EXOTHERMIC MOLD Search Results
EXOTHERMIC MOLD Result Highlights (4)
Part | ECAD Model | Manufacturer | Description | Download | Buy |
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TTC5886A |
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NPN Bipolar Transistor / VCEO=50 V / IC=5 A / hFE=400~1000 / VCE(sat)=0.22 V / tf=120 ns / New PW-Mold |
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TTC023 |
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NPN Bipolar Transistor / VCEO=120 V / IC=3 A / hFE=120~240 / VCE(sat)=0.19 V / tf=170 ns / New PW-Mold |
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TTA014 |
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PNP Bipolar Transistor / VCEO=-120 V / IC=-2.5 A / hFE=120~240 / VCE(sat)=-0.35 V / tf=65 ns / New PW-Mold |
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TTA2097 |
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PNP Bipolar Transistor / VCEO=-50 V / IC=-5 A / hFE=200~500 / VCE(sat)=-0.27 V / tf=60 ns / New PW-Mold |
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EXOTHERMIC MOLD Datasheets Context Search
Catalog Datasheet | Type | Document Tags | |
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Contextual Info: 40303.06 FSWLD 3/11/02 3:45 PM Page 229 The Furseweld Process Exothermic Welding Equipment is used by some of the world’s most demanding customers. By adding Furseweld to the Thomas & Betts product offering, T&B is now the only manufacturer that can offer exothermic welding, as well as |
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Contextual Info: T&B Catalog Number: UPC Number: Description: Status: 5410402T 78621085546 Exothermic Welding reusable graphite mold for Cable to Cable Connection. Type CC7 - Parallel Splice, #2 solid to #2 Wire Size, 65RTB Welding Powder Size, Handle Clamp HCPK4. Active General |
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5410402T 65RTB E9809 3B-50 | |
burndy YGHC-C
Abstract: burndy gstud-hy burndy grounding terminal burndy YGIB UL-96 UL-96A Burndy y750bh Burndy burndy GROUNDING CONNECTORS Y700DC-1B
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Ultrasonic welding circuit
Abstract: tantalum capacitors
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burndy Y750
Abstract: burndy Y35 Burndy Y35 hypress IEEE-837 burndy* YA Lug Burndy burndy Y39 STR 5634 kpb 1313 B455 E20
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KC22J12T13, EQC632C, B38-0330-00 burndy Y750 burndy Y35 Burndy Y35 hypress IEEE-837 burndy* YA Lug Burndy burndy Y39 STR 5634 kpb 1313 B455 E20 | |
Contextual Info: KEMET Electronics Corp. Conductive Polymer Capacitors for Lead Free Processing 260°C The conductive polymer capacitor is a solid-state device in which the cathode material of Tantalum-MnO2 is replaced with a conductive polymer coating (Figure 1). This replacement was initialized as the polymer affords a higher |
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J-STD-020C | |
Contextual Info: 403030.05BB 3/12/02 9:10 AM Page 193 Grounding GROUNDING Product Overview . . . . . . . . . . . . . . . . . . . . . 194-196 E-Z Ground Compression Connectors . . . . . . . . . . . . . . . . . 197-203, 205-209 Cast Copper Connectors for Grounding . . . . . . . . . . . . . . . . . . . . . . . . . 204, 210 |
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mechanics blue msds
Abstract: amp quality crimping handbook soil "electrical conductivity" underground power cable book GUIDE INSTALLATION rbs 2111 UL486A BURNDY split bolt UL467 Aluminum alloys physical properties ASTM nut and bolt
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ca capacitor
Abstract: AVX Tantalum chamberlain MIL-PRF-55365 schematic diagram welding device kyocera 4m
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S-STC00M407-N ca capacitor AVX Tantalum chamberlain MIL-PRF-55365 schematic diagram welding device kyocera 4m | |
Mn2O3
Abstract: Abstract ignition T510 T520 circuit diagram and abstract for timing bell system F3223 T491 solid tantalum chip capacitor", KEMET kemet cap mica
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F-3223; AP-253; Mn2O3 Abstract ignition T510 T520 circuit diagram and abstract for timing bell system F3223 T491 solid tantalum chip capacitor", KEMET kemet cap mica | |
LGA voiding
Abstract: CCGA APD-SCC-201 IBM ccga 67F4333 ceramic rework 810E N100 cte table flip chip substrate cte table epoxy
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67F4333, F52977, APD-SCC-201 LGA voiding CCGA IBM ccga 67F4333 ceramic rework 810E N100 cte table flip chip substrate cte table epoxy | |
Mn2O3
Abstract: Ta2O5 MnO2
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Ta2O5
Abstract: T510 materials T495
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Tantalum in Power Supply Applications
Abstract: Mn2O3 F211 Ta2O5 T510 Chip Tantalum Capacitor CAP materials T495 PCIM+177
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F2115 Tantalum in Power Supply Applications Mn2O3 F211 Ta2O5 T510 Chip Tantalum Capacitor CAP materials T495 PCIM+177 | |
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Contextual Info: Optically Clear Epoxy Encapsulating & Potting Compound 8321C Technical Data Sheet 8321C Description The 8321C Optically Clear Epoxy, Encapsulating and Potting Compound, is an electronic grade, optically clear epoxy. It cures at room temperature or by heat curing. |
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8321C 8321C | |
Contextual Info: High Temperature Epoxy Encapsulating & Potting Compound 832HT Technical Data Sheet 832HT Description The 832HT High Temperature Epoxy Encapsulating and Potting Compound is an electronic grade epoxy designed for high temperature environments. It is also an ideal encapsulant for very chemically aggressive |
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832HT 832HT | |
Contextual Info: Black Epoxy Encapsulating & Potting Compound 832B Technical Data Sheet 832B Description The 832B Black Epoxy Encapsulating and Potting Compound is an electric grade epoxy. It is simple to mix and easy to use. This two parts black epoxy provides great insulation and protection value. |
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193rd | |
Contextual Info: Thermally Conductive Epoxy Encapsulating & Potting Compound 832TC Technical Data Sheet 832TC Description The 832TC Thermally Conductive Epoxy, Encapsulating and Potting Compound, is an electric grade epoxy. It uses high purity aluminum oxide to provide excellent thermal conductivity at reasonable costs. This two |
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832TC 832TC | |
Contextual Info: Flame Retardant Epoxy Encapsulating & Potting Compound 833FRB Technical Data Sheet 833FRB Encapsulating and Potting Epoxy Description The 833FRB Flame Retardant Epoxy Encapsulating and Potting Compound is a UL 94V-0 recognized electric grade epoxy in the QMFZ2 category. This two-part epoxy provides a black, self-extinguishing finish |
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833FRB 833FRB | |
fuse d typeContextual Info: 893D Vishay Sprague Solid Tantalum Chip Capacitors TANTAMOUNT , Built-In-Fuse Miniature, Molded-Case FEATURES • Molded case available in three case codes. • Compatible with "High Volume" automatic pick and place Pb-free Available RoHS* • Electrically activated internal fuse. |
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535BAAC QC300801/ US0001. EIA-481-1. 18-Aug-05 fuse d type | |
893D226X
Abstract: 893D 893D105X
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535BAAC QC300801/ US0001. 330mm] 178mm] EIA-481-1. 05-Jan-04 893D226X 893D 893D105X | |
Contextual Info: 893D Vishay Sprague Solid Tantalum Chip Capacitors TANTAMOUNT , Built-In-Fuse Miniature, Molded-Case FEATURES • Molded case available in three case codes. • Compatible with "High Volume" automatic pick and place Pb-free Available RoHS* • Electrically activated internal fuse. |
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535BAAC QC300801/ US0001. 08-Apr-05 | |
893DContextual Info: 893D Vishay Sprague Solid Tantalum Chip Capacitors TANTAMOUNT , Built-In-Fuse Miniature, Molded-Case FEATURES • Molded case available in three case codes. • Compatible with "High Volume" automatic pick and place equipment. • Electrically activated internal fuse. |
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535BAAC QC300801/ US0001. 330mm] 178mm] EIA-481-1. 04-Feb-03 893D | |
893DContextual Info: 893D Vishay Sprague Solid Tantalum Chip Capacitors TANTAMOUNT , Built-In-Fuse Miniature, Molded-Case FEATURES • Molded case available in three case codes. • Compatible with "High Volume" automatic pick and place equipment. • Electrically activated internal fuse. |
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535BAAC QC300801/ US0001. EIA-481-1. 330mm] 178mm] 02-Mar-05 893D |