KLM8G2FE3B
Abstract: klm8g samsung eMMC 4.5 TLC nand samsung tlc nand flash KLM4G 153 ball eMMC memory SAMSUNG emmc klm8g2 Samsung KLMBG4GE2A
Text: Samsung eMMC Managed NAND Flash memory solution supports mobile applications FBGA QDP Package BROCHURE Efficiency, reduced costs and quicker time to market Expand device development with capable memory solutions Simplify mass storage designs Conventional NAND Flash memory can be challenging to
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SDIN7DP2-4G
Abstract: TWL6037 Sandisk eMMC OMAP5432 OMAP5430 SDIN7DP2 IN248 IN255 SN75LVCP412
Text: OMAP5432 ES2.0 EVM System Reference Manual Texas Instruments Revision 0.4 March 1, 2013 DOC-21163 OMAP5432 ES2.0 EVM System Reference Manual Preface Read This First About This Manual This manual should be used by software and hardware developers of applications based on the
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OMAP5432
DOC-21163
750-2628-2XX-SCH)
EVM5432
750-2628-213-EBOM)
SDIN7DP2-4G
TWL6037
Sandisk eMMC
OMAP5430
SDIN7DP2
IN248
IN255
SN75LVCP412
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OMAP5430
Abstract: OMAP5432 MIPI CSI-2 Parallel bridge Toshiba eMMC 4.40 emmc pcb layout toshiba eMMC DS MIPI DPI CAMERA PARALLEL RGB TO MIPI CSI-2 TWL6041 emmc toshiba
Text: Version F EL I M Data Manual IN Multimedia Device Engineering Samples 2.0 AR OMAP5430 Public Version PR ADVANCE INFORMATION concerns new products in the sampling or preproduction phase of development. Characteristic data and other specifications are subject to change without notice.
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OMAP5430
SWPS052F
OMAP5430
OMAP5432
MIPI CSI-2 Parallel bridge
Toshiba eMMC 4.40
emmc pcb layout
toshiba eMMC DS
MIPI DPI
CAMERA PARALLEL RGB TO MIPI CSI-2
TWL6041
emmc toshiba
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Untitled
Abstract: No abstract text available
Text: Home > Products > USB Controllers > Bridges - West Bridge Controllers > Bay > CYWB0163BB-FBXIT CYWB0163BB-FBXIT Alert me about changes to this product Status: In Production Datasheet Inventory Packaging/Ordering Quality and RoHS Technical Documents Related Products
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CYWB0163BB-FBXIT
unitA991
CYWB0163BB-FBXIT
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Untitled
Abstract: No abstract text available
Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 5, 06/2013 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch
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IMX50CEC
MCIMX50
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Samsung eMMC 4.51
Abstract: samsung eMMC 4.5
Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 2, 05/2012 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch
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IMX50CEC
MCIMX50
Samsung eMMC 4.51
samsung eMMC 4.5
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samsung eMMC 4.5
Abstract: Samsung eMMC 4.41 lpddr2 emmc emmc 4.41 spec emmc 4.5 spec 153 ball eMMC memory Samsung eMMC 4.51 samsung* lpddr2* pop package emmc Pin assignment eMMC 4.4
Text: Freescale Semiconductor Data Sheet: Advanced Information Document Number: IMX50CEC Rev. 2, 04/2012 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch
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IMX50CEC
MCIMX50
samsung eMMC 4.5
Samsung eMMC 4.41
lpddr2 emmc
emmc 4.41 spec
emmc 4.5 spec
153 ball eMMC memory
Samsung eMMC 4.51
samsung* lpddr2* pop package
emmc Pin assignment
eMMC 4.4
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samsung eMMC 4.5
Abstract: eMMC 4.51 Samsung eMMC 4.41 emmc 4.5 spec Samsung eMMC 4.51 emmc 4.41 spec eMMC PoP samsung lpddr2 153 ball eMMC memory 0.8 emmc spec samsung
Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 2, 05/2012 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch
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IMX50CEC
MCIMX50
samsung eMMC 4.5
eMMC 4.51
Samsung eMMC 4.41
emmc 4.5 spec
Samsung eMMC 4.51
emmc 4.41 spec
eMMC PoP
samsung lpddr2
153 ball eMMC memory 0.8
emmc spec samsung
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Untitled
Abstract: No abstract text available
Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 6, 08/2013 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch
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IMX50CEC
MCIMX50
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Untitled
Abstract: No abstract text available
Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 3, 11/2012 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch
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IMX50CEC
MCIMX50
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samsung eMMC 4.5
Abstract: emmc 4.4 standard jedec Samsung eMMC 4.41 153 ball eMMC memory emmc 4.5 spec emmc spec emmc 4.41 spec 50 50 mfd CAPACITOR USB_OTG Samsung eMMC 4.51
Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 4, 1/2013 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch
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IMX50CEC
MCIMX50
samsung eMMC 4.5
emmc 4.4 standard jedec
Samsung eMMC 4.41
153 ball eMMC memory
emmc 4.5 spec
emmc spec
emmc 4.41 spec
50 50 mfd CAPACITOR
USB_OTG
Samsung eMMC 4.51
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Untitled
Abstract: No abstract text available
Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 7, 10/2013 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch
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IMX50CEC
MCIMX50
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rk3188
Abstract: RK3188-T ARGB888 emmc boot sequence
Text: RK3188Technical Reference ManualRev 1.2 Chapter 1 Introduction RK3188 is a low power, high performance processor for mobile phones, personal mobile internet device and other digital multimedia applications, and integrates quad-core Cortex-A9 with separately NEONand FPU coprocessor.
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RK3188Technical
RK3188
1080p
60fps,
264/MVC/VP8
30fps,
RK3188-T
ARGB888
emmc boot sequence
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Manufacturer ID list eMMC
Abstract: emmc 4.41 spec finder type 81.11
Text: Intel Atom Processor Z2760 Datasheet October 2012 Revision 1.0 Document Number: 328104-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS
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Z2760
Z2760
Manufacturer ID list eMMC
emmc 4.41 spec
finder type 81.11
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sony IMX 161
Abstract: STMP3780 toshiba 16GB Nand flash emmc Cortex-A8 MIPI Toshiba emmc i.mx258 MC9S08GP32 sony cmos sensor imx 17 OV56 Sony IMX283
Text: TM August 2013 TM 2 Your Interface to the World i.MX families offer the most versatile platforms for multimedia and display applications, bringing personality and interactivity to a whole new world of products Auto Smart Devices TM Industrial Medical 3 New!
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PMM-C
Abstract: micro sd card CYWB0163BB
Text: CYWB0163BB/CYWB0164BB West Bridge Bay USB and Mass Storage Controller Features • Best-in-class sideloading performance >30 MBps based on Cypress's proprietary SLIM® II technology, enabling direct path from Hi-Speed USB 2.0 to mass storage devices
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CYWB0163BB/CYWB0164BB
PMM-C
micro sd card CYWB0163BB
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CYUSB202X
Abstract: No abstract text available
Text: CYUSB202X SD2 USB and Mass Storage Peripheral Controller Features • ■ ■ ❐ ❐ Latest-generation storage support ❐ SD2.0/SDXC – UHS1 SDR50 / DDR50 Master ❐ eMMC 4.4 Master ❐ SDIO 3.0 Master Ultra low-power in core power-down mode ❐ Less than 60 µA with VBATT on and 20 µA with VBATT off
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CYUSB202X
SDR50
DDR50
CYUSB202X
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toshiba emmc 4.4
Abstract: micron emmc micron emmc 4.4 toshiba emmc micron emmc 4.3 TCD1304DG micron eMMC 100 ball BGA eMMC intel eMMC eMMC 4.4
Text: Freescale Semiconductor Application Note Document Number: AN4198 Rev. 0, 09/2010 Architectural Differences between the i.MX23, i.MX25, and i.MX28 by Multimedia Applications Division Freescale Semiconductor, Inc. Austin, TX 1 Introduction This application note describes the key architectural
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AN4198
32-bit
ARM926EJ-S
ARM11
toshiba emmc 4.4
micron emmc
micron emmc 4.4
toshiba emmc
micron emmc 4.3
TCD1304DG
micron eMMC 100 ball BGA
eMMC intel
eMMC
eMMC 4.4
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CLKIN32
Abstract: No abstract text available
Text: CYUSB302x SD3 USB and Mass Storage Peripheral Controller Features • ■ ■ ■ ■ Latest-generation storage support ❐ SD3.0/SDXC – UHS1 SDR50 / DDR50 Master ❐ eMMC 4.4 Master ❐ SDIO 3.0 Master ■ Independent power domains for core and I/O ■
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CYUSB302x
SDR50
DDR50
CLKIN32
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Untitled
Abstract: No abstract text available
Text: CYUSB303X EZ-USB FX3S SuperSpeed USB Controller EZ-USB® FX3S SuperSpeed USB Controller Features • ■ ■ ❐ Universal serial bus USB integration ❐ USB 3.0 and USB 2.0 peripherals compliant with USB 3.0 specification 1.0 ❐ 5-Gbps USB 3.0 PHY compliant with PIPE 3.0
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CYUSB303X
100-MHz
16-bit
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Samsung eMMC 4.41
Abstract: ARM Cortex A9 samsung VFPv3 emmc jedec standard MCIMX50 samsung eMMC 4.5 153 ball eMMC memory
Text: Freescale Semiconductor Data Sheet: Advanced Information Document Number: IMX50CEC Rev. 0, 7/2011 MCIMX50 Package Information Plastic Package Case MAPBGA 13 x 13 mm, 0.5 mm pitch 416 pin PBGA i.MX50 Applications Processors for Consumer Products 1 Introduction
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IMX50CEC
MCIMX50
Samsung eMMC 4.41
ARM Cortex A9 samsung
VFPv3
emmc jedec standard
MCIMX50
samsung eMMC 4.5
153 ball eMMC memory
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samsung eMMC 4.5
Abstract: 153 ball eMMC memory emmc samsung samsung eMMC 5.0 samsung lpddr2 Samsung eMMC 4.41 MCIMX508CVK8B ARM Cortex A9 samsung MCIMX507 "EPD controller"
Text: Freescale Semiconductor Data Sheet: Advanced Information Document Number: IMX50CEC Rev. 1, 10/2011 MCIMX50 Package Information Plastic Package Case MAPBGA 13 x 13 mm, 0.5 mm pitch 416 pin PBGA i.MX50 Applications Processors for Consumer Products 1 Introduction
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IMX50CEC
MCIMX50
samsung eMMC 4.5
153 ball eMMC memory
emmc samsung
samsung eMMC 5.0
samsung lpddr2
Samsung eMMC 4.41
MCIMX508CVK8B
ARM Cortex A9 samsung
MCIMX507
"EPD controller"
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emmc 4.41 spec
Abstract: eMMC 4.41 emmc spec SD-DDR50 emmc 4.5 spec SDXC protocol emmc 4.41 firmware operation eMMC 4.41 application note MMC-DDR52 emmc v 4.41 operation mode
Text: CYUSB3035 EZ-USB FX3S SuperSpeed USB Controller Features • ■ ■ Universal serial bus USB integration ❐ USB 3.0 and USB 2.0 peripherals compliant with USB 3.0 specification 1.0 ❐ 5-Gbps USB 3.0 PHY compliant with PIPE 3.0 ❐ High-speed On-The-Go (HS-OTG) host and peripheral compliant with OTG Supplement Version 2.0
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CYUSB3035
100-MHz
emmc 4.41 spec
eMMC 4.41
emmc spec
SD-DDR50
emmc 4.5 spec
SDXC protocol
emmc 4.41 firmware operation
eMMC 4.41 application note
MMC-DDR52
emmc v 4.41 operation mode
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eMMC 4.41
Abstract: emmc 4.41 spec emmc spec emmc 5.0 emmc cmd18 EMMC HOST CONTROLLER emmc 4.5 spec DAT70 TO-39, UVC eMMC 4.41 application note
Text: CYUSB3035 EZ-USB FX3S SuperSpeed USB Controller Features • ■ ■ Universal serial bus USB integration ❐ USB 3.0 and USB 2.0 peripherals compliant with USB 3.0 specification 1.0 ❐ 5-Gbps USB 3.0 PHY compliant with PIPE 3.0 ❐ High-speed On-The-Go (HS-OTG) host and peripheral compliant with OTG Supplement Version 2.0
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CYUSB3035
100-MHz
16-bit
eMMC 4.41
emmc 4.41 spec
emmc spec
emmc 5.0
emmc cmd18
EMMC HOST CONTROLLER
emmc 4.5 spec
DAT70
TO-39, UVC
eMMC 4.41 application note
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