AN-100
Abstract: CPC7582 CPC7582BC EIA-481-2 GR-1089-CORE
Text: Not for New Designs CPC7582 Line Card Access Switch Features Description • Small 16-pin SOIC and 16-pin DFN • DFN package printed-circuit board footprint is 60 percent smaller than the SOIC version, 70 percent smaller than 4th generation EMR solutions.
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CPC7582
16-pin
DS-CPC7582-R05
AN-100
CPC7582
CPC7582BC
EIA-481-2
GR-1089-CORE
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5 pin relay NO NC
Abstract: AN-100 CPC7581 EIA-481-2 GR-1089-CORE J-STD-033 pin plating microinch
Text: Not for New Designs CPC7581 Line Card Access Switch Features Description • Small 16-pin SOIC or DFN package • DFN package printed-circuit board footprint is 60 percent smaller than the SOIC version, 40 percent smaller than fourth generation EMR solutions.
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CPC7581
16-pin
DS-CPC7581-R05
5 pin relay NO NC
AN-100
CPC7581
EIA-481-2
GR-1089-CORE
J-STD-033
pin plating microinch
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AN-100
Abstract: CPC7582 CPC7582BC EIA-481-2 GR-1089-CORE
Text: CPC7582 Line Card Access Switch Features Description • Small 16-pin SOIC and 16-pin DFN • DFN package printed-circuit board footprint is 60 percent smaller than the SOIC version, 70 percent smaller than 4th generation EMR solutions. • Monolithic IC reliability
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CPC7582
16-pin
DS-CPC7582-R04
AN-100
CPC7582
CPC7582BC
EIA-481-2
GR-1089-CORE
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Untitled
Abstract: No abstract text available
Text: Not for New Designs CPC7582 Line Card Access Switch Features Description • Small 16-pin SOIC and 16-pin DFN • DFN package printed-circuit board footprint is 60 percent smaller than the SOIC version, 70 percent smaller than 4th generation EMR solutions.
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CPC7582
16-pin
DS-CPC7582-R05
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k1b0
Abstract: AN-100 CPC7581 EIA-481-2 J-STD-020A IPC-9502
Text: CPC7581 Line Card Access Switch Features Description • Small 16-pin SOIC or micro-leadframe package • MLP package printed-circuit board footprint is 60 percent smaller than the SOIC version, 40 percent smaller than fourth generation EMR solutions. • Monolithic IC reliability
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CPC7581
16-pin
DS-CPC7581-R3
k1b0
AN-100
CPC7581
EIA-481-2
J-STD-020A
IPC-9502
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AN-100
Abstract: CPC7582 CPC7582BC EIA-481-2 GR-1089-CORE J-STD-020A
Text: CPC7582 Line Card Access Switch Features Description • Small 16-pin SOIC or micro-leadframe package • MLP package printed-circuit board footprint is 60 percent smaller than the SOIC version, 70 percent smaller than 4th generation EMR solutions. • Monolithic IC reliability
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CPC7582
16-pin
DS-CPC7582-R3
AN-100
CPC7582
CPC7582BC
EIA-481-2
GR-1089-CORE
J-STD-020A
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Untitled
Abstract: No abstract text available
Text: CPC7581 Line Card Access Switch Features Description • Small 16-pin SOIC or DFN package • DFN package printed-circuit board footprint is 60 percent smaller than the SOIC version, 40 percent smaller than fourth generation EMR solutions. • Monolithic IC reliability
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CPC7581
16-pin
DS-CPC7581-R04
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contactor 3 phase
Abstract: dc coil contactor
Text: 3 Phase RHP - Hybrid Solid State Contactors 3 Phase Contactor 3 Phase Contactor 40-50 Amp 280/600 VAC 40-50 Amp 120/240 VAC DC Input ENT PATDING PEN AC Input Combined SSR and EMR advantages Lifetime >2 million operations @ full load No heat sink required DC logic compatible input
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ed24e
Abstract: IEC62314 iec 62314
Text: ED Series • AC output Solid State Relay in an Industry standard EMR plug in package • Ratings of 3 & 5 Amps • Load voltage range of 24-280VAC • Fits standard DIN rail & PCB mountable sockets • LED input status indicator • AC or DC control • cUL Recognized, IEC Rated, CE & RoHS Compliant
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24-280VAC
ED24D3
ED24C3
ED24F3
ED24D5
ED24C5
ED24F5
ED24E5
ED24B5
47-63Hz)
ed24e
IEC62314
iec 62314
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Untitled
Abstract: No abstract text available
Text: ED Series • AC output Solid State Relay in an Industry standard EMR plug in package • Ratings of 3 & 5 Amps • Load voltage range of 24-280VAC • Fits standard DIN rail & PCB mountable sockets • LED input status indicator • AC or DC control • cUL Recognized, IEC Rated, CE & RoHS Compliant
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24-280VAC
ED24D3
ED24C3
ED24F3
ED24D5
ED24C5
ED24F5
ED24E5
ED24B5
47-63Hz)
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contactor 3 phase
Abstract: No abstract text available
Text: 3 Phase RHP - Hybrid Solid State Contactors 3 Phase Contactor 3 Phase Contactor 40-50 Amp 280/600 VAC 40-50 Amp 120/240 VAC DC Input ENT PATDING PEN AC Input Combined SSR and EMR advantages Lifetime >2 million operations @ full load No heat sink required DC logic compatible input
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100k-cycle
UL508
contactor 3 phase
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Untitled
Abstract: No abstract text available
Text: ED Series • AC output Solid State Relay in an Industry standard EMR plug in package • Ratings of 3 & 5 Amps • Load voltage range of 24-280VAC • Fits standard DIN rail & PCB mountable sockets • LED input status indicator • AC or DC control • cUL Recognized, IEC Rated, CE & RoHS Compliant
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24-280VAC
ED24D3
ED24C3
ED24F3
ED24D5
ED24C5
ED24F5
ED24E5
ED24B5
47-63Hz)
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ed24e
Abstract: RS-443 ED24B5
Text: ED Series • AC output Solid State Relay in an Industry standard EMR plug in package • Ratings of 3 & 5 Amps • Load voltage range of 24-280VAC • Fits standard DIN rail & PCB mountable sockets • LED input status indicator • AC or DC control • cUL Recognized, IEC Rated, CE & RoHS Compliant
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24-280VAC
ED24D3
ED24C3
ED24F3
ED24D5
ED24C5
ED24F5
ED24E5
ED24B5
47-63Hz)
ed24e
RS-443
ED24B5
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Untitled
Abstract: No abstract text available
Text: W3H128M72E-XSBX W3H128M72E-XNBX 1GB – 128M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS Data rate = 667, 533, 400 56% space savings vs. FBGA Package: Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 22mm
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W3H128M72E-XSBX
W3H128M72E-XNBX
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Untitled
Abstract: No abstract text available
Text: W3H64M64E-XSBX 512MB – 64M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS Data rate = 667, 533, 400 58% Space Savings vs. FBGA Package: Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 22mm 43% I/O reduction vs FBGA
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W3H64M64E-XSBX
512MB
667Mbs
533Mbs
400Mbs
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Untitled
Abstract: No abstract text available
Text: W3H64M64E-XSBX 512MB – 64M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS Data rate = 667, 533, 400 58% Space Savings vs. FBGA Package: Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 22mm 43% I/O reduction vs FBGA
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W3H64M64E-XSBX
512MB
667Mbs
533Mbs
400Mbs
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W3H128M72E-XSBX
Abstract: 84 FBGA
Text: White Electronic Designs W3H128M72E-XSBX 128M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667, 533, 400 Package: CK/CK# Termination options available • 0 ohm, 20 ohm • 208 Plastic Ball Grid Array PBGA , 16 x 22mm Posted CAS additive latency: 0, 1, 2, 3 or 4
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W3H128M72E-XSBX
775mA
975mA
-100ps
250ps
350ps
400ps
W3H128M72E-XSBX
84 FBGA
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Untitled
Abstract: No abstract text available
Text: White Electronic Designs W3H128M72E-XSBX 128M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667, 533, 400 Package: CK/CK# Termination options available • 0 ohm, 20 ohm • 208 Plastic Ball Grid Array PBGA , 16 x 22mm Posted CAS additive latency: 0, 1, 2, 3 or 4
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W3H128M72E-XSBX
W3H128M72E-XSBX
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Untitled
Abstract: No abstract text available
Text: W3H128M72E-XSBX W3H128M72E-XNBX 1GB – 128M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Commercial, Industrial and Military Temperature Ranges Data rate = 667, 533, 400 Organized as 128M x 72 Package: Weight: W3H128M72E-XSBX - 4 grams max
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W3H128M72E-XSBX
W3H128M72E-XNBX
W3H128M72E-XSBX
W3H128M72E-XNBX
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W3H128M72E-XSBX
Abstract: No abstract text available
Text: White Electronic Designs W3H128M72E-XSBX 128M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667, 533, 400 Package: CK/CK# Termination options available • 0 ohm, 20 ohm • 208 Plastic Ball Grid Array PBGA , 16 x 22mm Posted CAS additive latency: 0, 1, 2, 3 or 4
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W3H128M72E-XSBX
W3H128M72E-XSBX
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DDR2 x32
Abstract: K4T1G313QI-MCE7
Text: DDR2 SDRAM K4T1G313QI 1Gb x32 I-die DDR2 SDRAM Specification 128FBGA with Lead-Free & Halogen-Free RoHS compliant INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE
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K4T1G313QI
128FBGA
DDR2 x32
K4T1G313QI-MCE7
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weight sensor
Abstract: CSP301 DD800
Text: More Precision optoNCDT 1810-50 / 2210 Short measurement ranges at long standoff distances In contrast to conventional laser sensors, the Long-Range series allows accurate measurements to be taken at much longer stand off distances than normal. This is an important advantage, especially if the sensor
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120x120x40mm
230VAC
24VDC
IF2004
RS422
DD800
CSP301
Y9761136-B030098DGO
weight sensor
CSP301
DD800
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MR1020
Abstract: DD800 weight sensor b 806
Text: More Precision optoNCDT 1810-50 / 2210 Short measurement ranges at long standoff distances In contrast to conventional laser sensors, the Long-Range series allows accurate measurements to be taken at much longer stand off distances than normal. This is an important advantage, especially if the sensor
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120x120x40mm
230VAC
24VDC
IF2004
RS422
DD800
CSP301
Y9761136-B050089DGO
MR1020
DD800
weight sensor
b 806
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DP8490V
Abstract: DP8490n dp8490 ncr5380 fxp 3s NCR SCSI ns800 DP5380
Text: PRELIMINARY January 1989 DP8490 Enhanced Asynchronous SCSI Interface EASI General Description The DP8490 EASI is a C M O S device designed to provide a low cost, high perform ance Sm all C om puter System s Inter face. It com plies w ith th e ANS X 3 .131-1986 SCSI standard
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OCR Scan
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PDF
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DP8490
NCRS380
DP5380
NCR5380,
DP5380tor
2-26A
AA32096
DP8490V
DP8490n
ncr5380
fxp 3s
NCR SCSI
ns800
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