Untitled
Abstract: No abstract text available
Text: Accessories Heat Sinks Power-One has a wide range of standard and specialized heat sinks available for our converters. Shown below are standard product heat sinks. The heat sink kits include the heat sink, thermal pad, and mounting hardware. On horizontal heat
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HAS/HBC/HBCS/HHSK-HBX500-24H
HSK-HBX500-45H
HSK-HBX500-60H
HSK-HBX500-95H
HSK-HBX500-24V
HSK-HBX500-45V
HSK-HBX500-60V
HSK-TQD500-95H
HSK-TQD500-24V
HSK-TQD500-45V
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050074
Abstract: heat pipes X5570 E5520 E5530 LGA1366 E5506 heat pipes intel
Text: Xeon 5500 Series 2U High Performance Heat Sink RoHS Compliant PASSIVE HEAT SINK FOR INTEL XEON 5500 SERIES PROCESSORS Aavid’s line of 5500 series processor heat sinks are suitable for mainstream PCs. Their unique design removes heat using heat pipes, copper,
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E5520
Abstract: LGA1366 E5530 E5506 heat pipes E5540
Text: Xeon 5500 Series 1U High Performance Heat Sink RoHS Compliant PASSIVE HEAT SINK FOR INTEL XEON 5500 SERIES PROCESSORS Aavid’s line of 5500 series processor heat sinks are suitable for mainstream servers. Their unique design removes heat using heat pipes, copper,
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050232
Abstract: Intel Xeon 5500 heat pipes LGA1366 X5570 AAvid 050232 Xeon 5500 X557
Text: Xeon 5500 Series 1U High Performance Heat Sink RoHS Compliant PASSIVE HEAT SINK FOR INTEL XEON 5500 SERIES PROCESSORS Aavid’s line of 5500 series processor heat sinks are suitable for mainstream servers. Their unique design removes heat using heat pipes, copper,
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050235
Abstract: heat pipes E5520 E5504 E5530 LGA1366 E5506 shinetsu
Text: Xeon 5500 Series Blade High Performance Heat Sink RoHS Compliant PASSIVE HEAT SINK FOR INTEL XEON 5500 SERIES PROCESSORS Aavid’s line of 5500 series processor heat sinks are suitable for mainstream servers. Their unique design removes heat using heat pipes, copper,
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050075
Abstract: E5540 LGA1366 Intel Xeon 5500 l5520 heat pipes E5506 W3520 E5520 E5530
Text: Xeon 5500 Series 4U High Performance Heat Sink RoHS Compliant PASSIVE HEAT SINK FOR INTEL XEON 5500 SERIES PROCESSORS Aavid’s line of 5500 series processor heat sinks are suitable for mainstream servers. Their unique design removes heat using heat pipes, copper, and
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050233
Abstract: E5504 Aavid thermalloy 9000 heat pipes intel E5520 E5530 LGA1366 x.25 intel E5506 aavid
Text: Xeon 5500 Series Active 2U High Performance Heat Sink RoHS Compliant PASSIVE HEAT SINK FOR INTEL XEON 5500 SERIES PROCESSORS Aavid’s line of 5500 series processor heat sinks are suitable for mainstream desktop PCs. Their unique design removes heat using heat pipes, copper, and
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Untitled
Abstract: No abstract text available
Text: Extruded Heat Sinks for DC/DC Converters 14 Heat sinks for “Full-Brick” DC/DC Converters Heat sinks for “Full-Brick” DC/DC Converters Standard mounting slots mate with Vicor DC/DC converters. Optimized aluminum extruded fin construction transfers heat efficiently
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RT3830C00000
RT3835C00000
RT3845C00000
RT3840C00000
RT3830C00000
RT3835C00000
RT3840C00000
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Untitled
Abstract: No abstract text available
Text: THERMAL MANAGEMENT PRODUCTS CATALOG CTS ELECTRONIC COMPONENTS www.ctscorp.com CTS ® TABLE OF CONTENTS PAGE FAN HEAT SINKS 3 ADHESIVE PEEL AND STICK HEAT SINKS 6 FORGED HEAT SINKS WITH PLATE FINS 7 FORGED HEAT SINKS WITH PIN FINS 9 CLIP AND TAPE STYLES
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O-126,
O-202,
O-218
O-220
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642-45AB
Abstract: No abstract text available
Text: Integrated Circuit Heat Sinks PENGUIN COOLERS: HEAT SINKS FOR MICROPROCESSORS, ASICs AND BGAs 660 SERIES Standard P/N 660-29AB ̆ Unidirectional Fin Heat Sink for PowerPC™ 603 32 mm, 40 mm C4QFP Base Dimensions in. mm Height in. (mm) Heat Sink Finish
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660-29AB
642-25AB
642-35AB
642-45AB
642-60AB
642-45AB
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80486DX
Abstract: AMD 80486DX AM486TMdx4 helium gas sensor module 80486DX2 AM29030 AM486 heat sink Heat Sinks 80486DX intel
Text: Integrated Circuit Heat Sinks PENGUIN COOLERS: HEAT SINKS FOR MICROPROCESSORS AND ASICs 662 SERIES Pin Fin Heat Sink for Limited Height Applications for Intel 80486DX, AMD AM29030 17 x 17 PGA Standard P/N Base Dimensions in. mm Height in. (mm) Heat Sink
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80486DX,
AM29030
662-15AG
628-20AB
628-25AB
628-35AB
628-40AB
628-65AB
80486DX2TM,
AM486TMDX2,
80486DX
AMD 80486DX
AM486TMdx4
helium gas sensor module
80486DX2
AM29030
AM486
heat sink
Heat Sinks
80486DX intel
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MATERIAL SAFETY DENATURED ALCOHOL
Abstract: TC-2707
Text: Technical Data November 2011 3M Thermally Conductive Interface Pads 5591 and 5591S Product Description 3M™ Thermally Conductive Interface Pads 5591 and 5591S are designed to provide a preferential heat-transfer path between heat-generating components and heat sinks, heat spreaders or other cooling devices.
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5591S
5591S
5591/5591S
225-3S-06
MATERIAL SAFETY DENATURED ALCOHOL
TC-2707
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Untitled
Abstract: No abstract text available
Text: Technical Data July, 2010 3M Thermally Conductive Interface Pads 5592 and 5592S Product Description 3M™ Thermally Conductive Interface Pads 5592 and 5592S are designed to provide a preferential heat-transfer path between heat-generating components and heat sinks, heat spreaders or other cooling devices.
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5592S
5592S
225-3S-06
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573300D00000G
Abstract: 411399
Text: Slalom Surface Mount Heat Sink for D2PAK RoHS Compliant SLALOM SURFACE MOUNT HEAT SINK Aavid Thermalloy introduces it newest innovation in SMT compatible heat sinks to meet the needs of newer higher power semiconductors. The heat sinks’ unique design Patent Pending combines the technology of
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Untitled
Abstract: No abstract text available
Text: Technical Data December 2013 3M Thermally Conductive Silicone Interface Pads 5519 and 5519S Product Description 3M™ Thermally Conductive Silicone Interface Pads 5519 and 5519S are designed to provide a preferential heat transfer path between heat generating components and heat sinks, heat spreaders or other cooling devices. These
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5519S
5519S
225-3S-06
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PF435
Abstract: PF434 PF436 PF432G PF435G 576802B04000G PF432 576802B03100G PF436G PF433
Text: TO-220 & TO-262 Heat Sinks Plug in style heat sink featuring four spring action clips FIGURE B FIGURE A 14.48 0.570 MAX 19.05 (0.750) Plug in style heat sink features four spring action clips to firmly hold the device to the heat sink ensuring maximum metal to
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O-220
O-262
PF436G
PF432,
PF433,
PF434,
PF435,
PF436
PF435
PF434
PF436
PF432G
PF435G
576802B04000G
PF432
576802B03100G
PF436G
PF433
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Heat Sinks
Abstract: No abstract text available
Text: HEAT SINKS FOR LEDs Preliminary JTI – HEAT SINKS FOR POWER LEDs 882 SERIES – RADIAL FIN HEAT SINK FOR “STAR” LED PACKAGES Wakefield's new 882 series heat sinks can be used with LEDs in the star package from Lumileds, Osram, and others. The radial design and
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zif rod
Abstract: No abstract text available
Text: – THERMAL MANAGEMENT PRODUCTS CATALOG www.ctscorp.com CTS TABLE OF CONTENTS PAGE HI-TEMP FAN HEAT SINKS 3 ADHESIVE PEEL AND STICK HEAT SINKS 6 FORGED HEAT SINKS WITH PLATE FINS 7 FORGED HEAT SINKS WITH PIN FINS 9 CLIP AND TAPE STYLES 10 ZIF STANDARD CIRCUIT BOARD RETAINERS
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O-126,
O-202,
O-218
O-220
zif rod
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QTM-500
Abstract: 5519S 5519
Text: Technical Data February 2012 3M Thermally Conductive Silicone Interface Pads 5519 and 5519S Product Description 3M™ Thermally Conductive Silicone Interface Pads 5519 and 5519S are designed to provide a preferential heat transfer path between heat generating components and heat sinks, heat spreaders or other cooling devices. These products consist
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5519S
5519S
225-3S-06
QTM-500
5519
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AAVID 1020
Abstract: 7106D 573100D00010 573100D00000 573300D00010 573400D00010 7109D 573300D00000 TO-263 footprint
Text: Surface Mount Heat Sinks For D-PAK, D2 PAK, D3 PAK, and SO-10 SURFACE MOUNT HEAT SINKS Aavid’s line of low profile surface mount heat sinks are suitable for SMT power semiconductor devices in D-PAK, D2PAK, D3PAK and SO-10 packages.Their unique design removes heat indirectly through conduction without making
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SO-10
SO-10
AAVID 1020
7106D
573100D00010
573100D00000
573300D00010
573400D00010
7109D
573300D00000
TO-263 footprint
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Untitled
Abstract: No abstract text available
Text: Technical Data June 2011 3M Thermally Conductive Silicone Interface Pad 5515-20 and 5515-25 Product Description 3M™ Thermally Conductive Silicone Interface Pads 5515-20 and 5515-25 are designed to provide a preferential heat transfer path between heat generating components and heat sinks, heat spreaders or other cooling devices. The 3M Pad
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225-3S-06
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ebonol
Abstract: 260-4TH5B ebonol c black 205cb AB-275 204-CB TUBE 1625 5 lead dd pak weight 260-6SH5B 205-CB
Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,
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O-220,
OT-223,
SOL-20
ebonol
260-4TH5B
ebonol c black
205cb
AB-275
204-CB
TUBE 1625
5 lead dd pak weight
260-6SH5B
205-CB
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8810
Abstract: Tape UL746A MH17478 UL746C UL-746A UL-746C UL-746C silicone rubber E213134 adhesive rubber based msds
Text: Technical Data April, 2008 3M Thermally Conductive Adhesive Transfer Tapes 8805 • 8810 • 8815 • 8820 Product Description 3M™ Thermally Conductive Adhesive Transfer Tapes 8805, 8810, 8815 and 8820 are designed to provide a preferential heat-transfer path between heat-generating components and heat sinks or other cooling devices e.g., fans, heat spreaders
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1-1W-10,
8810
Tape
UL746A
MH17478
UL746C
UL-746A
UL-746C
UL-746C silicone rubber
E213134
adhesive rubber based msds
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ebonol
Abstract: 217-36CT6 218-40CT3 218-40CT5 MO-169 204sb
Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,
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O-220,
OT-223,
SOL-20
ebonol
217-36CT6
218-40CT3
218-40CT5
MO-169
204sb
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