HEATSINK U FORM Search Results

1001 dl pwm

Abstract: etri converter SC1188 Si4410 CS16 IRL2203 IRLR024N SC1188CS bst03 DL 1416
Contextual Info: SC1188 Programmable Synchronous DC/DC Converter, Dual Low Dropout Regulator Controller POWER MANAGEMENT Description Features u Synchronous design, enables no heatsink solution u 95% efficiency switching section u 4 bit DAC for output programmability u 1.8V, 2.5V short circuit protected linear controllers

Contextual Info: Package outline HBGA584: plastic thermal enhanced ball grid array package; 584 balls; body 37.5 x 37.5 x 1.42 mm; heatsink B D SOT707-1 A ball A1 index area A E A2 A1 detail X C e1 b e AH AF AD AB Y V T P M K H F D B AJ AG e AE AC AA W heatsink U e2 R N L

Contextual Info: Package outline HBGA600: plastic thermal enhanced ball grid array package; 600 balls; body 40 x 40 x 0.9 mm; heatsink B D SOT605-1 A ball A1 index area A A2 A1 E A4 detail X C e1 f1 e AK AH AF AD AB Y F B AJ AG AE e AC heatsink AA e2 R M D AL U T P H N L J

Contextual Info: Package outline HBGA672: plastic thermal enhanced ball grid array package; 672 balls; body 40 x 40 x 1.2 mm; heatsink B D SOT835-1 A ball A1 index area A A2 A1 E A4 detail X C e1 f1 e AK AH AF AD AB Y V T P M K H F D B AJ AG AE e AC heatsink AA W U e2 R N

Contextual Info: Package outline HBGA504: plastic thermal enhanced ball grid array package; 504 balls; body 35 x 35 x 0.9 mm; heatsink B D SOT604-1 A ball A1 index area A A2 A1 E A4 detail X C e1 f1 e AF AB T F D B heatsink R M H e AA U P K AE AC W V y ∅w M C AG AD Y y1 C

Contextual Info: Package outline HBGA520: plastic thermal enhanced ball grid array package; 520 balls; heatsink SOT1088-1 B D A D1 ball A1 index area A j A2 E1 E A1 detail X C e1 e AF AD AB Y V AE AC AA e W heatsink U T R P e2 N M L K 1/2 e J H G F E D C B A 1 shape 2 optional 4x

Contextual Info: Package outline HBGA329: plastic, thermal enhanced ball grid array package; 329 balls; body 31 x 31 x 1.75 mm; heatsink SOT714-1 B D A D1 ball A1 index area A j A2 A1 E1 E detail X C e1 b e AC AB AA Y W V U T R P N M L K J H G F E D C B A e heatsink e2 1 shape

Contextual Info: Package outline HBGA552: plastic thermal enhanced ball grid array package; 552 balls; body 37.5 x 37.5 x 1.42 mm; heatsink B D SOT706-1 A ball A1 index area A E A2 A1 detail X C e1 b e AH AF Y AE e AC AA W V heatsink U T e2 R P N M L K J H G F E D C B A 1

Contextual Info: Package outline HBGA324: plastic thermal enhanced ball grid array package; 324 balls; heatsink SOT1123-2 B D D1 A ball A1 index area E1 j E A A2 A1 detail X e1 e 1/2 e ∅v ∅w b AB AA Y W V U T R P N M L K J H G F E D C B A C C A B C y y1 C e heatsink e2

Contextual Info: Package outline HBGA352: plastic, heatsink ball grid array package; 352 balls; body 35 x 35 x 0.9 mm B D SOT546-2 A ball A1 index area A2 E A1 A A3 detail X e1 b e AE AC AA W U R N L J G E C A C v M B ZD1 ∅w M y y1 C v M A AF AD AB e Y heatsink V T P e1

Contextual Info: Package outline HBGA324: plastic thermal enhanced ball grid array package; 324 balls; heatsink SOT1123-1 B D D1 A ball A1 index area E1 j E A A2 A1 detail X e1 e 1/2 e ∅v ∅w b AB AA Y W V U T R P N M L K J H G F E D C B A C C A B C y y1 C e heatsink e2

Contextual Info: Package outline HBGA360: plastic, thermal enhanced ball grid array package; 360 balls; heatsink SOT1163-1 B D D1 A ball A1 index area E1 j E A2 A A1 detail X e1 e 1/2 e ∅v ∅w b AB AA Y W V U T R P N M L K J H G F E D C B A C C A B C y y1 C e heatsink e2

Contextual Info: l e l u o m Semiconductor, Inc. TC622 TC624 LOW COST, SINGLE TRIP POINT TEMPERATURE SENSOR FEATURES • ■ ■ ■ Temperature Set Point Easily Programs with a Single External Resistor Operates with 2.7V Power Supply TC624 TO-220 Package for Direct Mounting to Heatsink

d0311

Abstract: Schottky 2,1A 40v MTBF
Contextual Info: Technical Specification IQ1BxxxHPXxx 66-160V 3.3-48V 255W 3000V dc Half-brick Continuous Input Outputs Max Power REINFORCED INSULATION DC-DC Converter A N @ 48 T U PC 5V O IN V -1 IQ 66 High efficiency, 91% at full rated load current Delivers full power with minimal derating - no heatsink required

PC1215

Abstract: BPC35
Contextual Info: :m ic q n d u c to r T m GBPC 12,15, 25, 35 SERIES H O L E FOR # 1 0 S C R E W Features 0.22 5.59i • Integrally m olded heatsink provided very low therm al resistance for maximum heat dissipation. GBPC 0.25(6.35 • Surge overload rartings from 300 am peres to

LT 5320 DIODE

Abstract: LT 5320
Contextual Info: NEC 400m w ZENER DIO DE ELECTRON DEVICE 1N746A— 1N759A 1 N 7 4 6 A ~ 1 N 7 5 9 A are D H D {Double Heatsink Diode construction planar type O U T L IN E D R A W IN G zener diodes possessing an allowable power dissipation of 400 m watt. FEATURES Unit : mm)

dc-dc converter step up 12v t0 48v

Abstract: IQ72120HPx21
Contextual Info: Technical Specification IQ72xxxHPXxx 42-110V 1.8-48 V 255 W 3000 V dc Half-brick Continuous Input Outputs Max Power REINFORCED INSULATION DC-DC Converter R 46 N @ 46 T U PC 5V O 0H IN V 10 IQ High efficiency, 91% at full rated load current Delivers full power with minimal derating - no heatsink required

Zener diode 224

Abstract: RD24E RD22E RD2.4E zener rd9.1esb2
Contextual Info: NEC 5 0 0 m w ZENER D IO D E ELECTRON DEVICE R D 2.0E —RD 100E Outline Drawing U nit: mm NEC Type RD l“ J E Series are DHD (Double Heatsink Diode) construction planar type zener diodes possessing an allowable power dissipation of 500 m watt. T FEA TU R E S

Contextual Info: Package outline Ceramic single-ended flat package; heatsink mounted; 2 mounting holes; 12 in-line tin Sn plated leads SOT347 D y U q A P F S U1 G E L 1 12 e Z b c v A w M Q A 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A b c D E e F G

Contextual Info: Package outline Ceramic single-ended flat package; heatsink mounted; 2 mounting holes; 12 in-line tin Sn plated leads SOT347B D y U q A P F S U1 G E L 1 12 e Z b c v A w M Q A 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A b c D E e F G

Contextual Info: Package outline Ceramic single-ended flat package; heatsink mounted; 1 mounting hole; 11 in-line gold-metallized leads SOT451A D y U A p F S U1 G E L 1 11 e b c v A w M Q A 5 10 mm scale DIMENSIONS mm are the original dimensions UNIT A b c D E e F G L p

Contextual Info: Package outline HBGA456: plastic thermal enhanced ball grid array package; 456 balls; body 27 x 27 x 1.75 mm; heatsink SOT900-1 B D A D1 ball A1 index area A j A2 E1 E A1 detail X C e1 e 1/2 e y y1 C ∅v M C A B b ∅w M C AF AD AB Y AE AC AA e W V U T R

Contextual Info: Package outline HBGA736: plastic thermal enhanced ball grid array package; 736 balls; heatsink SOT1035-1 B D D1 A ball A1 index area E1 j E A2 A A1 detail X e1 e C ∅v ∅w b 1/2 e AP AN AM AL AK AJ AH AG AF AE AD AC AB AA Y W V U T R P N M L K J H G F E

Contextual Info: Package outline HBGA624: plastic thermal enhanced ball grid array package; 624 balls; heatsink SOT1095-1 B D D1 A ball A1 index area j E1 E A2 A A1 detail X e1 e 1/2 e ∅v ∅w b AP AN AM AL AK AJ AH AG AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D