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    HC325FF Datasheets Context Search

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    EP3SE110F1152

    Abstract: f7807 EP3SE110-F1152 EP3SL110F780 107K hc335 WF484 EP3SE110F780 GEN-1002-00 EP3SL200-F1517
    Text: HardCopy III ASIC Product Table v0.995 HardCopy Base Die HardCopy III ASIC Package Body Size 2 WF484 (23 mm) FF484 (23 mm) HC325 WF780 (29 mm) FF780 (29 mm) Generic Part Number HC325WF484N HC325FF484N HC325WF780N HC325FF780N Stratix III FPGA Prototype 107K


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    PDF 18x18 EP3SE110--F7807 EP3SL200--H7807 EP3SL340--H11527 GEN-1002-00 EP3SE110F1152 f7807 EP3SE110-F1152 EP3SL110F780 107K hc335 WF484 EP3SE110F780 GEN-1002-00 EP3SL200-F1517

    HC325FF780

    Abstract: PT-HC325FF780-1 transistor 6c x FF780 AA34 H1152 HC325Ff78 AE-15
    Text: Pin Information for HardCopy III HC325FF780 Version 1.0 Bank Number VREF Group 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A VREFB1AN0 VREFB1AN0 VREFB1AN0 VREFB1AN0


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    PDF HC325FF780 PT-HC325FF780-1 HC325FF780 transistor 6c x FF780 AA34 H1152 HC325Ff78 AE-15

    transistor 6c x

    Abstract: HC325FF484 diode AG14 AH15 E20 L27 AA34 H1152 diode x9 FF484
    Text: Pin Information for HardCopy III HC325FF484 Version 1.0 Bank Number VREF Group 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A VREFB1AN0 VREFB1AN0 VREFB1AN0 VREFB1AN0 VREFB1AN0


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    PDF HC325FF484 PT-HC325FF484-1 transistor 6c x HC325FF484 diode AG14 AH15 E20 L27 AA34 H1152 diode x9 FF484

    EP3SL340F1517

    Abstract: altera cyclone 3 handbook texas instruments HC335FF1152 HC325Ff DDR3 jedec diode handbook fbga Substrate design guidelines hc335 texas instruments handbook
    Text: HardCopy III Device Handbook, Volume 1 101 Innovation Drive San Jose, CA 95134 www.altera.com HC3_H5V1-3.2 Copyright 2010 Altera Corporation. All rights reserved. Altera, The Programmable Solutions Company, the stylized Altera logo, specific device designations, and all other


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    EP4CE6 package

    Abstract: EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80
    Text: Package Information Datasheet for Altera Devices DS-PKG-16.3 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead


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    PDF DS-PKG-16 EP4CE6 package EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80

    HC335FF1152

    Abstract: HC325FF780 HC335 EP3SE110F1152 EP3SE110F
    Text: Section I. Device Core This section provides a complete overview of all features relating to the HardCopy III device family. HardCopy III devices are Altera’s latest generation of low-cost, high-performance, low power ASICs with pin-outs, densities, and


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    EIA-644

    Abstract: SSTL-15 SSTL-18 HC325Ff78 HC335f HC325FF780 HC325Ff
    Text: Section II. I/O Interfaces This section includes the following chapters: • Chapter 6, HardCopy III Device I/O Features ■ Chapter 7, External Memory Interfaces in HardCopy III Devices ■ Chapter 8, High-Speed Differential I/O Interfaces and DPA in HardCopy III


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    1517P

    Abstract: HC325 EP3SE110F HC335FF1152 verilog code for delta sigma adc m9ka hc335ff1152n 24BAN HC335LF1152
    Text: HardCopy III Device Handbook Volume 1: Device Interfaces and Integration HardCopy III Device Handbook Volume 1: Device Interfaces and Integration 101 Innovation Drive San Jose, CA 95134 www.altera.com HC3_H5V1-3.3 2011 Altera Corporation. All rights reserved. ALTERA, ARRIA, CYCLONE, HARDCOPY, MAX, MEGACORE, NIOS, QUARTUS and STRATIX are Reg. U.S. Pat.


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    EP4CE15

    Abstract: MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22
    Text: Altera Device Package Information Datasheet DS-PKG-16.2 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead


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    PDF DS-PKG-16 EP4CE15 MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22

    EP3CLS150F484

    Abstract: EP3CLS200F484 EP4SGX180FF35 EP2AGX65DF29 EP4CGX15B EP3CLS150F780 EP4SE360F35 HC335FF1152 EP3CLS200F484 datasheet EP4S100G5F45
    Text: Quartus II Software Device Support Release Notes November 2009 RN-01049-1.0 This document provides late-breaking information about device support in this version of the Altera Quartus® II software. For information about disk space and system requirements, refer to the readme.txt file in your altera/<version number>/quartus directory.


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    PDF RN-01049-1 EP4SE530 EP4SGX530 EP3CLS150F484 EP3CLS200F484 EP4SGX180FF35 EP2AGX65DF29 EP4CGX15B EP3CLS150F780 EP4SE360F35 HC335FF1152 EP3CLS200F484 datasheet EP4S100G5F45

    EP3SE110F1152

    Abstract: altera cyclone 3
    Text: HardCopy III Device Handbook, Volume 2 101 Innovation Drive San Jose, CA 95134 www.altera.com HC3_H5V2-3.1 Copyright 2010 Altera Corporation. All rights reserved. Altera, The Programmable Solutions Company, the stylized Altera logo, specific device designations, and all other


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    EP3SE110F1152

    Abstract: EP3SE110F HC325FF780 EP3SE110F780 EP3SE110-F1152 ep3sl200h780 H1152 HC325WF780 HC335 EP3SE110-F780
    Text: 5. Clock Networks and PLLs in HardCopy III Devices HIII51005-3.0 Introduction This chapter provides a general description of clock networks and PLLs in HardCopy III devices. HardCopy III devices support a hierarchical clock structure and multiple PLLs with


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    PDF HIII51005-3 EP3SE110F1152 EP3SE110F HC325FF780 EP3SE110F780 EP3SE110-F1152 ep3sl200h780 H1152 HC325WF780 HC335 EP3SE110-F780

    JESD8-16A

    Abstract: JESD8-15 ccpd 33 CB EP3SE110F780 JESD8-6 JESD86 SSTL-15 JESD815 JESD8 EIA-644
    Text: 6. HardCopy III Device I/O Features HIII51006-3.0 Introduction This chapter documents I/O standards, features, termination schemes, and performance supported in HardCopy III devices. All HardCopy III devices have configurable high-performance I/O drivers and receivers supporting a wide range of


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    PDF HIII51006-3 EP3SE260--H780 EP3SL340--H1152 JESD8-16A JESD8-15 ccpd 33 CB EP3SE110F780 JESD8-6 JESD86 SSTL-15 JESD815 JESD8 EIA-644

    FBGA 1760

    Abstract: F1517 EP3SE110F stratix III fpga
    Text: Section I. HardCopy III Design Flow and Prototyping with Stratix III Devices This section provides a description of the design flow and the implementation process used by the HardCopy Design Center. It also provides information about mapping Stratix III devices to HardCopy® III devices and associated power and configuration


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    EP4CE22f17

    Abstract: EP4CE115F29 EP4CE40F23 EP4CE6E22 EP4CE15f17 EP4CE10E22 EP4CE6F17 EP4CE30F EP4CE10F17 EP4CE15F23
    Text: Quartus II Software Version 9.1, SP1 Device Support Release Notes RN-01051-1.0 February 2010 This document provides late-breaking information about device support in this version of the Altera Quartus® II software. For information about disk space and system requirements,


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    PDF RN-01051-1 EP4CE22f17 EP4CE115F29 EP4CE40F23 EP4CE6E22 EP4CE15f17 EP4CE10E22 EP4CE6F17 EP4CE30F EP4CE10F17 EP4CE15F23

    hc335

    Abstract: EP3SE110F1152 EP3SE110 EP3SL110F780 1517-pin HC325WF484N hc335ff1152n HC335FF1517N Altera Stratix II BGA 484 pinout HC325
    Text: 3. Mapping Stratix III Device Resources to HardCopy III Devices HIII53003-3.1 This chapter discusses the available options for mapping from a Stratix III device to a HardCopy ® III device. The Quartus II software limits resources to those available to both the Stratix III FPGA


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    PDF HIII53003-3 avai10, hc335 EP3SE110F1152 EP3SE110 EP3SL110F780 1517-pin HC325WF484N hc335ff1152n HC335FF1517N Altera Stratix II BGA 484 pinout HC325