vr7pu
Abstract: VR7PU567258GBD SODIMM DDR3 Mechanical Dimensions CB-172 VR7PU287258FBC VR7PU567258GBZ vr7pu287 VR7PU567258FBA VR7PU567258FBC 1066F
Text: DDR3 72bit Unbuffered SODIMM MODULE CONFIGURATIONS 1GB 1GB 1GB 1GB 1GB 1GB Module Configuration 128MX72 128MX72 128MX72 128MX72 128MX72 128MX72 Device Configuration 128Mx8 128Mx8 128Mx8 128Mx8 128Mx8 128Mx8 Device Package FBGA FBGA FBGA FBGA FBGA FBGA Module
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Original
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72bit
128MX72
128Mx8
vr7pu
VR7PU567258GBD
SODIMM DDR3 Mechanical Dimensions
CB-172
VR7PU287258FBC
VR7PU567258GBZ
vr7pu287
VR7PU567258FBA
VR7PU567258FBC
1066F
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PDF
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SODIMM DDR3 Mechanical Dimensions
Abstract: VR7PA127258GBD DDR3 SODIMM SPD JEDEC VR7PA567258GBZ viking connector 12 pin
Text: DDR3 72bit Registered SODIMM MODULE CONFIGURATIONS 1GB 1GB 1GB 1GB 1GB 1GB Module Configuration 128MX72 128MX72 128MX72 128MX72 128MX72 128MX72 Device Configuration 128Mx8 128Mx8 128Mx8 128Mx8 128Mx8 128Mx8 Device Package FBGA FBGA FBGA FBGA FBGA FBGA Module
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Original
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72bit
128MX72
128Mx8
SODIMM DDR3 Mechanical Dimensions
VR7PA127258GBD
DDR3 SODIMM SPD JEDEC
VR7PA567258GBZ
viking connector 12 pin
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PDF
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H5GQ4H24MFR-R2C
Abstract: H5GQ2H24AFR-R0C H5GC4H24MFR-T2C H5GQ1H24BFR-R0C H5GQ1H24BFR-T2C H5GC2H24BFR-T2C H5TQ2G63DFR-11c H5GQ2H24AFR-T2C H5TC4G63AFR-11C H5TQ2G63FFR
Text: Page 1 DENSI TY ORG. SPEED PART NUMBER PKG. FEATURE AVAI L. 1.1GHz 0.9ns H5TQ4G63AFR-N1C FBGA(96ball) 8Bank, 1.5V/ 1.5V Now 1.0GHz (1.0ns) H5TC4G63AFR-N0C FBGA(96ball) 8Bank, 1.35V/ 1.35V Now FBGA(96ball) 8Bank, 1.5V/ 1.5V Now FBGA(96ball) 8Bank, 1.35V/ 1.35V
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Original
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H5TQ4G63AFR-N1C
96ball)
H5TC4G63AFR-N0C
256Mx16
H5TC4G63AFR-11C
900MHz
H5GQ4H24MFR-R2C
H5GQ2H24AFR-R0C
H5GC4H24MFR-T2C
H5GQ1H24BFR-R0C
H5GQ1H24BFR-T2C
H5GC2H24BFR-T2C
H5TQ2G63DFR-11c
H5GQ2H24AFR-T2C
H5TC4G63AFR-11C
H5TQ2G63FFR
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PDF
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MTFC4G
Abstract: MTFC16G micron emmc MTFC32G micron eMMC 100 ball BGA MTfc8g emmc csd MTFC4 micron emmc 4.4 MTFC16GKQDI
Text: 4GB, 8GB, 16GB, 32GB: e•MMC Features e·MMC Memory MTFC4GGQDM, MTFC4GGQDI, MTFC8GKQDI, MTFC16GKQDI, MTFC32GKQDH Features Figure 1: Micron e·MMC Device • MultiMediaCard MMC controller and NAND Flash • 153-ball FBGA or 169-ball FBGA (6/6 RoHS-compliant)
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Original
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MTFC16GKQDI,
MTFC32GKQDH
153-ball
169-ball
41-compliant
84-A441)
09005aef838eabba
j534q567r
MTFC4G
MTFC16G
micron emmc
MTFC32G
micron eMMC 100 ball BGA
MTfc8g
emmc csd
MTFC4
micron emmc 4.4
MTFC16GKQDI
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PDF
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m312l
Abstract: No abstract text available
Text: 512MB, 1GB, 2GB FBGA DDR400 Registered DIMM DDR SDRAM DDR SDRAM Registered Module DDR400 Module 60FBGA 184pin Registered Module based on 512Mb B-die (x4, x8) with 1,125mil/1,200mil Height Revision 1.1 November. 2004 Revision 1.1 November 2004 512MB, 1GB, 2GB FBGA DDR400 Registered DIMM
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Original
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512MB,
DDR400
60FBGA)
184pin
512Mb
125mil/1
200mil
m312l
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PDF
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H5TQ2G63BFR-H9C
Abstract: H5TQ1G83BFR-H9C H26M42001EFR H5RS1H23MFR h27u1g8f2b H27U1G8F2 H27UBG8T2A H27UBG8T H5MS2G22MFR-J3M H26M54001BKR
Text: Rev 0.0 Q2’2010 Databook C omputing Memory DDR3 SDRAM : Component VDD DENSITY ORG. SPEED PART NUMBER PKG. FEATURE AVAIL. 1.5V 1Gb 256Mx4 DDR3 1333 H5TQ1G43BFR-H9C FBGA 78ball 8Bank, 1.5V, CL9,9-9-9 Now H5TQ1G43TFR-H9C FBGA(78ball) 8Bank, 1.5V, CL9,9-9-9
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Original
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256Mx4
H5TQ1G43BFR-H9C
78ball)
H5TQ1G43TFR-H9C
H5TQ1G43BFR-G7C
H5TQ1G43TFR-G7C
H5TQ1G83BFR-H9C
H5TQ2G63BFR-H9C
H5TQ1G83BFR-H9C
H26M42001EFR
H5RS1H23MFR
h27u1g8f2b
H27U1G8F2
H27UBG8T2A
H27UBG8T
H5MS2G22MFR-J3M
H26M54001BKR
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PDF
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Untitled
Abstract: No abstract text available
Text: 512MB, 1GB, 2GB FBGA DDR400 Registered DIMM DDR SDRAM DDR SDRAM Registered Module DDR400 Module 184pin Registered Module based on 512Mb B-die x4, x8 with 1,125mil/1,200mil Height 60 FBGA with Pb-Free (RoHS compliant) Revision 1.2 Nov. 2004 Revision 1.2 November. 2004
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Original
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512MB,
DDR400
184pin
512Mb
125mil/1
200mil
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PDF
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M312L2920BG0-CCC
Abstract: M312L5720BG0-CCC M312L6523BG0-CCC M312L2920BG0 DDR400 M312L2923BG0-CCC
Text: 512MB, 1GB, 2GB FBGA DDR400 Registered DIMM DDR SDRAM DDR SDRAM Registered Module DDR400 Module 60FBGA 184pin Registered Module based on 512Mb B-die (x4, x8) with 1,125mil/1,200mil Height Revision 1.0 November. 2003 Revision 1.0 November 2003 512MB, 1GB, 2GB FBGA DDR400 Registered DIMM
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Original
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512MB,
DDR400
60FBGA)
184pin
512Mb
125mil/1
200mil
M312L2920BG0-CCC
M312L5720BG0-CCC
M312L6523BG0-CCC
M312L2920BG0
M312L2923BG0-CCC
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PDF
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Untitled
Abstract: No abstract text available
Text: DATA SHEET 2G bits DDR2 Mobile RAM PoP 12mm x 12mm, 168-ball FBGA EDB2432BCPE Specifications Features • Density: 2G bits • Organization — 8M words × 32 bits × 8 banks • Data rate: 800Mbps (max.) • Package: 168-ball FBGA — Package size: 12.0mm × 12.0mm
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Original
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168-ball
EDB2432BCPE
800Mbps
M01E1007
E1881E20
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PDF
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Untitled
Abstract: No abstract text available
Text: 184pin Registered DDR SDRAM DIMMs based on 512Mb B ver. FBGA This Hynix Registered Dual In-Line Memory Module (DIMM) series consists of 512Mb B ver. DDR SDRAMs in 60 ball FBGA package on a 184pin glass-epoxy substrate. This Hynix 512Mb B ver. based Registered DIMM series provide a
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Original
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184pin
512Mb
184-pin
128Mb
HYMD512G726BF
157max
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PDF
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Untitled
Abstract: No abstract text available
Text: 184pin Registered DDR SDRAM DIMMs based on 512Mb C ver. FBGA This Hynix Registered Dual In-Line Memory Module (DIMM) series consists of 512Mb C ver. DDR SDRAMs in 60 ball FBGA package on a 184pin glass-epoxy substrate. This Hynix 512Mb C ver. based Registered DIMM series provide a
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Original
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184pin
512Mb
184-pin
128Mb
HYMD512G726CFP4N
157max
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PDF
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hynix module suffix
Abstract: DDR333 DDR400 DDR400B HYMD512G726BF4N DQSO d431
Text: 184pin Registered DDR SDRAM DIMMs based on 512Mb B ver. FBGA This Hynix Registered Dual In-Line Memory Module (DIMM) series consists of 512Mb B ver. DDR SDRAMs in 60 ball FBGA package on a 184pin glass-epoxy substrate. This Hynix 512Mb B ver. based Registered DIMM series provide a
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Original
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184pin
512Mb
184-pin
157max
hynix module suffix
DDR333
DDR400
DDR400B
HYMD512G726BF4N
DQSO
d431
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PDF
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Untitled
Abstract: No abstract text available
Text: 512Mb: x16 Mobile LPDDR2 SDRAM S4 Features Mobile LPDDR2 SDRAM MT42L32M16D1 Features Options Marking • VDD2: 1.2V • Configuration – 8 Meg x 16 x 4 banks • Device type – LPDDR2-S4, 1 die in package • FBGA “green” package – 121-ball FBGA 6.5mm x 8mm
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Original
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512Mb:
MT42L32M16D1
09005aef8467caf2
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PDF
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Untitled
Abstract: No abstract text available
Text: STM32F205xx STM32F207xx ARM-based 32-bit MCU, 150DMIPs, up to 1 MB Flash/128+4KB RAM, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 15 comm. interfaces & camera Datasheet − production data Features FBGA FBGA • ■ Core: ARM 32-bit Cortex -M3 CPU 120 MHz
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Original
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STM32F205xx
STM32F207xx
32-bit
150DMIPs,
Flash/128
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PDF
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|
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NAND sample code for stm32f2xx
Abstract: DCMI timing specification STM32F20xxx programming manual stm32f205rx STM32F20xxx reference manual STM32F207ZE programming manual stm32f205 STM32F20x STM32F20xxx STM32F207ZG
Text: STM32F205xx STM32F207xx ARM-based 32-bit MCU, 150DMIPs, up to 1 MB Flash/128+4KB RAM, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 15 comm. interfaces & camera Datasheet − production data Features • ■ FBGA FBGA Core: ARM 32-bit Cortex -M3 CPU 120 MHz
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Original
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STM32F205xx
STM32F207xx
32-bit
150DMIPs,
Flash/128
NAND sample code for stm32f2xx
DCMI timing specification
STM32F20xxx programming manual
stm32f205rx
STM32F20xxx reference manual
STM32F207ZE programming manual
stm32f205
STM32F20x
STM32F20xxx
STM32F207ZG
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PDF
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hynix module suffix
Abstract: No abstract text available
Text: 184pin Registered DDR SDRAM DIMMs based on 512Mb C ver. FBGA This Hynix Registered Dual In-Line Memory Module (DIMM) series consists of 512Mb C ver. DDR SDRAMs in 60 ball FBGA package on a 184pin glass-epoxy substrate. This Hynix 512Mb C ver. based Registered DIMM series provide a
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Original
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184pin
512Mb
184-pin
DDR400
DDR333
HYMD525G726CFP4-D43/J
hynix module suffix
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PDF
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Untitled
Abstract: No abstract text available
Text: 184pin Registered DDR SDRAM DIMMs based on 256Mb D ver. FBGA This Hynix Registered Dual In-Line Memory Module (DIMM) series consists of 256Mb D ver. DDR SDRAMs in 60 ball FBGA package on a 184pin glass-epoxy substrate. This Hynix 256Mb D ver. based Registered DIMM series provide a
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Original
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184pin
256Mb
184-pin
128Mb
HYMD212G726DF
157max
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PDF
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Untitled
Abstract: No abstract text available
Text: 184pin Registered DDR SDRAM DIMMs based on 512Mb C ver. FBGA This Hynix Registered Dual In-Line Memory Module (DIMM) series consists of 512Mb C ver. DDR SDRAMs in 60 ball FBGA package on a 184pin glass-epoxy substrate. This Hynix 512Mb C ver. based Registered DIMM series provide a
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Original
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184pin
512Mb
184-pin
HYMD525G726CFP4-D43/J
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PDF
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dual fet q51
Abstract: DDR333 DDR400 DDR400B HYMD512G726CFP4N-D43 hynix module suffix dc-dc 8030
Text: 184pin Registered DDR SDRAM DIMMs based on 512Mb C ver. FBGA This Hynix Registered Dual In-Line Memory Module (DIMM) series consists of 512Mb C ver. DDR SDRAMs in 60 ball FBGA package on a 184pin glass-epoxy substrate. This Hynix 512Mb C ver. based Registered DIMM series provide a
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Original
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184pin
512Mb
184-pin
HYMD525G726CFP4-D43/J
dual fet q51
DDR333
DDR400
DDR400B
HYMD512G726CFP4N-D43
hynix module suffix
dc-dc 8030
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PDF
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sdram dimm layout hynix
Abstract: 6050 DDR333 DDR400 DDR400B 256mb ddr333 200 pin hynix module suffix DM U23
Text: 184pin Registered DDR SDRAM DIMMs based on 256Mb D ver. FBGA This Hynix Registered Dual In-Line Memory Module (DIMM) series consists of 256Mb D ver. DDR SDRAMs in 60 ball FBGA package on a 184pin glass-epoxy substrate. This Hynix 256Mb D ver. based Registered DIMM series provide a
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Original
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184pin
256Mb
184-pin
157max
sdram dimm layout hynix
6050
DDR333
DDR400
DDR400B
256mb ddr333 200 pin
hynix module suffix
DM U23
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PDF
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Untitled
Abstract: No abstract text available
Text: STM32F205xx STM32F207xx ARM-based 32-bit MCU, 150DMIPs, up to 1 MB Flash/128+4KB RAM, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 15 comm. interfaces & camera Datasheet − production data Features FBGA FBGA • ■ ■ ■ ■ ■ ■ ■ ■ Core: ARM 32-bit Cortex -M3 CPU with
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Original
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STM32F205xx
STM32F207xx
32-bit
150DMIPs,
Flash/128
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PDF
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Untitled
Abstract: No abstract text available
Text: 200pin DDR SDRAM SO-DIMMs based on 512Mb C ver. FBGA This Hynix unbuffered Small Outline, Dual In-Line Memory Module (DIMM) series consists of 512Mb C ver. DDR SDRAMs in 60 ball FBGA packages on a 200pin glass-epoxy substrate. This Hynix 512Mb C ver. based unbuffered SODIMM series provide a high performance 8 byte interface in 67.60mm width form factor of industry standard. It is suitable for easy interchange and addition.
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Original
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200pin
512Mb
200-pin
DDR400,
DDR333obes)
HYMD512M646C
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PDF
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DDR266
Abstract: DDR266B DDR333 DDR400 DDR400B hynix ddr400 sdram 1Gb
Text: 200pin Unbuffered DDR SDRAM SO-DIMMs based on 512Mb B ver. FBGA This Hynix unbuffered Small Outline, Dual In-Line Memory Module (DIMM) series consists of 512Mb B ver. DDR SDRAMs in 60 ball FBGA packages on a 200pin glass-epoxy substrate. This Hynix 512Mb B ver. based unbuffered SODIMM series provide a high performance 8 byte interface in 67.60mm width form factor of industry standard. It is suitable for easy interchange and addition.
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Original
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200pin
512Mb
200-pin
DDR400,
DDR333
HYMD512M646B
DDR266
DDR266B
DDR400
DDR400B
hynix ddr400 sdram 1Gb
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PDF
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Untitled
Abstract: No abstract text available
Text: 200pin Unbuffered DDR SDRAM SO-DIMMs based on 512Mb B ver. FBGA This Hynix unbuffered Small Outline, Dual In-Line Memory Module (DIMM) series consists of 512Mb B ver. DDR SDRAMs in 60 ball FBGA packages on a 200pin glass-epoxy substrate. This Hynix 512Mb B ver. based unbuffered SODIMM series provide a high performance 8 byte interface in 67.60mm width form factor of industry standard. It is suitable for easy interchange and addition.
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Original
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200pin
512Mb
200-pin
DDR400,
HYMD512M646B
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PDF
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