2082D
Abstract: re30d
Text: 8 7 PLATING SPECIFICATIONS F A D G M N O P R S T V W X Y Z CONTACT .000015" GOLD .00003" GOLD .00001" GOLD .00003" GOLD .00005" GOLD .00003" GOLD GOLD FLASH .00002" GOLD .00001" GOLD .0001" TIN/LEAD .00003" GOLD GOLD FLASH .00003" GOLD .00003" GOLD .00001" GOLD
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E05DH_
E10DH_
E15DH_
E20DH_
E25DH_
E30DH_
E32DH_
E35DH_
E40DH_
E45DH_
2082D
re30d
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RB95
Abstract: b30h
Text: 8 7 F A D G M N O P R S T V W X Y Z CONTACT .000015" GOLD .00003" GOLD .00001" GOLD .00003" GOLD .00005" GOLD .00003" GOLD GOLD FLASH .00002" GOLD .00001" GOLD .0001" TIN/LEAD .00003" GOLD GOLD FLASH .00003" GOLD .00003" GOLD .00001" GOLD 4 5 6 PLATING SPECIFICATIONS
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B30HD-A350
B05DHRD
B06DHRD
B09DHRD
B10DHRD
B13DENTIAL
RB95
b30h
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Untitled
Abstract: No abstract text available
Text: b http://www.tekcon.com http://www.tekcon.com.tw 1701 Series Card Edge Connector 2.54 mm, for ISA BUS Ordering Information 1701 - X X X - XXX Contact Plating A - Gold Flash/ Tin B - 10 µ" Gold/ Tin C - 15 µ" Gold/ Tin D - 20 µ" Gold/ Tin G - 3µ" Gold/ Tin
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UL94V-0.
-558C
1258C
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Untitled
Abstract: No abstract text available
Text: b http://www.tekcon.com http://www.tekcon.com.tw 2222 Series SMT D-SUB Miniature Connector Double Row, Card Edge Mount, Plug Ordering Information 2222 - X X X - XX P - X X Contact Plating 0 - Gold Flash/Tin 1 - 10 µ" Gold/Tin 3 - 30 µ" Gold/Tin 5 - 15 µ" Gold/Tin
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-558C
1258C
UL94V-0.
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Untitled
Abstract: No abstract text available
Text: b http://www.tekcon.com http://www.tekcon.com.tw 2222 Series SMT D-SUB Miniature Connector Double Row, Card Edge Mount, Receptacle Ordering Information 2222 - X X X - XX S - X X Contact Plating 0 - Gold Flash/Tin 1 - 10 µ" Gold/Tin 3 - 30 µ" Gold/Tin 5 - 15 µ" Gold/Tin
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-558C
1258C
UL94V-0.
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ULTRA THIN CARD EDGE CONNECTOR OF SERIES 235
Abstract: 245-21-XXXCE-XX methode 3200 methode series 79 connector METHODE* 3200 M42X M42X-02 AMP PBT connector edge CONNECTOR series CE mil-m-24519
Text: .050" 1.27mm Series 235 Ultra Thin Card Edge Connector DIP SOLDER TERMINALS WITHOUT MOUNTING EARS PART NUMBER LEGEND 235-21-XXXDS-XX PLATING OPTIONS 01 = .000010 GOLD IN CONTACT AREA OVER NICKEL WITH GOLD FLASH TAILS. 03 = .000030 GOLD IN CONTACT AREA OVER NICKEL WITH
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235-21-XXXDS-XX
ULTRA THIN CARD EDGE CONNECTOR OF SERIES 235
245-21-XXXCE-XX
methode 3200
methode series 79 connector
METHODE* 3200
M42X
M42X-02
AMP PBT connector
edge CONNECTOR series CE
mil-m-24519
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ULTRA THIN CARD EDGE CONNECTOR OF SERIES 235
Abstract: 245-21-XXXCE-XX m42x M42X-03-XXX-X 275-00-XXXDSX-XX methode board edge connectors usa lead
Text: .050" 1.27mm Series 235 Ultra Thin Card Edge Connector DIP SOLDER TERMINALS WITHOUT MOUNTING EARS PART NUMBER LEGEND 235-21-XXXDS-XX PLATING OPTIONS 01 = .000010 GOLD IN CONTACT AREA OVER NICKEL WITH GOLD FLASH TAILS. 03 = .000030 GOLD IN CONTACT AREA OVER NICKEL WITH
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235-21-XXXDS-XX
ULTRA THIN CARD EDGE CONNECTOR OF SERIES 235
245-21-XXXCE-XX
m42x
M42X-03-XXX-X
275-00-XXXDSX-XX
methode board edge connectors
usa lead
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404w
Abstract: No abstract text available
Text: MC-CARD RECEPTACLES STRAIGHT SMT RECEPTACLES captive center contact finish PCB pattern packaging R199 005 820W yes Gold P03 unit R199 005 820 yes Gold P03 100 p / reel R199 005 821 yes Gold P03 500 p / reel part number Please see procedure on pages 13 to 16.
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r107
Abstract: No abstract text available
Text: EDGE CARD RECEPTACLES UMP series SMT EDGE CARD RECEPTACLES part number mounting R107 003 000 R107 003 010 R107 003 010 W M02 PCB finish packaging P07 gold 4000 p / reel P07 gold 100 p / reel P07 gold unit For more information about UMP series, please ask for our catalog D1 107 CE.
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tristate buffer
Abstract: Tri-State Buffer SMD TQFP microcontroller 80C166 ITB06063 pmb 2706
Text: GOLD System Controller GOLD-µC PMB 2706 General Description The GOLD System Controller (GOLD-µC) is part of a chip set, which covers all functions of a mobile radio provided for the Global System for Mobile communications, GSM. A mobile terminal which contains this chip set will meet all
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2706-F
16-bit
80C166
P-TQFP-144-2
80C166)
P-TQFP-144,
tristate buffer
Tri-State Buffer
SMD TQFP microcontroller
ITB06063
pmb 2706
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r223
Abstract: R223.424 R223424800
Text: MMBX PCB RECEPTACLES STRAIGHT PCB RECEPTACLES male center contact Fig. 1 Fig. 2 mounting instruction finish yes M04 gold bulk 100 pcs SMT 1 yes M04 gold unit SMT 1 yes M04 gold tape & reel 750 pcs SMT R223 435 000 2 yes P01 gold bulk 100 pcs R223 435 000W
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Untitled
Abstract: No abstract text available
Text: ENGINEERING NOTES INSULATOR MOLDING MATERIALS CONTACT FINISH PLATING & GOLD INLAY 1 Selective plating - nickel overall followed by gold on the contact mating area and tin/lead alloy on the contact tails. 2 Overall plating - gold over nickel or tin/lead alloy.
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AFCA-CER-XX-XX-XX
Abstract: No abstract text available
Text: 1 2 3 4 5 6 7 SPECIFICATIONS Current rating: Contact material: Contact plating: Insulator material: Withstanding: Contact resistance: Insulation resistance: Operating temperature: Terminates with: A B 8 9 1 amp Phosphor bronze Tin, selective gold, gold flash, gold plate
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UL94V-0
500VAC
AFCA-CER-XX-XX-XX
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SUYIN Connector
Abstract: SUYIN SIM CARD sim card sim card connector
Text: SIM CARD CONNECTOR H:2.1mm 250291MA Series Specifications: Insulator Material : Black High Temp. Plastic Operating Type Range Terminal Material : Phos. Bronze Platings : Contact-Selective Gold Plated or Full Gold Plated Max. Current Rating : 1.0A Max. Voltage Rating
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250291MA
SUYIN Connector
SUYIN SIM CARD
sim card
sim card connector
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Brass per QQ-B-626, Alloy 360
Abstract: QQ-N-290 class2 phono drawings ASTM B194 Brass 1/2 hard per QQ-B-626 Brass per QQ-B-626, Alloy 360 1/2 data sheet drawings, RCA, Phono phono data sheet drawings phono female to female data sheet B194
Text: Pomona Model 5748 Maxi Universal Adapter Kit MATERIALS: CENTER CONTACT DIELECTRIC SHELL 1- TYPE `N` MALE Gold Plated Brass Teflon Silver Plated Brass 2- BNC MALE Gold Plated Phosphor Bronze Teflon Silver Plated Brass 3- TNC MALE Gold Plated Phosphor Bronze
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300MHz)
500MHz
50MHz
Goldberg\FlukeDataSheet\d5748
Brass per QQ-B-626, Alloy 360
QQ-N-290 class2
phono drawings
ASTM B194
Brass 1/2 hard per QQ-B-626
Brass per QQ-B-626, Alloy 360 1/2
data sheet drawings, RCA, Phono
phono data sheet drawings
phono female to female data sheet
B194
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sim card 6PIN
Abstract: SIM Card Connector, 2,54mm
Text: Amphenol 6pin Hinge Sim Card Connector 1. Material: Contact: Alloy copper, Shell:Stainless steel, Insulator: High temperature. Thermoplastic, UL94V-0, Black. 2. Finish : Contact: gold plated on mating area, gold flash plating on solder area. Part Number: 3. Electrical specifications:
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UL94V-0,
5000cycles,
sim card 6PIN
SIM Card Connector, 2,54mm
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CARD12
Abstract: No abstract text available
Text: SIM CARD CONNECTOR 6 PINS H:1.0mm 254118MA Series Specifications: Insulator Material : Black High Temp. Plastic Operating Type Range Terminal Material : Phos. Bronze Platings : Contact-Selective Gold Plated or Full Gold Plated Max. Current Rating : 1.0A Max. Voltage Rating
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254118MA
CARD12
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XXX10XX
Abstract: No abstract text available
Text: .156 3 .9 6 C enters Card Edge B ifurcated C antilever C on tacts PART NUMBER CODING 184-XXXXX-XX-XX MARKING SPECIFICATIONS SEE MARKING STYLES -CONTACT PLATING CONTACT SURFACE TERMINATION 01 = .000010 GOLD GOLD FLASH 02 = .000020 GOLD GOLD FLASH 20 = .000010 GOLD
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184-XXXXX-XX-XX
184-XXX28-XX-12XX
184-XXX18-XX-06XX
184-XXX36-XX-13XX
184-XXX18-XX-07XX
184-XXX43-XX-14XX
XXX10XX
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Untitled
Abstract: No abstract text available
Text: .156" 3.96mm Series 179 Right Angle Connector .156 (3.96) Centers Card Edge Tuning Fork Contacts PART NUMBER COOING 179-XXX-XX •CONTACT PLATING CONTACT SURFACE AND TERMINATION 30 = .000010 GOLD OVERALL 32 = .000020 GOLD OVERALL ALL GOLD PLATED OVER 000050
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179-XXX-XX
polarizatio79!
X79-XX3-XX
X79-XX4-XX
X79-XX5-XX
X79-XX6-XX
X79-XX7-XX
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Untitled
Abstract: No abstract text available
Text: .156" 3.96mm Series 179 Right Angle Connector .156 (3.96) Centers Card Edge Tuning Fork Contacts PART NUMBER CODING 1 79- X X X - X X CONTACT PLATING CONTACT SURFACE AND TERMINATION 30 = .000010 GOLD OVERALL 32 = 000020 GOLD OVERALL ALL GOLD PLATED OVER .000050
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X79-XX3-XX
X79-XX4-XX
X79-XX5-XX
X79-XX6-XX
X79-XX7-XX
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3V IC LINEAR SMD
Abstract: PMB2706
Text: GOLD System Controller GOLD-|aC PMB 2706 General Description Type The GOLD System Controller (GOLD-pC) is part of a chip set, which covers all functions of a mobile radio provided for the Global System for Mobile communications, GSM. A mobile terminal which contains this chip set will meet all
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16-bit
80C166
2706-F
P-TQFP-144-2
80C166)
P-TQFP-144,
3V IC LINEAR SMD
PMB2706
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Untitled
Abstract: No abstract text available
Text: o CO CO o PIN #A1 Ordering Inform ation #A1 IDENTIFIER s0 T KPCI EX-SM 3-xxxxxxx Series * I Straddle Mount 00 o With clips £ 10 Number of positions C\l Plating option: Blank: Gold Flash 1 0 :10u" Gold 1 5 :15u" Gold 30: 30u" Gold Color: BK-Black T- 10 Material and Finish
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UL94V-0
flash/10u
2002/95/EC
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Untitled
Abstract: No abstract text available
Text: MC-CARD RECEPTACLES XÛ 3=D STRAIGHT SMT RECEPTACLES T ~ 4. 85 u 1 *>5 . 3 2 .1 5 captive center contact finish PCB pattern packaging R 199 005 820W yes Gold P03 unit R 199 0 05 820 yes Gold P03 100 p / reel R 1 9 9 0 0 5 821 yes Gold P03 500 p / reel part number
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Untitled
Abstract: No abstract text available
Text: Recom m ended 15 p 2 P.C.B L a y o u t C o m p o n e n t Sid e o o +l n co -3— *• 2.60+0.20 254016MA006 GD 00ZL 1 1.Selective plating G1—05u” Gold over Nickel. G2—Indicate Gold flash. G5—10u” Gold over Nickel. G4—15u” Gold over Nickel.
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254016MA006
SUS304
254016MA006GX00ZL
CH02061
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