HL832 PCB MATERIAL Search Results

HL832 PCB MATERIAL Result Highlights (5)

Part	Manufacturer	Description
UE62B46230S021	Amphenol Communications Solutions	1x4 OSFP cage with stainless steel material
UE62B46200S021	Amphenol Communications Solutions	1x4 OSFP cage with stainless steel material
ZLEDPCB2	Renesas Electronics Corporation	LED Test PCBs
ZLEDPCB10	Renesas Electronics Corporation	LED Test PCB - 12x 0.5W
ZLEDPCB1B	Renesas Electronics Corporation	LED Test PCB - 3W

HL832 PCB MATERIAL Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
PSR4000 AUS308 Abstract: prepreg GHPL-830 taiyo AUS703 taiyo PSR4000 aus303 GHPL-830 THP 100 PSR4000 AUS703 Hitachi MCL-E-679FG MGC HL832 MCL-E-679FG Text: Ball Grid Array Ball Grid Array • INTRODUCTION Ball Grid Array BGA is the one of package type which using the SMT. BGA package has several advantages for it's electrical, mechanical and thermal characteristics and these characteristics can come from it's outstanding structure. By using the PCB board and solder ball array	Original	PDF	HL832 HL832-HS HL832-NB MCL-E-679W MCL-E-679BR MCL-E-679FG GHPL-830 GEA-679N MR600 GHPL-830 PSR4000 AUS308 prepreg GHPL-830 taiyo AUS703 taiyo PSR4000 aus303 THP 100 PSR4000 AUS703 Hitachi MCL-E-679FG MGC HL832 MCL-E-679FG
AU-85B Abstract: Taiyo AUS-308 bi8921t prepreg GHPL-830 Bi8921 GHPL-830 GHPL MOMBD420G1A GHPL prepreg Samsung CMOS Image sensor Text: Specification for Approval Samsung Electro-Mechanics Co.,LTD PDF created with pdfFactory Pro trial version www.pdffactory.com Specification for Approval Revision History Rev. Date Description of Change Rev. Page 1 2005.07.30 The Primary Specification 1.0 Rev.	Original	PDF	AU-85B MOMBD420G1A AU-85B Taiyo AUS-308 bi8921t prepreg GHPL-830 Bi8921 GHPL-830 GHPL MOMBD420G1A GHPL prepreg Samsung CMOS Image sensor

Catalog Datasheet

MFG & Type

PDF

Document Tags

PSR4000 AUS308

Abstract: prepreg GHPL-830 taiyo AUS703 taiyo PSR4000 aus303 GHPL-830 THP 100 PSR4000 AUS703 Hitachi MCL-E-679FG MGC HL832 MCL-E-679FG
Text: Ball Grid Array Ball Grid Array • INTRODUCTION Ball Grid Array BGA is the one of package type which using the SMT. BGA package has several advantages for it's electrical, mechanical and thermal characteristics and these characteristics can come from it's outstanding structure. By using the PCB board and solder ball array

Original

PDF

HL832 HL832-HS HL832-NB MCL-E-679W MCL-E-679BR MCL-E-679FG GHPL-830 GEA-679N MR600 GHPL-830 PSR4000 AUS308 prepreg GHPL-830 taiyo AUS703 taiyo PSR4000 aus303 THP 100 PSR4000 AUS703 Hitachi MCL-E-679FG MGC HL832 MCL-E-679FG

AU-85B

Abstract: Taiyo AUS-308 bi8921t prepreg GHPL-830 Bi8921 GHPL-830 GHPL MOMBD420G1A GHPL prepreg Samsung CMOS Image sensor
Text: Specification for Approval Samsung Electro-Mechanics Co.,LTD PDF created with pdfFactory Pro trial version www.pdffactory.com Specification for Approval Revision History Rev. Date Description of Change Rev. Page 1 2005.07.30 The Primary Specification 1.0 Rev.