HOT AIR BGA Search Results

HOT AIR BGA Result Highlights (5)

Part	Manufacturer	Description
D1U54T-M-2500-12-HB4C	Murata Manufacturing Co Ltd	2.5KW 54MM AC/DC 12V WITH 12VDC STBY BACK TO FRONT AIR
MPC860PZQ50D4	Rochester Electronics LLC	32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357
MPC860PVR80D4	Rochester Electronics LLC	32-BIT, 80MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357
MPC855TCZQ50D4	Rochester Electronics LLC	32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357
MPC860TCZQ50D4	Rochester Electronics LLC	32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357

HOT AIR BGA Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
7007S Abstract: BARb TRANSISTOR SMD Diode HER 507 Text: WOW! Catalogue World of Weller Inhalt 2 Page 06 – Seite 219 Soldering, Microtools, Desoldering, Hot Air, Rework, Fume Extraction, Electronic Screwdrivers, Dispensing Systems, Accessories, etc. Page 220 – Seite 323 Tweezers, Cutters, Pliers, EROP, Stripping Tools, Kits, etc.	Original	PDF
Untitled Abstract: No abstract text available Text: PCBs for SMD Solder Practice RE713001-LF - PCB for solder practices pick-and-place for BGA 169 and 225 grid 1.50 mm including daisychain test points - introduction into trend-setting technology - EPOXY resin FR4 1.50 mm single-sided 35 µm CU - solder side hot air leveling coated HAL-leadfree ; solder stop mask and additional print	Original	PDF	RE713001-LF
850 SMD Rework Station Abstract: EC 2000 weller weller t 3000 WRS3000 Weller Electronics WST20 WRS1001 weller soldering station wrs3000 WTA50 WHA700 Text: Weller Cooper Tools Soldering, Desoldering and Rework Systems Weller Thermal Tweezer and Tips Weller¨ WHA 700 and WHA 2000 Hot Air SMD Rework Systems The Weller WTA50 Thermal Tweezers are designed for quick and easy removal of small two-sided SMT components. Tips ranging in size from 1 mm .040" to 12.5 mm (.492") tip are available. These	Original	PDF	WTA50 WRS1000 WRS3000 WTA50. WTA50 EC1201AP. WT50SET. 984Q9730. WRS1001. 984Q9720. 850 SMD Rework Station EC 2000 weller weller t 3000 Weller Electronics WST20 WRS1001 weller soldering station wrs3000 WHA700
reballing Abstract: Alpha WS609 solder reflow hot air BGA solder paste alpha WS609 WS609 Lead Free reflow soldering profile BGA BGA PROFILING BGA Ball Crack Alpha WS609 reball Text: BGA REBALLING INSTRUCTIONS Notice Mention of third-party products is for informational purposes only and constitutes neither an endorsement nor a recommendation. Emulation Techology assumes no responsibility with regard to the performance of these products.	Original	PDF
spst reed relay Abstract: Lead Free reflow soldering profile BGA 5B31-02 78234 relay spst reflow hot air BGA fine BGA thermal profile Text: BGA Series BGA SERIES MEDER electronic CRF Series High Frequency Reed Relays CRR Series SPST Reed Relays RM Series 4pol Relay Module RM Series 6pol Relay Module 2 bga.p65 www.meder.com Europa # +49- 0 7733-94870, USA # 800-870-5385 2 22.09.2004, 14:59 MEDER electronic	Original	PDF	CH-8197 F-91971 CZ-10400 spst reed relay Lead Free reflow soldering profile BGA 5B31-02 78234 relay spst reflow hot air BGA fine BGA thermal profile
wsp80 Abstract: weller wsd81 WRS3000 weller MT1500 WSD81 WQB3000 weller soldering tip wsd81 weller wsp80 WHA2000 WES50 Text: CooperTools Weller ELECTRONIC SOLDERING AND DESOLDERING TOOLS 1 Weller® Soldering Table of Contents Founded in 1945, Weller® has become the world’s leading supplier of professional quality soldering equipment, including the famous Weller® temperature controlled irons and soldering guns. Weller® also makes advanced	Original	PDF	WSD81 WSD161 MT1500 CT02-9564/AC/12181/25M/Printed wsp80 weller wsd81 WRS3000 weller MT1500 WSD81 WQB3000 weller soldering tip wsd81 weller wsp80 WHA2000 WES50
Intel reflow soldering profile BGA Abstract: all ic data infrared heating gun 82425EX 80c196kb 1988 28F010 80C196KB pcb warpage after reflow Intel reflow soldering profile BGA intel conveyor belt alignment Text: Board Solder Reflow Process Recommendations 9.1 9 Introduction In reflowed board assemblies, the solder joint quality is affected by several variables such as the component, SMT Surface Mount Technology assembly conditions, solder paste, reflow profile and board design.	Original	PDF	conductivi49-58. Intel reflow soldering profile BGA all ic data infrared heating gun 82425EX 80c196kb 1988 28F010 80C196KB pcb warpage after reflow Intel reflow soldering profile BGA intel conveyor belt alignment
all ic data Abstract: Intel reflow soldering profile BGA infrared heating gun 82425EX intel 80486 DX4 hot air bga land pattern for TSOP TSOP infrared 80c196kb 1988 land pattern QFP 208 Text: 2 9 Board Solder Reflow Process Recommendations 1/16/97 5:29 PM CH09WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 9 BOARD SOLDER REFLOW PROCESS RECOMMENDATIONS 9.1. INTRODUCTION In reflowed board assemblies, the solder joint quality is affected by several variables such as	Original	PDF	CH09WIP all ic data Intel reflow soldering profile BGA infrared heating gun 82425EX intel 80486 DX4 hot air bga land pattern for TSOP TSOP infrared 80c196kb 1988 land pattern QFP 208
WELLER EC 2001 Abstract: WELLER LR 20 TIP weller WECP-80 weller soldering ecp weller soldering tip TCP weller wecp 20 weller wecp 50 DS801 WELLER "5 10 201 99" WELLER 5 24 110 99 Text: S o l d e r i n g , D e s o l d e r i n g , R e w o r k / R e p a i r To o l s a n d To r c h e s Weller Contents Temtronic / SL-Series 77 - 97 Stations Options Soldering Tips Exin-5 IC-Extractor SFA / SFC 78 80 84 92 94 96 - 79 83 91 93 95 97 Magnastat	Original	PDF
Untitled Abstract: No abstract text available Text: PCB for Pick and Place Soldering Practice for BGA 169 and 225 RE713001-LF - PCB for solder practices pick-and-place for BGA 169 and 225 grid 1.50 mm including daisychain test points - introduction into trend-setting technology - EPOXY resin FR4 1.50 mm single-sided 35 µm CU	Original	PDF	RE713001-LF
IPC-7525 Abstract: ipc 7525 IPC-9502 AN-9036 IPC9502 FDMS8660S JESD22-102D Soldering guidelines pin in paste JESD22-102 FDMS8660AS Text: AN-9036 Guidelines for Using Fairchild's Power56 Dennis Lang, Staff Engineer Introduction The Power56 minimizes both Printed Wiring Board PWB space and RDS(ON) in a convenient, familiar SO-8 sized footprint, with the addition of a large drain tab for improving thermal	Original	PDF	AN-9036 Power56 Power56 FDMS8460, FDMS8660AS, FDMS8660S, FDMS8662, FDMS8670AS, IPC-7525 ipc 7525 IPC-9502 AN-9036 IPC9502 FDMS8660S JESD22-102D Soldering guidelines pin in paste JESD22-102 FDMS8660AS
heller 1700 Abstract: BGA reflow guide reflow hot air BGA BGA PACKAGE thermal profile pcb warpage after reflow BGA Solder Ball collapse Text: APPLICATION NOTE Mobile Pentium II Processor Mini-Cartridge 240-Pin BGA Connector Assembly Development Guide April 1998 Order Number: 243759-001 Mobile Pentium ® II Processor Mini-Cartridge 240-Pin BGA Connector Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any	Original	PDF	240-Pin heller 1700 BGA reflow guide reflow hot air BGA BGA PACKAGE thermal profile pcb warpage after reflow BGA Solder Ball collapse
Calculation Form Abstract: kyocera 455 TCXO SMD mtbf DLIFMXAXF1216 supercapacitor DNCFM1K4B9756 DNCFM1K4C1307 DNCFM1K4D1627 IEC60068 IEC61071 Text: www.avx.com AVX High Power Capacitors For Power Electronics Version 9.5 Contents Capacitors for High Power Electronics FIM PRODUCTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-10	Original	PDF	S-HPC0M509-C Calculation Form kyocera 455 TCXO SMD mtbf DLIFMXAXF1216 supercapacitor DNCFM1K4B9756 DNCFM1K4C1307 DNCFM1K4D1627 IEC60068 IEC61071
TSOP infrared Abstract: proof hot air bga reflow hot air BGA "Humidity Indicator Card" Hitachi DSA0015 baking Text: ASSEMBLY 7-1 Soldering Methods for Various Surface Mount Packages QFP SOP TQFP TSSOP QFJ LQFP SSOP TSOP HQFP SOJ HSOP Soldering Methods Partial Heating Methods QFI HSOI G-QFP G-QFJ QFN LDPAK S Other discrete BGA HQFI packages not FBGA (CSP) listed to the left	Original	PDF

Application Note SO8 Exposed Abstract: hot air bga FDS7066N3 FDS7066N7 J-STD-020B AN-705 Text: November 2002 Application Note 7005 Mounting Techniques for BottomlessTM SO-8 Dennis Lang, Applications Engineer Introduction The Bottomless SO-8 minimizes both Printed Circuit Board PCB space and RD S ( O N ) in a convenient SO-8 sized package. The Bottomless SO-8 employs a breakthrough in packaging	Original	PDF	AN7055 Application Note SO8 Exposed hot air bga FDS7066N3 FDS7066N7 J-STD-020B AN-705
M9627 Abstract: uPC451g SMD 6PIN IC MARKING CODE PR-53365 NIHON SMD MARKING codes sealed relay ge mil 7451 UPD65013 smd code marking NEC g GE4F tanaka AL wire Text: SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL 1989 Document No. C10535EJ8V0IF00 8th edition Date Published February 1997 N Printed in Japan No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in	Original	PDF	C10535EJ8V0IF00 M9627 uPC451g SMD 6PIN IC MARKING CODE PR-53365 NIHON SMD MARKING codes sealed relay ge mil 7451 UPD65013 smd code marking NEC g GE4F tanaka AL wire
marking code SMD Transistor 2ak Abstract: smd code marking NEC g TRANSISTOR SMD MARKING CODE 3401 transistor 5dx smd fairy liquid marking code AE SMD Transistor UPD65013 1.6/SmD TRANSISTOR av Ultrasonic humidifier circuit koki solder paste Text: Information SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL Document No. C10535EJ9V0IF00 9th edition Date Published December 1997 N Printed in Japan 1989 [MEMO] No part of this document may be copied or reproduced in any form or by any means without the prior written	Original	PDF	C10535EJ9V0IF00 marking code SMD Transistor 2ak smd code marking NEC g TRANSISTOR SMD MARKING CODE 3401 transistor 5dx smd fairy liquid marking code AE SMD Transistor UPD65013 1.6/SmD TRANSISTOR av Ultrasonic humidifier circuit koki solder paste
hand movement based fan speed control Abstract: No abstract text available Text: InnovationS in thermal management DESIGN SERVICES and rapid prototyping E CREATE CREAT Through its computational facilities and thermal/fluids laboratories, ATS specializes in providing thermal analysis, mechanical and design services for telecommunications,	Original	PDF	CWT-125 CLWTC-1000 HP-97TM hand movement based fan speed control
Intel reflow soldering profile BGA Abstract: A5832 JEDEC bga 63 tray Intel BGA cte table epoxy substrate BGA PROFILING A4470-01 Lead Free reflow soldering profile BGA land pattern BGA 196 a5764 Text: Ball Grid Array BGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads) packages are many. Having no leads to bend, the PBGA has greatly reduced coplanarity problems	Original	PDF
GE4F Abstract: UPD65013 74022a SMD BGA 672 DRAWING ULF-210R TRANSISTOR SMD MARKING CODE 352 UPD7514 UPC451G2 smd TRANSISTOR code YW UPD74HC00 Text: Information SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL Document No. C10535EJ9V0IF00 9th edition Date Published December 1997 N Printed in Japan 1989 [MEMO] No part of this document may be copied or reproduced in any form or by any means without the prior written	Original	PDF	C10535EJ9V0IF00 GE4F UPD65013 74022a SMD BGA 672 DRAWING ULF-210R TRANSISTOR SMD MARKING CODE 352 UPD7514 UPC451G2 smd TRANSISTOR code YW UPD74HC00
ceramic rework Abstract: CCGA BGA Solder Ball collapse 90Pb 10Sn solder paste 304-pin ltcc MPC105 MPC106 MPC107 BGA PROFILING spray nozzles Text: Ceramic Ball Grid Array Packaging, Assembly & Reliability Freescale Semiconductor 1 Outline for Discussion • • • • • • Why BGA? CBGA Introduction and Package Description PC Board Design for CBGA CBGA Assembly Rework Board-Level Solder Joint Reliability	Original	PDF	25x25x1 ceramic rework CCGA BGA Solder Ball collapse 90Pb 10Sn solder paste 304-pin ltcc MPC105 MPC106 MPC107 BGA PROFILING spray nozzles
marx and generator Abstract: SIMCARD disfim GUNS marx generator varicon avx quartz Text: High Power Capacitors Calculation Form DESIGN Specification Your Choice Capacitance Working voltage Rms current Frequency Ripple voltage Ambient temperature Lifetime @ Vw,Irms and θamb Parasitic inductance Cooling conditions C µF Vw (V) Irms (Arms) F (Hz)	Original	PDF
WQB3000 Abstract: No abstract text available Text: 1 BGAI QFP-Rework System WQB 3000 Betriebsanleitung Operating Instruction Version 1.1 2 T a b la of Contents 1 Description T&çhnfcal u'ata 2 Start-up 2.1 Eei-up 2.2 Preliminaries 2.3 Attachment and al.gnmentof the circuit boarri and soldering nozzle 3 Operation with the Programming unit	OCR Scan	PDF	O20090 WQB3000
BGA-169 Abstract: No abstract text available Text: PCB for Pick and Place Soldering Practice for BGA 169 and 225 HP = FR2 - P henolharzhartpapier / S RBP-Paper / Résine phénolplaste / papel duro a base de résina fenôlica EP = FR4 - E poxydglashartgewebe / epoxy fibre-glas / fibre de verre époxyde / epöxido	OCR Scan	PDF

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HOT AIR BGA Search Results

HOT AIR BGA Result Highlights (5)

HOT AIR BGA Datasheets Context Search

7007S

Untitled

850 SMD Rework Station

reballing

spst reed relay

wsp80

Intel reflow soldering profile BGA

all ic data

WELLER EC 2001

Untitled

IPC-7525

heller 1700

Calculation Form

TSOP infrared

Application Note SO8 Exposed

M9627

marking code SMD Transistor 2ak

hand movement based fan speed control

Intel reflow soldering profile BGA

GE4F

ceramic rework

marx and generator

WQB3000

BGA-169