original
|
PDF
|
|
MLF3216
Abstract: MLCC R040 NTC thermistor 5k ohm FBM0805 MLF1005 330m 400v MLF1206 c1206x7r160 thr mgp 10k CR0402-16w
Text: Our Mission Venkel’s mission is to be a leading supplier of surface mount components by utilizing a team of highly motivated people dedicated to exceeding customer expectations through superior quality, price, service and innovation with integrity. 5900 Shepherd Mountain Cove • Austin, TX 78730
|
Original
|
PDF
|
C1206C0G500-333JNE
C1206C0G500-473JNE
C1206C0G500-563JNE
C1206C0G500-683JNE
C1206C0G500-823JNE
C1206C0G250-104JNE
MLF3216
MLCC R040
NTC thermistor 5k ohm
FBM0805
MLF1005
330m 400v
MLF1206
c1206x7r160
thr mgp 10k
CR0402-16w
|
R10-J
Abstract: No abstract text available
Text: Miniature RF Chip Inductors Features • High Q values. • High SRF. • Wide inductance range, 1nH to 3.3 µH • Excellent solderability and resistance to soldering heat suitable for flow or reflow soldering. • High reliability and high speed surface mount assembly.
|
Original
|
PDF
|
016rs,
R10-J
|
Untitled
Abstract: No abstract text available
Text: Low Value Multilayer Chip Inductors Features • Low inductance — down to 1.2 nano Henry’s. • Suitable for high frequency applications. • Monolithic structure. • Excellent solderability for either flow or reflow soldering. Dimensions Unit: mm inch
|
Original
|
PDF
|
|
|
|
VP-2811A
Abstract: No abstract text available
Text: Low Value Multilayer Chip Inductors Features • Low inductance — down to 1.0 nH • Suitable for high frequency applications • Monolithic structure • Excellent solderability for either flow or reflow soldering Unit: mm inch Dimensions SERIES W L T
|
Original
|
PDF
|
|
LMCI1005-39N
Abstract: LMCI1005-8N2
Text: Low Value Multilayer Chip Inductors Features • Low inductance — down to 1.0 nH • Suitable for high frequency applications • Monolithic structure • Excellent solderability for either flow or reflow soldering Unit: mm inch Dimensions SERIES W L T
|
Original
|
PDF
|
|
b 803 a
Abstract: GHM3045 GHM3145 GRM40CH GRM40 GRH110 GRM40B103K GRM40-T0 GRM42-6 5150JIS
Text: このカタログはNo.C02-6をムラタのwebサイトよりPDF形式でダウンロードしたものです。 C02J6.pdf 00.1.26 チップ積層セラミックコンデンサ CHIP MONOLITHIC CERAMIC CAPACITOR Cat.No.C02-6 このカタログはNo.C02-6をムラタのwebサイトよりPDF形式でダウンロードしたものです。
|
Original
|
PDF
|
C026webPDF
C02J6
C02-6
GRM36
GRM441
GRM39
GRM441
GRM33
b 803 a
GHM3045
GHM3145
GRM40CH
GRM40
GRH110
GRM40B103K
GRM40-T0
GRM42-6
5150JIS
|
GR42-6
Abstract: 2j 103k GR43-2 GHM3145 GHM3045 rr 102k 2kv rr 681k- 1kv capacitor GRM42-6 rr 471k 1kv GRM40B103K
Text: This is the PDF file of catalog No.C02E-4. No.C02E4.pdf 98.8.21 Chip Monolithic Ceramic Capacitor CHIP MONOLITHIC CERAMIC CAPACITOR Murata Manufacturing Co., Ltd. Cat.No.C02E-4 This is the PDF file of catalog No.C02E-4. No.C02E4.pdf 98.8.21 Chip Monolithic Ceramic Capacitor
|
Original
|
PDF
|
C02E-4.
C02E4
C02E-4
GRM33
GRM36YGRM44-1
GRM39YGRM44-1
GRM33
GRM40-024
GR42-6
2j 103k
GR43-2
GHM3145
GHM3045
rr 102k 2kv
rr 681k- 1kv capacitor
GRM42-6
rr 471k 1kv
GRM40B103K
|
HP8753A
Abstract: HP-8753A 16091A HP-85046A HP16091A 0R68 CAP 10nF 200V 0603 signal path designer
Text: Cal-Chip Electronics, Incorporated CHQ SERIES Surface Mount Chip Capacitors: Ultra High Frequency High Frequency Measurement and Performance of High ‘Q’ Multilayer Ceramic Capacitors Introduction Capacitors used in High Frequency applications are generally
|
Original
|
PDF
|
|
4N7k 250
Abstract: No abstract text available
Text: Low Value Multilayer Chip Inductors Features • Low inductance — down to 1.0 nH • Suitable for high frequency applications • Monolithic structure • Excellent solderability for either flow or reflow soldering Unit: mm inch Dimensions SERIES W L T
|
Original
|
PDF
|
|
HP16091A
Abstract: HP4191A HP16192A A95E VP-2811A
Text: TYPE M uttU ayer C h ip In d u c to rs 50 LL2012-F m LL1608-FH LL1005-FH S e rie s m m m TAPING SPECIFICATIONS/' x —fcf> 1 Chip's placing Chip Inductors are packed into 8mm width, 4 or 2mm pitch plastic or paper tape and enclosed with cover tape. (2) Carriage hole position
|
OCR Scan
|
PDF
|
LL2012-F
LL1608-FH
LL1005-FH
LL2012-F
LL1005-FH
VP-2811A
HP8753C
HP16091A
HP16091A
HP4191A
HP16192A
A95E
VP-2811A
|
HP16091A
Abstract: HP4291A HP16092A Tape and Reel Packaging Specifications panasonic VP-2811A vp2811a
Text: Packaging & Testing Taping Specifications 1 Chip Placement Chips are packed in 8mm, 4mm, or 2mm pitch plastic tape and enclosed by a cover tape. (2) Carriage hole positions Carriage hole position is on the right side of the tape when the sealing tape is on top.
|
OCR Scan
|
PDF
|
LL2012-F
LL1608-F/FH
LL1005-FH
FSLU2520
FSLP2520
HP4291A
/HP4191A
LL1608-F/FH
LL2012F)
HP16091A
HP4291A HP16092A
Tape and Reel Packaging Specifications panasonic
VP-2811A
vp2811a
|
Untitled
Abstract: No abstract text available
Text: Features High Q values. High SRF. Wide inductance range, 1nH to 3.3 pH Excellent solderability and resistance to soldering heat suitable for flow or reflow soldering. High reliability and high speed surface mount assembly. 0603 SIZE 1 S Dimensions □ T ALL OTHER SIZES
|
OCR Scan
|
PDF
|
|
Untitled
Abstract: No abstract text available
Text: Features ^ Low inductance — down to 1.2 nano Henry’s. « Suitable for high frequency applications. Monolithic structure. » Excellent solderability for either flow or reflow soldering. Dimensions Unit: mm inch TYPE L W T a LMCI 1608 (0603) 1.6 ± 0.15
|
OCR Scan
|
PDF
|
10OnH
Tolera000
HP4191A
100MHz
HP16092A)
HP8753C
HP16091A)
VP-2811A
|