AMF1608B2450A1T
Abstract: AMF1005B2450AT AMF1608B2450B1T 2400-2500MHz
Text: MD-MDE013-201212 Multilayer Chip BPF AMF1005B / AMF1608B Series Applications Features • Mobile phone Ultra Small Size and Low Profile 1.6mm（L）x0.8mm（W）×0.4mm（H） typ. W-LAN , Bluetooth , etc. 1.0mm（L）×0.5mm（W）×0.4mm（H） typ.
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Original
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MD-MDE013-201212
AMF1005B
AMF1608B
960MHz)
AMF1005B2450AT
4800-5000MHz)
7200-7500MHz)
1710-1990MHz)
2110-2170MHz)
AMF1005B5375AT
AMF1608B2450A1T
AMF1608B2450B1T
2400-2500MHz
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PDF
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Untitled
Abstract: No abstract text available
Text: Application Note Packaging Solutions to Heat Generation Light Emitting Diode 1. Objective Multiple LEDs are generally mounted on a board for the desired light output, as panel light and illumination for facilities. Operating a single LED generates high heat; all the more heat is generated when multiple LEDs are
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Original
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NS2x157AR)
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PDF
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FR4 1.6mm substrate
Abstract: Thermagon t-lam CLD-AP25 Fabrication process steps mcpcb FR-4 substrate 1.6mm NEMA FR-4 led mcpcb large copper trace thermal Thermagon pcb fabrication process kapton
Text: Optimizing PCB Thermal Performance for Cree XLamp® LEDs Table of Contents 1. Introduction. 2 2. Thermal Management Principles. 2
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Original
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CLD-AP37
FR4 1.6mm substrate
Thermagon t-lam
CLD-AP25
Fabrication process steps mcpcb
FR-4 substrate 1.6mm
NEMA FR-4
led mcpcb large copper trace thermal
Thermagon
pcb fabrication process
kapton
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PDF
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SG-BGA-7104
Abstract: No abstract text available
Text: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid
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Original
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725mm
725mm
025mm
SG-BGA-7104
125mm.
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PDF
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SG-BGA-7018
Abstract: No abstract text available
Text: GHz CSP Socket - Direct mount, solderless Top View Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid
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Original
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475mm.
725mm
025mm
SG-BGA-7018
125mm.
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PDF
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SG-BGA-7053
Abstract: IC-512
Text: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid
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Original
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475mm.
SG-BGA-7053
725mm
025mm
125mm.
IC-512
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PDF
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7052
Abstract: SG-BGA-7052
Text: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid
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Original
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475mm.
SG-BGA-7052
725mm
025mm
125mm.
7052
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PDF
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SG-BGA-7048
Abstract: ic 7048
Text: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid
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Original
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475mm.
SG-BGA-7048
725mm
025mm
125mm.
ic 7048
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PDF
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SG-BGA-6102
Abstract: SG-BGA-6120
Text: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. Top View High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 28.225mm Ball guide prevents over compression of elastomer
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Original
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225mm
SG-BGA-6120
725mm
125mm.
SG-BGA-6102
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PDF
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IC 7108
Abstract: SG-BGA-7108 7108 and/cj 7108
Text: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid
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Original
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f/4/09,
725mm
025mm
SG-BGA-7108
125mm.
IC 7108
7108
and/cj 7108
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PDF
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SG-BGA-7051
Abstract: No abstract text available
Text: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid
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Original
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475mm.
SG-BGA-7051
725mm
025mm
125mm.
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PDF
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SG-BGA-7149
Abstract: No abstract text available
Text: 12.225mm GHz CSP Socket - Direct mount, solderless Top View Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid
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Original
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225mm
SG-BGA-7149
725mm
025mm
125mm.
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PDF
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7058
Abstract: SG-BGA-7058
Text: GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid
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Original
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475mm.
SG-BGA-7058
725mm
025mm
125mm.
7058
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PDF
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SG-BGA-7070
Abstract: FR4 0.8mm thickness
Text: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid
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Original
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475mm.
SG-BGA-7070
725mm
025mm
125mm.
FR4 0.8mm thickness
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PDF
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SG-BGA-7057
Abstract: No abstract text available
Text: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid
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Original
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475mm.
SG-BGA-7057
725mm
025mm
125mm.
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PDF
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SG-BGA-7059
Abstract: No abstract text available
Text: GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid
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Original
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475mm.
SG-BGA-7059
725mm
025mm
125mm.
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PDF
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Jack cat5e
Abstract: modular plug amp RJ45 cat5e keystone jack PBT 20 GF PBT20 AMP modular plug RJ45 PBT-20GF
Text: 2 3 5 4 6 7 A 14.50MM 14.50MM A 16.20MM 1 35.4MM B B 16.20MM 19.20MM C 21.20MM 8.13MM 3.80MM 7.1MM Material: • Housing: PC UL94V-0 • Insert Material: PBT+20%GF UL94V-0 • PCB Material: FR-4 Thickness 1.6MM • Contact Material: Phosphor Bronze Stamp Pin T=0.50MM
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UL94V-0
-TA3534-R
rev00
Jack cat5e
modular plug amp RJ45
cat5e keystone jack
PBT 20 GF
PBT20
AMP modular plug RJ45
PBT-20GF
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PDF
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PBT 20 GF
Abstract: AMP modular plug RJ45 RJ45 JACK PCB CAT6
Text: 2 3 5 4 6 7 A 14.50MM 14.50MM A 16.20MM 1 35.4MM B B 16.20MM 19.20MM C 21.20MM 8.13MM 3.80MM 7.1MM Material: • Housing: PC UL94V-0 • Insert Material: PBT+20%GF UL94V-0 • PCB Material: FR-4 Thickness 1.6MM • Contact Material: Phosphor Bronze Stamp Pin T=0.50MM
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Original
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UL94V-0
-TA3535-R
rev00
PBT 20 GF
AMP modular plug RJ45
RJ45 JACK PCB CAT6
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PDF
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IC 7012
Abstract: SG-BGA-7012 7012 ic
Text: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid
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Original
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475mm.
SG-BGA-7012
725mm
025mm
125mm.
IC 7012
7012 ic
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PDF
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SG-BGA-7098
Abstract: No abstract text available
Text: GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid
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Original
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525mm
FR4/G10,
475mm.
725mm
025mm
SG-BGA-7098
125mm.
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PDF
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SG-BGA-7055
Abstract: No abstract text available
Text: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid
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Original
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475mm.
SG-BGA-7055
725mm
025mm
125mm.
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PDF
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FR4 thickness 1.6mm
Abstract: 7101 11351 te 7101 SG-BGA-7101
Text: GHz CSP Socket - Direct mount, solderless Top View Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid
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Original
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725mm
025mm
SG-BGA-7101
11351Rupp
125mm.
FR4 thickness 1.6mm
7101
11351
te 7101
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PDF
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SG-BGA-7148
Abstract: No abstract text available
Text: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid
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Original
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475mm.
937mm
SG-BGA-7148
725mm
025mm
125mm.
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PDF
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7082 B
Abstract: SG-BGA-7082
Text: GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid
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Original
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525mm
FR4/G10,
475mm.
725mm
025mm
SG-BGA-7082
125mm.
7082 B
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PDF
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