FDMF6730 Search Results

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Abstract: FDMF6730 MO-220 6X6 mlp SPM 1000 plus
Contextual Info: FDMF6730 Driver plus FET Multi-chip Module Features General Description Over 95% efficiency The FDMF6730 is a high efficiency Driver plus MOSFET power stage solution optimized for Ultra Mobile PC UMPC system power voltage supplies. It is fully compliant with the Intel UltraMobile Driver MOS (uDrMOS) Specification. The MOSFETs and

Contextual Info: FDMF6730 Driver plus FET Multi-chip Module Features General Description 1 Over 95% efficiency The FDMF6730 is a high efficiency Driver plus MOSFET power stage solution optimized for Ultra Mobile PC UMPC system power voltage supplies. It is fully compliant with the Intel UltraMobile Driver MOS (uDrMOS) Specification. The MOSFETs and

IPC-SM-7525A

Abstract: ipc 610D IPC-7525 J-STD-001C IPC-4101B entek ht plus JSTD001D 7525A smt j-std-001d IPC610D
Contextual Info: AN-9048 Assembly Guidelines for Fairchild’s 6x6 DriverMOS Packaging By Dennis Lang INTRODUCTION The Fairchild 6x6 DriverMOS package is based on Molded Leadless Packaging MLP technology. This technology has been increasingly used in packaging for power related products due to its

220v AC voltage stabilizer schematic diagram

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Contextual Info: QUICK INDEX NEW IN THIS ISSUE! Detailed Index - See Pages 3-24 AD9272 Analog Front End, iMEMS Accelerometers & Gyroscopes . . . . . . 782, 2583 Connectors, Cable Assemblies, IC Sockets . . . . . . . . . . . 28-528 Acceleration and Pressure Sensors . . . . . . . . . . . . . . . . . . . . . . . . . . Page 2585