084AC
Abstract: PLCC-044-F-A plcc 52 socket footprint
Text: FACTSHEET F-202-1 PLCC–044–F–A PLCC–068–T–A CHIP CARRIER SOCKETS PLCC SERIES FEATURES • Same footprint as most common plastic leaded chip carriers. • Unique PLCC Series contact design has a “slotted tail” for added adhesion of solder paste, and superior
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F-202-1
1-800-SAMTEC-9
084AC
PLCC-044-F-A
plcc 52 socket footprint
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084AC
Abstract: No abstract text available
Text: FACTSHEET F-200 PLCC–044–F–A PLCC–068–T–A CHIP CARRIER SOCKETS PLCC SERIES Features: • Same footprint as most common plastic leaded chip carriers. • Unique PLCC Series contact design has a “slotted tail” for added adhesion of solder paste, and superior
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F-200
1-800-SAMTEC-9
084AC
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084AC
Abstract: No abstract text available
Text: FACTSHEET F-201 PLCC–044–F–A PLCC–068–T–A CHIP CARRIER SOCKETS PLCC SERIES Features: • Same footprint as most common plastic leaded chip carriers. • Unique PLCC Series contact design has a “slotted tail” for added adhesion of solder paste, and superior
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F-201
Alignment68
1-800-SAMTEC-9
084AC
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84 Pin PLCC Socket DIP
Abstract: plcc thru hole socket 32 PLCC
Text: WINSLOW ADAPTICs WAxx127DSAJT PLCC TO PGA ADAPTER This is a complete range of Adapters which convert a PLCC package to a PGA male thru hole footprint. This range of adapters are supplied with PLCC production sockets mounted for ease of device insertion. Sockets are to JEDEC standard PLCC dimensions.
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WAxx127DSAJT
84 Pin PLCC Socket DIP
plcc thru hole socket 32 PLCC
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A 2057
Abstract: WA084 2057
Text: WINSLOW ADAPTICs WAxx127DAJT PLCC TO PGA ADAPTER This is a complete range of Adapters which convert a PLCC package to a PGA male thru hole footprint. This range of adapters are supplied with SMT pads to accept the PLCC device. Surface mounting of the PLCC device is also available.
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WAxx127DAJT
A 2057
WA084
2057
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footprint pga 84
Abstract: plcc thru hole socket 32 PLCC 84 Pin PLCC Socket DIP footprint plcc 32 WA-052 plcc 52 socket footprint plcc thru hole socket 20 PGA adapter
Text: WINSLOW ADAPTICs WAxx127DAJT / WAxx127DSAJT PLCC TO PGA ADAPTER This is a complete range of Adapters which convert a PLCC package to a PGA thru hole footprint. The adapters can be supplied with or without PLCC production sockets. Pin out shown is for representation only
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WAxx127DAJT
WAxx127DSAJT
WA068127DAJT
WA084127DAJT
footprint pga 84
plcc thru hole socket 32 PLCC
84 Pin PLCC Socket DIP
footprint plcc 32
WA-052
plcc 52 socket footprint
plcc thru hole socket 20
PGA adapter
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084AC
Abstract: No abstract text available
Text: F-203 CHIP CARRIER SOCKETS PLCC SERIES FEATURES • Same footprint as most common plastic leaded chip carriers. • Unique PLCC Series contact design has a “slotted tail” for added adhesion of solder paste, and superior solder joint strength. • PLCC Series contact
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F-203
1-800-SAMTEC-9
084AC
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WA044127FSAJT
Abstract: WA032127FSAJT WA084127FSAJT WA020127FSAJT WA028127FSAJT WA052127FSAJT WA068127FSAJT WAXX127FSAJT W2603 WA084
Text: WINSLOW ADAPTICs Iss 2 WAxx127FSAJT PLCC TO DIL ADAPTER This is a complete range of Adapters which coverts a PLCC package to either an PGA or DIL footprint. The adapters can be supplied with or without PLCC production sockets. sales@winslowadaptics.com DIP Support products from Winslow Adaptics
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WAxx127FSAJT
WA020127FSAJT
WA028127FSAJT
WA032127FSAJT
W2603
WA044127FSAJT
WA044127FSAJT-2
W2443
WA052127FSAJT
WA084127FSAJT
WA068127FSAJT
WA084
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smd s101
Abstract: s69 lf 16 qam demodulator ITU-T V.22 bis standard S54 SMD S68 SMD ATDT1234567890 CH1788 CH1788-3 CH1788-3ET smd s66
Text: CH1788 Surface Mount PLCC 2400bps Modem • CS-03 Industry Canada registered. INTRODUCTION The CH1788 modem has the smallest footprint and lowest profile of any commercially available full function, FCC Part 68 approved 2400bps modem. Utilizing a 68 pin PLCC form factor and requiring a
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CH1788
2400bps
CS-03
CH1788
smd s101
s69 lf
16 qam demodulator ITU-T V.22 bis standard
S54 SMD
S68 SMD
ATDT1234567890
CH1788-3
CH1788-3ET
smd s66
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Z80180
Abstract: No abstract text available
Text: 1109477 ZILOG Z80180 - 68 PIN PLCC PACKAGE TO 64 PIN DIP FOOTPRINT FEATURES: • Replace difficult to obtain DIP devices with common PLCC packages. SPECIFICATIONS: • PCB is FR-4,.062 [1.56 or .094 [2.39] thick. • Male pin is Brass Alloy 360 1/2 hard per UNS C36000
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Z80180
C36000
ASTM-B16-85.
MIL-T10727
MIL-P-81728
QQ-N-290.
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Untitled
Abstract: No abstract text available
Text: 1109477 ZILOG Z80180 - 68 PIN PLCC PACKAGE TO 64 PIN DIP FOOTPRINT FEATURES: • Replace difficult to obtain DIP devices with common PLCC packages. SPECIFICATIONS: • PCB is FR-4,.062 [1.56 or .094 [2.39] thick. • Male pin is Brass Alloy 360 1/2 hard per UNS C36000
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Z80180
C36000
ASTM-B16-00.
SAE-AMS-QQ-N-290.
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HASL
Abstract: No abstract text available
Text: 1109477 ZILOG Z80180 - 68 PIN PLCC PACKAGE TO 64 PIN DIP FOOTPRINT FEATURES: • Replace difficult to obtain DIP devices with common PLCC packages. SPECIFICATIONS: • PCB is FR-4,.062 [1.56 or .094 [2.39] thick. • Male pin is Brass Alloy 360 1/2 hard per UNS C36000
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Z80180
C36000
ASTM-B16-85.
MIL-T10727
MIL-P-81728
QQ-N-290.
HASL
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Untitled
Abstract: No abstract text available
Text: Series 505 PLCC-to-PGA JEDEC Type 0.050 [1.27] Pitch Adapter FEATURES • Convert surface mount PLCC packages to a PGA footprint • Pin polarization option also available • Consult factory for Panelized Form or for mounting of consigned chips GENERAL SPECIFICATIONS
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C36000
ASTM-B16-00
B579-73
AMS-QQ-N-290
29-PGM06002-30
44-PGM08002-30
52-PGM09018-30
68-PGM11032-30
84-PGM13042-30
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XX-505-11
Abstract: No abstract text available
Text: Series 505 PLCC-to-PGA JEDEC Type 0.050 [1.27] Pitch Adapter FEATURES • Convert surface mount PLCC packages to a PGA footprint • Pin polarization option also available • Consult factory for Panelized Form or for mounting of consigned chips GENERAL SPECIFICATIONS
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C36000
ASTM-B16-00
B579-73
AMS-QQ-N-290
29-PGM06002-30
44-PGM08002-30
68-PGM11032-30
84-PGM13042-30
XX-505-11
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AMS-QQ-N-290
Abstract: 84 Pin PLCC Socket
Text: Series 505 PLCC-to-PGA JEDEC Type 0.050 [1.27] Pitch Adapter FEATURES • Convert surface mount PLCC packages to a PGA footprint • Pin polarization option also available • Consult factory for Panelized Form or for mounting of consigned chips GENERAL SPECIFICATIONS
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C36000
ASTM-B16-00
B579-73
AMS-QQ-N-290
29-PGM06002-30
44-PGM08002-30
52-PGM09018-30
68-PGM11032-30
84-PGM13042-30
84 Pin PLCC Socket
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44-pin plcc pcb mount footprint
Abstract: No abstract text available
Text: Series 505 PLCC to PGA Adapter for JEDEC Type .050 [1.27] Pitch Devices FEATURES: Convert surface mount PLCC packages to a PGA footprint. Optional open frame allows for more efficient Utilization of board space and better cooling. Pin polarization option also available.
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QQ-B-626.
MIL-T-10727
QQ-N-290.
44-pin plcc pcb mount footprint
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Untitled
Abstract: No abstract text available
Text: 1109477 ZILOG Z80180 - 68 PIN PLCC PACKAGE TO 64 PIN DIP FOOTPRINT FEATURES: • Replace difficult to obtain DIP devices with common PLCC packages. SPECIFICATIONS: • PCB is Black FR-4,.062 [1.56 or .094 [2.39] thick. • Male pin is Brass Alloy 360 1/2 hard per UNS C36000
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Original
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PDF
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Z80180
C36000
ASTM-B16-85.
MIL-P-81728
QQ-N-290.
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Untitled
Abstract: No abstract text available
Text: 1109477 ZILOG Z80180 - 68 PIN PLCC PACKAGE TO 64 PIN DIP FOOTPRINT FEATURES: • Replace difficult to obtain DIP devices with common PLCC packages. SPECIFICATIONS: • PCB is Black FR-4,.062 [1.56 or .094 [2.39] thick. • Male pin is Brass Alloy 360 1/2 hard per UNS C36000
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Z80180
C36000
ASTM-B16-85.
MIL-P-81728
QQ-N-290.
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44-pin plcc pcb mount footprint
Abstract: PGA Surface Mounting Type ASTM-B16-85
Text: Series 505 PLCC to PGA Adapter for JEDEC Type .050 [1.27] Pitch Devices FEATURES: • Convert surface mount PLCC packages to a PGA footprint. • Optional open frame allows for more efficient utilization of board space and better cooling. • Pin polarization option also available.
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C36000
ASTM-B16-85.
MIL-P81728
QQ-N-290.
28-PGM06002-30
44-PGM08002-30
52-PGA09018-30
68-PGM11032-30
84-PGM13042-30
44-pin plcc pcb mount footprint
PGA Surface Mounting Type
ASTM-B16-85
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44-pin plcc pcb mount footprint
Abstract: ASTM-B16-85 MIL-T-10727
Text: Series 505 PLCC to PGA Adapter for JEDEC Type .050 [1.27] Pitch Devices FEATURES: • Convert surface mount PLCC packages to a PGA footprint. • Optional open frame allows for more efficient utilization of board space and better cooling. • Pin polarization option also available.
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Original
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PDF
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C36000
ASTM-B16-85.
MIL-T-10727
MIL-P-81728
QQ-N-290.
29-PGM06002-30
44-PGM08002-30
52-PGA09018-30
68-PGM11032-30
84-PGM13042-30
44-pin plcc pcb mount footprint
ASTM-B16-85
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Untitled
Abstract: No abstract text available
Text: 1109477 ZILOG Z80180 - 68 PIN PLCC PACKAGE TO 64 PIN DIP FOOTPRINT FEATURES: • Replace difficult to obtain DIP devices with common PLCC packages. SPECIFICATIONS: • PCB is Black FR-4,.062 [1.56 or .094 [2.39] thick. • Male pin is Brass Alloy 360 1/2 hard per UNS C36000
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Z80180
C36000
ASTM-B16-85.
MIL-P-81728
QQ-N-290.
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Untitled
Abstract: No abstract text available
Text: PA-XAS3FC-PD Data Sheet 68 pin PLCC socket/40 pin DIP 0.6” plug Supported Device/Footprints Adapter Wiring These adapters are for device programming the EPROM of a Philips 51 XAS3. They accept the XAS3 in 68 pin PLCC or CLCC and plug into an 87C51FC 40 pin DIP footprint.
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socket/40
87C51FC
51XA-S3PLCC
87C51FC
51XA-S3
51XA-S3â
0000-7FFF)
IC120-0684-304
XAS3-68
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Untitled
Abstract: No abstract text available
Text: F-205-1 sam Tec CHIP CARRIER SOCKETS PLCC SERIES FEATURES • Same footprint as most common plastic leaded chip carriers. • Unique PLCC Series contact design has a “slotted tail" for added adhesion of solder paste, and superior solder joint strength. PLCC
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F-205-1
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Untitled
Abstract: No abstract text available
Text: CHIP CARRIER SOCKETS PLCC SERIES FEATURES • Same footprint as most common plastic leaded chip carriers. • Unique PLCC Series contact design has a “slotted tail” for added adhesion of solder paste, and superior solder joint strength. PLCC NO. OF CONTACTS
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