TLP3910
Toshiba Electronic Devices & Storage Corporation
Photocoupler (photovoltaic output), VOC=14 V / ISC=12 μA, 5000 Vrms, SO6L
10078239-10003LF
Amphenol Communications Solutions
DDR3 Memory Module Sockets, Storage and Server System, Very low profile (VLP) Through Hole, 240 Position Memory Socket.
93939-108HLF
Amphenol Communications Solutions
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 8 Positions, 2.54 mm Pitch, Right Angle, 4.06 mm (0.16in) Mating, 3.05 mm (0.12in) Tail.
51939-1014LF
Amphenol Communications Solutions
PwrBlade®, Power Connectors, 3P 16S 6P Right Angle Header, Solder To Board
51939-1055LF
Amphenol Communications Solutions
PwrBlade®, Power Supply Connectors, 2ACP 4S 2ACP Right Angle Header.