Untitled
Abstract: No abstract text available
Text: Product Number: 350-10-157-00-001100 Description: Interconnect Header .100 Grid; Straight Pin Header .025 Pin Head with Solder Tail Single Row Through Hole Plating Code: 10 Shell Plating: 10 µ" Gold over 100 µ" Nickel # Of Pins Mill-Max Part Number 57 350-10-157-00-001100
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C36000)
C/885
2002/95Annex
CG933,
CG-933
VRMS/150
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Untitled
Abstract: No abstract text available
Text: Product Number: 330-10-157-00-240000 Description: Interconnect Header Spring-Loaded Target Connector Single Row Plating Code: 10 Shell Plating: 10 " Gold over 100 μ" Nickel # Of Pins Mill-Max Part Number 57 330-10-157-00-240000 RoHS Compliant LOOSE PIN:
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C36000)
C/885
2002/95Annex
CG933,
CG-933
VRMS/150
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LA-BGA-FG680-S-B-01
Abstract: TLA700 FG680
Text: LA-BGA-FG680-S-B-01 Drawing Top View 0.2620" [6.654mm] 6.2000" [157.480mm] 2.6000" [66.040mm] Bottom View Page 1 of 2 Description: LA adaptor for TEKTRONIX TLA700 series Logic Analyzer 680 position BGA land socket to 680 position surface mountable BGA emulator foot, with latch housing high density Mictor
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LA-BGA-FG680-S-B-01
654mm]
480mm]
040mm]
TLA700
FG680
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AMD reflow soldering profile BGA
Abstract: visteon ford visteon eutectic 157 SMALL ELECTRONICS PROJECTS AMD reflow BGA ROHS nortel meridian Delco SIEMENS WASHING machine TOSHIBA GLASS MOLD
Text: Lead Pb -Free Packaging Strategy 2000− −2003 . . . . . JUNE 2000 (DECEMBER 2001 Update) . . . . JAMES HAYWARD . NOTE ON USAGE It is a peculiarity of the English language that the words “lead” (as in package lead) and “lead” (as in the metallic element) are homographic; that is, they are spelled the same, although they have
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Untitled
Abstract: No abstract text available
Text: Product Number: 340-43-157-30-780100 Description: Interconnect Socket .100 Grid; Surface Mount Socket Single Row; Block Style Surface Mount Accepts .015-.025" Leads Plating Code: 43 Shell Plating: 200 " Tin matte finish over 100 μ" Nickel Inner Contact Plating:
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C17200)
2002/95Annex
CG933,
CG-933
VRMS/150
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amd (BGA) replacement alloy
Abstract: Sn-58Bi NOKIA CIRCUIT PCB SIEMENS WASHING machine TOSHIBA GLASS MOLD washing machine bosch circuit diagram visteon sony antimony
Text: Lead Pb -Free Packaging Strategy 2000− −2003 . . JUNE 2000 . . . . . . . JAMES HAYWARD . NOTE ON USAGE It is a peculiarity of the English language that “lead” (as in package lead) and “lead” (as in the metallic element) are homographic; that is, they are spelled the same but have different
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Untitled
Abstract: No abstract text available
Text: Product Number: 340-99-157-30-780100 Description: Interconnect Socket .100 Grid; Surface Mount Socket Single Row; Block Style Surface Mount Accepts .015-.025" Leads Plating Code: 99 Shell Plating: 200 µ" Tin/Lead 93/7 over 100 µ" Nickel Inner Contact Plating:
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C17200)
2002/95Annex
CG933,
CG-933
VRMS/150
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Untitled
Abstract: No abstract text available
Text: Product Number: 340-44-157-30-780100 Description: Interconnect Socket .100 Grid; Surface Mount Socket Single Row; Block Style Surface Mount Accepts .015-.025" Leads Plating Code: 44 Shell Plating: 200 µ" Tin matte finish over 100 µ" Nickel Inner Contact Plating:
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C17200)
2002/95Annex
CG933,
CG-933
VRMS/150
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eutectic 157
Abstract: advanced 94vo fr4
Text: SMT Adapter 5 Energy Way, West Warwick, RI 02893 USA Tel: 800-424-9850 / 401-823-5200 Fax: 401-823-8723 E-mail: info@advintcorp.com Website: www.bgasockets.com SMT Adapter Typical Applications LGA Adapter De-balled BGA Adapter BEFORE BEFORE BGA LGA ADVANCED
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BGA-TECH04
eutectic 157
advanced
94vo fr4
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eutectic 157
Abstract: No abstract text available
Text: LGA/BGA SMT Adapter 5 Energy Way, West Warwick, RI 02893 USA Tel: 800-424-9850 / 401-823-5200 Fax: 401-823-8723 E-mail: info@advintcorp.com Internet: www.advintcorp.com LGA/BGA SMT Adapter Typical Applications LGA Adapter De-balled BGA Adapter BEFORE BEFORE
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Untitled
Abstract: No abstract text available
Text: LGA/BGA SMT Adapter 5 Energy Way, West Warwick, RI 02893 USA Tel: 800-424-9850 / 401-823-5200 Fax: 401-823-8723 E-mail: info@advintcorp.com Internet: www.advintcorp.com LGA/BGA SMT Adapter Typical Applications LGA Adapter De-balled BGA Adapter BEFORE BEFORE
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Untitled
Abstract: No abstract text available
Text: LGA/BGA SMT Adapter 5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com LGA/BGA SMT Adapter Typical Applications LGA Adapter De-balled BGA Adapter
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C36000)
ASTM-B-16
63Sn/37Pb
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interposing relay
Abstract: Allen-Bradley auxiliary contact 595-A 500F-BOD930 592-EUTB 592-EEHE 509-FOD 599-KA04 509-BOD Bulletin 709 Motor Starter Coil 599-k04
Text: Bulletin 500 Line Open Type Modular Kits and Components Selection Guide Bulletin 500, 500F, 509 NEMA AC Contactors and Starters Product Overview NEMA AC Contactor and Starter Modular Kits and Components NEMA sizes 0…4 for open-type Bulletin 500 top-wired contractors, Bulletin 500F feed-through contactors, and Bulletin 509 fullvoltage starters, are provided as modular kits for faster delivery. Other sizes and enclosed-type devices are also available.
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800T/H
500-SG008A-EN-P
interposing relay
Allen-Bradley auxiliary contact 595-A
500F-BOD930
592-EUTB
592-EEHE
509-FOD
599-KA04
509-BOD
Bulletin 709 Motor Starter Coil
599-k04
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Material density CDA 195
Abstract: eutectic 157 CDA 194 olin 7025 Eftec 64t X10-4 resistivity table sn 8400 MF202 silver
Text: Physical Constants of IC Package Materials 5 Table 5-1 through Table 5-9 list typical values for selected properties of materials used in IC packages. Table 5-1. Case Material Characteristics Properties Density Modulus of Elasticity Tensile Strength Alumina
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eutectic 157 b
Abstract: BT 742
Text: New High Density SMT B2B Board to Board Connectors Superior Features Designed-In For Long Term Reliability and Robust Handling Shrouded Design – protects exposed male pins during handling and provides positive polarization to aid in blind mating applications
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B2B-TECH00-A
eutectic 157 b
BT 742
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Untitled
Abstract: No abstract text available
Text: New High Density SMT B2B Board to Board Connectors Superior Features Designed-In For Long Term Reliability and Robust Handling Shrouded Design – protects exposed male pins during handling and provides positive polarization to aid in blind mating applications
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B2B-TECH00
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Sn-37Pb
Abstract: PBGA 256 reflow profile C1448 STR 6253 IR50 37pb nec smd transistors
Text: 1. NEC Electronics Lead Elimination Policies 1-1. Preface The 21st century, which has been called the "Century of the Environment", is a time in which humanity must earnestly grapple with the global environmental problems that became manifest at the end of the 20th century.
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101Yin
C14485EJ4V0PF00
Sn-37Pb
PBGA 256 reflow profile
C1448
STR 6253
IR50
37pb
nec smd transistors
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Untitled
Abstract: No abstract text available
Text: New High Density SMT B2B Board to Board Connectors Superior Features Designed-In For Long Term Reliability and Robust Handling Shrouded Design – protects exposed male pins during handling and provides positive polarization to aid in blind mating applications
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B2B-TECH01
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Untitled
Abstract: No abstract text available
Text: CM1424 MultiMedia Card EMI Filter Array with ESD Protection Features Product Description • The CM1424 is an EMI filter array integrating 3 pi-filters C-R-C and 2 channels of ESD protection. The CM1424 has component values of 12pF - 100Ω - 12pF. The parts include avalanche-type ESD diodes on every
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CM1424
CM1424
IEC61000-4-2
MILSTD-883
CM1424-01
178mm
CM1424-03
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mmc cARD PCB FOOTPRINT
Abstract: CM1424 CM1424-01CP CM1424-01CS CM1424-03CP CM1424-03CS
Text: CM1424 MultiMedia Card EMI Filter Array with ESD Protection Features Product Description • The CM1424 is an EMI filter array integrating 3 pi-filters C-R-C and 2 channels of ESD protection. The CM1424 has component values of 12pF - 100Ω - 12pF. The parts include avalanche-type ESD diodes on every
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CM1424
CM1424
IEC61000-4-2
MILSTD-883
CM1424-01
178mm
CM1424-03
mmc cARD PCB FOOTPRINT
CM1424-01CP
CM1424-01CS
CM1424-03CP
CM1424-03CS
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D4 diode top mark
Abstract: top side marking b2 CM1424 CM1424-01CP CM1424-01CS CM1424-03CP CM1424-03CS mmc cARD PCB FOOTPRINT
Text: CM1424 MultiMedia Card EMI Filter Array with ESD Protection Features Product Description • The CM1424 is an EMI filter array integrating 3 pi-filters C-R-C and 2 channels of ESD protection. The CM1424 has component values of 12pF - 100Ω - 12pF. The parts include avalanche-type ESD diodes on every
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CM1424
CM1424
IEC61000-4-2
MILSTD-883
CM1424-01
178mm
CM1424-03
D4 diode top mark
top side marking b2
CM1424-01CP
CM1424-01CS
CM1424-03CP
CM1424-03CS
mmc cARD PCB FOOTPRINT
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Untitled
Abstract: No abstract text available
Text: Product Number: 310-91-157-41-001000 Description: Interconnect Socket .100 Grid; Straight Socket Standard Solder Tail 0.125 Tail Single Row Through Hole Accepts .015-.025" Leads Plating Code: 91 Shell Plating: 200 " Tin/Lead(93/7) over 100 μ" Nickel
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C17200)
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PT 2102 ic
Abstract: HXTR-41Q1 HXTR-4101TXV 2N6679 HPAC-70GT HXTR-2101 HXTR-4101 hxtr-6105 6105tx BV EI 302 2003
Text: H E W L E T T - P A C K A R D n CMPNTS EOE D £3 44475Û4 m General Purpose Transistors HXTR-2001 Chip Technical Data Features ^ k laert ; LJ Generic Chip HXTR-2001 Recommended Die Attach and Bonding Procedures Eutectic Die Attach at a stage temperature of 410 ± 10°C under
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HXTR-2001
2N6679,
HXTR-2101,
HXTR-2102,
HXTR-4101,
HXTR-6105,
HXTR-6106,
HXTR-6106
MIL-S-19500,
PT 2102 ic
HXTR-41Q1
HXTR-4101TXV
2N6679
HPAC-70GT
HXTR-2101
HXTR-4101
hxtr-6105
6105tx
BV EI 302 2003
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Untitled
Abstract: No abstract text available
Text: ADVANCED aKJA« INTERCONNECTIONS. LGA/BGA SMT Adapter 5 Energy Way, P.O. Box 1019, West Warwick, Rl 02893 USA Tel. 800-424-9850/401-823-5200 » Fax 401-823-8723 •Email info@advintcorp.com • Internet http://www.advintcorp.com LGA/BGA SMT Adapter Typical Applications
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OCR Scan
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CustomC36000)
ASTM-B-16
63Sn/37Pb
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