FLIP CHIP Search Results

FLIP CHIP Result Highlights (5)

Part	Manufacturer	Description
GCM188D70E226ME36D	Murata Manufacturing Co Ltd	Chip Multilayer Ceramic Capacitors for Automotive
GRM022C71A472KE19L	Murata Manufacturing Co Ltd	Chip Multilayer Ceramic Capacitors for General Purpose
GRM033C81A224KE01W	Murata Manufacturing Co Ltd	Chip Multilayer Ceramic Capacitors for General Purpose
GRM155D70G475ME15D	Murata Manufacturing Co Ltd	Chip Multilayer Ceramic Capacitors for General Purpose
GRM155R61J334KE01D	Murata Manufacturing Co Ltd	Chip Multilayer Ceramic Capacitors for General Purpose

FLIP CHIP Price and Stock

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Littelfuse Inc SP4337-01WTG ESD Protection Diodes / TVS Diodes 5V 7A 0.18PF 15KV BI-DIR
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
TTI	SP4337-01WTG	Reel	20,000		10,000	1 - 10 - 100 - 1000 - 10000 $0.106	Buy Now
Littelfuse Inc SP1005-01WTG ESD Protection Diodes / TVS Diodes 30pF30kV Bi 0201 Flip Chip
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
TTI	SP1005-01WTG	Reel	20,000		10,000	1 - 10 - 100 - 1000 - 10000 $0.067	Buy Now
Littelfuse Inc SP3130-01WTG ESD Protection Diodes / TVS Diodes .3pF 10KV 28V 0201 Flipchip
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
TTI	SP3130-01WTG	Reel			10,000	1 - 10 - 100 - 1000 - 10000 $0.097	Buy Now
Littelfuse Inc SP3118-01WTG ESD Protection Diodes / TVS Diodes .3pF 10KV 18V 0201 Flipchip
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
TTI	SP3118-01WTG	Reel			10,000	1 - 10 - 100 - 1000 - 10000 $0.094	Buy Now
Littelfuse Inc SP1312-01WTG ESD Protection Diodes / TVS Diodes 11pF 24kV 01005 BI-DIR DIS TVS DIODE
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
TTI	SP1312-01WTG	Reel			15,000	1 - 10 - 100 - 1000 - 10000 -	Buy Now

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FLIP CHIP Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
capture and electronic packaging Abstract: Flip Chip Substrate tolerance thermal conductivity of substrate chip pads layout dram layout structure Pb210 Text: Designing for Cost Effective Flip Chip Technology Jack Bogdanski White Electronic Designs Corp. Designing for Cost Effective Flip Chip Technology Designing For Cost Effective Flip Chip Technology Bump and flip approaches to semiconductor packaging have gained acceptance	Original		PDF
radioactivity detector Abstract: 25-micron Alpha Industries alpha particle Delco Text: Alpha Partical Considerations In Flip Chip Technology Alpha Partical Considerations In Flip Chip Technology Alpha Partical Considerations In Flip Chip Technology 1 What are alpha particles? High energy particles are emitted during radioactive decay of heavier elements	Original		PDF
AN2348 Abstract: EIA standards 763 EIA 481-C flip chip bga 0,8 mm WLCSP stencil design EIA 763 Service Manual smd rework station WLCSP chip mount WLCSP flip chip BUT12 Text: AN2348 Application note IPAD 400 µm Flip Chip: package description and recommendations for use Introduction This document provides package and usage recomendation information for 400 µm pitch Flip Chips. For information on 500 µm Flip Chips, see Application note AN1235.	Original	AN2348 AN1235. AN2348 EIA standards 763 EIA 481-C flip chip bga 0,8 mm WLCSP stencil design EIA 763 Service Manual smd rework station WLCSP chip mount WLCSP flip chip BUT12	PDF
motorola darlington power transistor Abstract: LIN 2.0 alternator motorola automotive power transistor Alternator regulator MCCF33095 MCCF33096 20PS20 Text: Order this data sheet by MCCF33096/D MOTOROLA SEMICONDUCTOR~ MCCF33096 TECHNICAL OATA Advance Information Darlington Drive Flip-Chip The MCCF33096 is a Darlington Flip-Chip designed for use with the MCCF33095 Flip-Chip as a lamp driver in automotive charging	Original	MCCF33096/D MCCF33096 MCCF33096 MCCF33095 MCCF33095 MCCF33096, MKI45BP, motorola darlington power transistor LIN 2.0 alternator motorola automotive power transistor Alternator regulator 20PS20	PDF
EIA standards 783 Abstract: smd diode order marking code stmicroelectronics EIA 481-C bulk id EIA standards 763 EIA 763 IEC-60286-3 WLCSP flip chip WLCSP stencil design st smd diode marking code Text: AN1235 Application note IPAD 500 µm Flip Chip: package description and recommendations for use Introduction This document provides package and usage recomendation information for 500 µm pitch Flip Chips. For information on 400 µm Flip Chips, see Application note AN2348.	Original	AN1235 AN2348. EIA standards 783 smd diode order marking code stmicroelectronics EIA 481-C bulk id EIA standards 763 EIA 763 IEC-60286-3 WLCSP flip chip WLCSP stencil design st smd diode marking code	PDF
BGA 64 PACKAGE thermal resistance Abstract: FCCSP CABGA 6x6 amkor flip fcBGA PACKAGE thermal resistance bga 9x9 Shipping Trays CABGA 8X8 BGA 256 PACKAGE power dissipation BGA 256 PACKAGE thermal resistance BGA45 Text: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package — a flip chip solution in a CSP package format. This package construction utilizes eutectic tin/lead (63Sn/37Pb) flip chip interconnect	Original	63Sn/37Pb) BGA 64 PACKAGE thermal resistance FCCSP CABGA 6x6 amkor flip fcBGA PACKAGE thermal resistance bga 9x9 Shipping Trays CABGA 8X8 BGA 256 PACKAGE power dissipation BGA 256 PACKAGE thermal resistance BGA45	PDF
106E Abstract: No abstract text available Text: THICKFILM LOW RESISTANCE KELVIN FLIP CHIP ISO-9001 Registered LRK SERIES • Precision Low Resistance Applications • Flip Chip Design With Kelvin Layout • Low Temperature Coefficient • Resistance to 0.003 ohms The IRC LRK Low Range Flip Chip Resistor Series	Original	ISO-9001 150oC MIL-STD-202 MIL-PRF-55342 LRK2512 LRK2512 106E	PDF
Pb210 Abstract: flip chip substrate tolerance Text: Designing for Cost Effective Flip Chip Technology Application Note DESIGNING FOR COST EFFECTIVE FLIP CHIP TECHNOLOGY Bump and flip approaches to semiconductor packaging have gained acceptance in the industry. For the designer to take full advantage of this technology, attention to bump	Original	AN0039 Pb210 flip chip substrate tolerance	PDF
E700G Abstract: No abstract text available Text: Data Sheet LAMINATE fcCSP fcCSP Packages Amkor Technology offers the Flip Chip CSP fcCSP package – a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or	Original	DS577G E700G	PDF
Untitled Abstract: No abstract text available Text: SFC05-5 TVS PENTA FLIP CHIP ARRAY DESCRIPTION The SFCO5-5 flip chip is designed to protect sensitive components at the board level. The size makes this flip chip unique and well suited for applications which have limited board real estate yet requires ESD protection.	Original	SFC05-5	PDF
HL832N Abstract: FCCSP HL832 Amkor CSP mold compound cu pillar amkor cabga thermal resistance CABGA 6x6 flip chip bga 0,8 mm BGA 64 PACKAGE thermal resistance amkor Cu pillar Text: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package - a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or	Original		PDF
cu pillar Abstract: Flip Chip Substrate HL832 ds7409 FCCSP amkor flip chiparray amkor HL832N CABGA 48 7x7 amkor cabga thermal resistance Text: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package - a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or	Original		PDF
Untitled Abstract: No abstract text available Text: R Flip-Chip Packages Flip-Chip Packages As silicon devices become more integrated with smaller feature sizes as well as increased functionality and performance, packaging technology is also evolving to take advantage of these silicon advancements. Flip-chip packaging is the latest packaging option introduced	Original	UG012	PDF
Untitled Abstract: No abstract text available Text: R Flip-Chip Packages Flip-Chip Packages As silicon devices become more integrated with smaller feature sizes as well as increased functionality and performance, packaging technology is also evolving to take advantage of these silicon advancements. Flip-chip packaging is the latest packaging option introduced	Original	UG012	PDF

LRF1206 Abstract: 106E LRF2512 LRF2010 Text: THICKFILM LOW RESISTANCE FLIP CHIP LRF SERIES ISO-9001 Registered • Precision Low Resistance Applications • Low Cost Flip Chip Design • Low Temperature Coefficient • Resistance to 0.003 Ohms The IRC LRF Low Range Flip Chip Resistor Series offers very low resistance for applications	Original	ISO-9001 LRF1206 150oC LRF2010 LRF2512 MIL-STD-202 MIL-PRF-55342 LRF1206 106E	PDF
APP3599 Abstract: DS2760 DS2761 AN3599 Text: Maxim > App Notes > 1-Wire DEVICES GENERAL ENGINEERING TOPICS Keywords: DS2760, flip chip, DS2761, DS2761 flip-chip, RoHS, lead, Pb, lead free, Pb free, battery management, fuel gauge Sep 16, 2005 APPLICATION NOTE 3599 Assembling High-Lead Pb DS2761 Flip-Chips in a Pb-Free Assembly	Original	DS2760, DS2761, DS2761 com/an3599 DS2760: DS2761: AN3599, APP3599, APP3599 DS2760 AN3599	PDF
LSI Logic Abstract: Flip Chip Substrate led flip-chip heatsink Signal Path Designer Text: Flip Chip Ball Grid Array FPBGA Package Family Overview LSI Logic's FPBGA packages offer flip chip die interconnect, and support leadcounts in excess of 1700 to target high performance, high pin count applications. LSI Logic is the first company to qualify a flip chip package using	Original	B20022 LSI Logic Flip Chip Substrate led flip-chip heatsink Signal Path Designer	PDF
Untitled Abstract: No abstract text available Text: 54ACT534 54ACT534 Octal D Flip-Flop with TRI-STATE Outputs Literature Number: SNOS108 54ACT534 Octal D Flip-Flop with TRI-STATE Outputs General Description The ’ACT534 is a high-speed, low-power octal D-type flip-flop featuring separate D-type inputs for each flip-flop	Original	54ACT534 54ACT534 SNOS108 ACT534 ACT374	PDF
54LS174 Abstract: 54LS174DMQB 54LS174FMQB 54LS174LMQB 54LS175 LS174 LS175 DM74LS174 Text: DM74LS174/DM74LS175 Hex/Quad D Flip-Flops with Clear General Description Features These positive-edge-triggered flip-flops utilize TTL circuitry to implement D-type flip-flop logic. All have a direct clear input, and the quad 175 versions feature complementary outputs from each flip-flop.	Original	DM74LS174/DM74LS175 LS174 54LS174 54LS174DMQB 54LS174FMQB 54LS174LMQB 54LS175 LS175 DM74LS174	PDF
54AC175 Abstract: No abstract text available Text: 54AC175,54ACT175 54AC175, 54ACT175 Quad D Flip-Flop Literature Number: SNOS094A July 29, 2011 54AC175 • 54ACT175 Quad D Flip-Flop General Description Features The 'AC/'ACT175 is a high-speed quad D flip-flop. The device is useful for general flip-flop requirements where clock and	Original	54AC175 54ACT175 54AC175, 54ACT175 SNOS094A 54AC175 ACT175	PDF
T74LS74 Abstract: T54LS74AD2 Text: DUAL D-TYPE POSITIVE EDGETRIGGERED FLIP-FLOP DESCRIPTION The T54LS/T74LS74A dual edge-triggered flip-flop utilizes Schottky TTL circuitry to produce high speed D-type flip-flops. Each flip-flop has individual clear_and set inputs, and also complementary Q	OCR Scan	T54LS/T74LS74A T74LS74 T54LS74AD2	PDF
T74LS74AB1 Abstract: T74LS74a T54LS74AD2 T74LS74 Text: DUAL D-TYPE POSITIVE EDGETRIGGERED FLIP-FLOP DESCRIPTION The T54LS/T74LS74A dual edge-triggered flip-flop utilizes Schottky TTL circuitry to produce high speed D-type flip-flops. Each flip-flop has individual clear_and set inputs, and also complementary Q	OCR Scan	T54LS/T74LS74A T74LS74AB1 T74LS74a T54LS74AD2 T74LS74	PDF
Alternator regulator Abstract: transistor marking ld3 Alternator Voltage Regulator Darlington motorola darlington power transistor Text: MOTOROLA MCCF33096 SEMICONDUCTOR TECHNICAL DATA Advance Information Darlington Drive Flip-Chip The MCCF33096 is a Darlington Flip-Chip designed for use with the MCCF33095 Flip-Chip as a lamp driver in automotive charging systems. The MCCF33095 and MCCF33096, when used with an appropriate Motorola Power	OCR Scan	MCCF33096 MCCF33096 MCCF33095 MCCF33096, Alternator regulator transistor marking ld3 Alternator Voltage Regulator Darlington motorola darlington power transistor	PDF
RCA-CD4027A Abstract: No abstract text available Text: C04027A Types oy l CMOS Dual J-K Master-Slave Flip-Flop The RCA-CD4027A is a single monolithic chip Integrated circuit containing tw o Iden tical complementary-symmetry J-K masterslave flip-flops. Each flip-flop has provisions for individual J, K, Set, Reset, and Clock in	OCR Scan	C04027A RCA-CD4027A RCA-CD4013A CD4027A 13--Dynamic	PDF

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FLIP CHIP Search Results

FLIP CHIP Result Highlights (5)

FLIP CHIP Price and Stock

Littelfuse Inc SP4337-01WTG

Littelfuse Inc SP1005-01WTG

Littelfuse Inc SP3130-01WTG

Littelfuse Inc SP3118-01WTG

Littelfuse Inc SP1312-01WTG

FLIP CHIP Datasheets Context Search

capture and electronic packaging

radioactivity detector

AN2348

motorola darlington power transistor

EIA standards 783

BGA 64 PACKAGE thermal resistance

106E

Pb210

E700G

Untitled

HL832N

cu pillar

Untitled

Untitled

LRF1206

APP3599

LSI Logic

Untitled

54LS174

54AC175

T74LS74

T74LS74AB1

Alternator regulator

RCA-CD4027A