FLUX 959T Search Results

FLUX 959T Result Highlights (2)

Part	ECAD Model	Manufacturer	Description	Download	Buy
2SK1959-T1-AZ		Renesas Electronics Corporation	Switching N-Channel Power Mosfet, POMM, /Embossed Tape
2SC2959-T-AZ		Renesas Electronics Corporation	Bipolar Power Transistors, , /

FLUX 959T Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
sn63pb37 solder wire Abstract: SN63PB37 ROSIN FLUX TYPE ROL0 kester Sn63pB37 sn63pb37 solder wire flux 232 Text: 2011RECOMMENDED RECOMMENDED 2012 ElectronicsAssembly Assembly Materials Materials Electronics Table of Contents Table of Contents 2 Products Pages Solder Paste Fluxes Solder Wire Bar Solder Additional Flux Materials TSF Products Other products Helpful Information	Original	PDF
24-7068-1407 Abstract: 24-6337-8817 GR-63-CORE Zone 4 test 2460400010 24-6337-0027 K100LD sn62pb36ag2 Text: 2013 RECOMMENDED Electronics Assembly Materials Table of Contents Table of Contents 2 Products Pages Solder Paste Fluxes Solder Wire Bar Solder Additional Flux Materials TSF Products Other products Helpful Information 3-7 8-11 12-13 14-15 16 17 18 19 \| 800 253 7837 \| WWW.kester.com	Original	PDF
Sn62Pb36Ag02 Abstract: 959T kester 245 solder wire bellcore GR-78 Kester 275 sn63pb37 solder wire shelf life GR-78 IPC-TM-650 IPC-TM650 j-std-004 Text: 275 No-Clean Cored W ire For Lead-bearing and Lead-free alloys Product Description Reliability Properties Kester 275 No-Clean Flux for cored solder wire was developed to provide superior wetting performance for hand soldering in the electronics industry. The chemistry is based on some of the	Original	PDF	J-STD-004, IPC-TM-650, 15Jun07 Sn62Pb36Ag02 959T kester 245 solder wire bellcore GR-78 Kester 275 sn63pb37 solder wire shelf life GR-78 IPC-TM-650 IPC-TM650 j-std-004
GR-78-CORE Abstract: ROSIN FLUX TYPE ROL0 sn63pb37 Sn62Pb36Ag2 J-STD-006A RF771 bellcore GR-78 sn63pb37 solder wire 959T TC-527 Text: 2010 RECOMMENDED Electronics Assembly Materials Page 4 Kester Lead-Free Lead-Free Solder Pastes Formula EnviroMark 907 Application EnviroMark™ 828 No-Clean Stencil Printing Water-Soluble Stencil Printing Sn96.5Ag3.0Cu0.5 Sn96.5Ag3.0Cu0.5 Designed to exceed customers' expectations for high yield lead-free manufacturing. EM907 is engineered for the high thermal demands of assembling with	Original	PDF	65-0n-Tien GR-78-CORE ROSIN FLUX TYPE ROL0 sn63pb37 Sn62Pb36Ag2 J-STD-006A RF771 bellcore GR-78 sn63pb37 solder wire 959T TC-527
SN63PB37 Abstract: No abstract text available Text: 2009 RECOMMENDED Electronics Assembly Materials Page 4 Kester Lead-Free Lead-Free Solder Pastes Formula EnviroMark 907 EnviroMark™ 828 Application No-Clean Stencil Printing Water-Soluble Stencil Printing Alloys Sn96.5Ag3.0Cu0.5 Sn96.5Ag3.0Cu0.5 Product	Original	PDF	EM907 EM828 SN63PB37