ENPLAS FPQ Search Results

enplas

Abstract: enplas socket CA-QFE208SB1-L-Z-01 CA-QFE208SB1-L-Z-T-01 SF-QFE208SB-L-01 FPQ-208-0
Contextual Info: 2.050" Top View 2.500" Enplas socket: part number determined from package dimensions 0.884" 0.234" 1 2 0.250" assembled SF-QFE208SB-L-01 sub assembly (included) Side View 0.5mm 1.165" Carrier adapter part # Enplas socket part # CA-QFE208SB1-L-Z-T-01 FPQ-208-0.5-06

enplas

Abstract: CA-QFE208SB1-L-Z-T-01 SF-QFE208SB-L-01
Contextual Info: 2.650" 0.100" typ. 0.575" Top View 1 3.600" 2.500" Enplas socket: part number determined from package dimensions 0.819" 3 0.229" 0.229" 2 0.250" assembled SF-QFE208SB-L-01 sub assembly (included) Side View 0.5mm 1.165" Carrier adapter part # Enplas socket part #

enplas

Abstract: CA-QFE208SB1-G-Z-T-01 SF-QFE208SB-G-01 FPQ-208-0 TO-208
Contextual Info: 2.650" 0.100" typ. 0.575" Top View 1 3.600" 2.500" Enplas socket: part number determined from package dimensions 0.819" 3 0.229" 0.229" 2 0.3" assembled SF-QFE208SB-G-01 sub assembly (included) Side View 0.5mm 1.165" Carrier adapter part # Enplas socket part #

Enplas fpq

Abstract: Enplas FPQ-128-0 Enplas drawings CA-QFE128SD-K-Z-01 SF-QFE128SD-K-01
Contextual Info: 56.85mm [2.238"] Top View 53.80mm [2.118"] Side View ENPLAS FPQ-128-0.4-01A 29.69mm [1.169"] 32.13mm [1.265] assembled See SF-QFE128SD-K-01 Description: Carrier Adapter 128 position QFP ZIF socket to 128 position surface mountable QFP emulator foot. The 2 piece adaptor interconnects via a gold plated mini-grid socket interface.

Yamaichi ic354

Abstract: IC354 IC51-2084-1052-36 IC234-1004-023P YAMAICHI ic234 IC51-0484-806 648-0482211 QP1-120050-272 IC51-1004-809 IC234-1444-053P
Contextual Info: FUJITSU SEMICONDUCTOR DATA SHEET Socket 1. Socket .2 2 List of Test Sockets .3

socket Yamaichi ic51 qfp

Abstract: DP-24N IC-86 Kogyo welcon DIP SOCKET AUGAT DIP SOCKETS IC386 Enplas fpq FP-54 IC51-1004-395
Contextual Info: Sockets for Evaluating Surface and Through-Hole Mount Packages 1. SOCKET LIST Table 1 lists the sockets available on the market for evaluating the characteristics o f surface and through-hole package devices. For details, please inquire directly to the socket manufacturer.

Yamaichi ic354

Abstract: IC354 IC51-2084-1052-36 IC51-0484-806 Enplas OTS-32-0.5-01 sumitomo 3m Enplas fpq 352 IC235-0442 fpq-64-0.5-06 Enplas fpq 240
Contextual Info: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 8. RELATED INFORMATION This document is Chapter 8 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 8. RELATED INFORMATION 8. RELATED INFORMATION

FPQ-256(352)-0.5-04

Abstract: ic149-208-161-s5 FPQ-256 Enplas drawings IC51-1004-809 Enplas fpq 352 Yamaichi TQFP Enplas fpq IC51-1764-1505-5 IC51-1444-1354
Contextual Info: v2.0 Socket Recommendation for Actel FPGA Packages So c ke t s f or Pr o t o t yp i n g w i t h Ac t e l F P G A s Actel offers a range of surface-mount sockets to make it easier for designers to prototype designs using Actel one-time-programmable FPGAs. These sockets have been manufactured for Actel by some of

FP-64

Abstract: IC386 KOGYO Yamaichi IC8620-6409-G4
Contextual Info: SOCKETS FOR EVALUATING SURFACE AND THROUGH-HOLE MOUNT PACKAGES 1. SOCKET LIST T able I lists th e s o c k e ts a v a ila b le o n th e m a rk e t fo r e v a lu a tin g th e c h a ra c te ristic s o f s u rfa c e a n d th ro u g h -h o le p a c k ag e d e v ic e s . F o r d e ta ils , p le a se

ic 4006

Abstract: Yamaichi HITACHI, FP-64 IC37NR-2806-G4
Contextual Info: SOCKETS FOR EVALUATING SURFACE AND THROUGH-HOLE MOUNT PACKAGES 1. SOCKET LIST T able 1 lists th e .sockets av a ila b le o n th e m a rk e t to r e v a lu a tin g th e c h a ra c te ristic s o f s u rfa c e a n d th ro u g h -h o le p a c k ag e d e v ic e s . F o r d e ta ils ,

SMD MARKING CODE 071 A01

Abstract: smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo
Contextual Info: To Top Contents Safety Precautions 1 Introduction to Packages 1.1 Overview 1.2 Package Lineup 1.3 Package Forms 1.4 Package Structures 1.5 How Package Dimensions Are Indicated 1.6 Package Codes 1.7 Marking 1.8 Future Trends in Packages 2 Package Mounting Methods

Yamaichi IC51-1444-1354-7 footprint

Abstract: IC149-208-161-S5 BPW32 Enplas drawings BPW896-1030-30AB01L IC51-1764-1505-5 IC51-1004-809 SY-PQ240 enplas FPQ-256
Contextual Info: v3.1 Socket Recommendation for Actel FPGA Packages Sockets for Prototyping with Actel FPGAs Actel offers a range of surface-mount sockets to make it easier for designers to prototype designs using Actel one-time-programmable FPGAs. These sockets have been manufactured for Actel by some of

LGA 1155 Socket PIN diagram

Abstract: marking code smd fujitsu Yamaichi ic354 marking code smd semiconductor fujitsu pitch 0.4 QFP 256p SMD transistor M05 YAMAICHI ic234 smd code 38P fpq-144-0.5-03 smd p08
Contextual Info: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and

PA44-QP-03

Abstract: PA44-QP-16 PA44-QP
Contextual Info: PA44-QP -03, -16 or -06T Data Sheet 44 pin QFP socket/44 pin PLCC plug Supported Device/Footprints This adapter allows a QFP device to be inserted into a PLCC socket. The adapter can be built with test points upon request. Mfgr Many Device Device 44 pin Package Device

PA44Q-1-03

Abstract: PA44Q-1-14C PA44Q-1-16 PA44Q1X Enplas OTQ Enplas 28 pin
Contextual Info: PA44Q-1-xxx Data Sheet 44 pin QFP socket/44 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction This adapter accepts a 44 pin QFP device and connects it to a 44 pin DIP footprint. It can be used for device programming or prototyping. These adapters are made of 3 sub-assemblies. They assemble

PA44QF14C-44QF

Abstract: PA44QF16-44QF PA44QF03-44QF 44QXQF QFP 128 pin Socket Enplas Enplas fpq FPQ-44-0.8-16 qfp 0.8mm Enplas OTQ
Contextual Info: PA44QFxxx-44QF Data Sheet 44 pin QFP socket/44 pin QFP plug Supported Device/Footprints These adapters accept 44 pin QFP devices and have a removable 44 pin QFP solder-down plug. This allows QFP device to be inserted into and removed from a prototype easily.

HT 1200-4

Abstract: IC51-2084-1052-11 IC51-0242-1341 YAMAICHI ic234 transistor fpq 630 IC51-0404-1511 fpq-144-0.5-03 648-0482211-A01 IC189 Series Open Top SOP, SSOP, TSOP Type I a HLQFP 176 Package drawing
Contextual Info: Hitachi Semiconductor Package Data Book ADE–410–001C 4th Edition March/98 Semiconductor & Integrated Circuit Devision, Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher

Contextual Info: PA51-QD -03, -14C or -16 Data Sheet 44 pin PQFP or TQFP socket/40 pin DIP 0.6” plug Supported Device/Footprints These adapters allows programming of many QFP devices in their DIP footprint. The following is a partial list. The following devices are supported using the indicated footprint.

LGA 1156 PIN OUT diagram

Abstract: QFP11T144-002 LGA 1156 Socket diagram 216-LQFP Wells-CTI 36 lead Flat Pack smd AAAS Wells-CTI LCC socket Wells-CTI 880 020 BGA136 Enplas drawings
Contextual Info: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and

PT740 AB

Abstract: diode AE 84A KS74 FP64E hitachi FET EDR-7316 Hitachi DSAUTAZ006 IC51-2084-1052 OTS-48
Contextual Info: Hitachi Semiconductor Package Data Book ADE–410–001G 8th Edition September/2000 Semiconductor & Integrated Circuits Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher

HT 1200-4

Abstract: YAMAICHI ic234 PT740 AB TSSOP YAMAICHI SOCKET FP-20-0.65-01 IC51-1444-1354-7 PT817 Enplas drawings IC51-2084-1052-11 IC 7418 IC51-0242-1341
Contextual Info: Hitachi Semiconductor Package Data Book ADE–410–001B 3rd Edition March/97 Semiconductor & Integrated Circuit Devision, Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher functional

IC51-128

Abstract: transistor fpq 630 PC-68 TTP-48DF OF IC 7421 Enplas fpq Enplas PT740 AB am fm radio Hitachi DSAUTAZ005
Contextual Info: Hitachi Semiconductor Package Data Book Introduction Contents Section 1 Introduction of Packages 1.1 Types of Packages and Advantages 1.2 IC Package Name and Code Indication 1.3 Method of Indicating IC Package Dimensions 1.4 Lineups in Terms of Shapes and Materials

Contextual Info: PA7032-QFP -16 or -06T Data Sheet 44 pin PQFP or TQFP socket/40 pin DIP 0.6” plug Supported Device/Footprints Adapter Parts & Part Numbers This adapter allows programming of the Altera 7032 in a QFP package using one of several 40 pin DIP programmers. The following chart shows the various socket and board part

IC Package Names and Code Designations

Abstract: data sheet IC 7408 7404 not gate ic MSP 044 THERMISTOR enplas otq-100-0.5 IC 7404 7406 IC51-1004-809 ic 7404 datasheet HLP40R ic 7408
Contextual Info: Hitachi Semiconductor Package DATA BOOK ADE 410-001A Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher functional capacity and higher density and developing packages