KLMBG4GE2A-A001
Abstract: KLMDGAGE2A-A001 32GB emmc KLMBG4GEAC-B001 SAMSUNG emmc KLMBG KLMAG2WE4AA001 klm8g KLMAG Samsung eMMC 4.41
Text: 10/22/13 Samsung Memory Link HOME PRODUCTS Home Product Flash Solution APPLICATIONS DESIGN SUPPORT LOG IN NEWS EVENTS PRODUCT SEARCH e-MMC Product Catalogue e-MMC Parameter Selector Overview Product catalogue Related Resources Density Class eMMC Version Card
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KLMDGAGE2A-A001
128GB
Class1500
Class400
KLMCG8GEAC-B001
Class2000
KLMCG8GE2A-A001
KLMBG4WE4A-A001
KLMBG4GE2A-A001
KLMDGAGE2A-A001
32GB emmc
KLMBG4GEAC-B001
SAMSUNG emmc
KLMBG
KLMAG2WE4AA001
klm8g
KLMAG
Samsung eMMC 4.41
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KLM8G2FE3B
Abstract: klm8g samsung eMMC 4.5 TLC nand samsung tlc nand flash KLM4G 153 ball eMMC memory SAMSUNG emmc klm8g2 Samsung KLMBG4GE2A
Text: Samsung eMMC Managed NAND Flash memory solution supports mobile applications FBGA QDP Package BROCHURE Efficiency, reduced costs and quicker time to market Expand device development with capable memory solutions Simplify mass storage designs Conventional NAND Flash memory can be challenging to
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16G nand flash
Abstract: emmc csd emmc mmc EXT_CSD emmc Extended CSD NAND16GAH0D EXT_CSD NUMONYX emmc 3R14 CRC16
Text: NAND08GAH0A NAND16GAH0D 1 Gbyte, 2 Gbyte, 1.8 V/3 V supply, NAND Flash memories with MultiMediaCard interface Preliminary Data Features • Packaged NAND Flash memory with MultiMediaCard interface ■ 1, 2 Gbytes of formatted data storage ■ eMMC/MultiMediaCard system specification,
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NAND08GAH0A
NAND16GAH0D
16G nand flash
emmc csd
emmc
mmc EXT_CSD
emmc Extended CSD
NAND16GAH0D
EXT_CSD
NUMONYX emmc
3R14
CRC16
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CMD24
Abstract: emmc ball
Text: NAND08GAH0B 1-Gbyte, 1.8 V/3 V supply, NAND flash memories with MultiMediaCard interface Preliminary Data Features • Packaged NAND flash memory with MultiMediaCard interface ■ 1 Gbyte of formatted data storage ■ eMMC/MultiMediaCard system specification,
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NAND08GAH0B
CMD24
emmc ball
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NAND08GAH0B
Abstract: emmc csd emmc Initialization CMD24 emmc ball emmc 4.4 standard jedec MultiMediaCard System Specification MultiMediaCard System Specification Version MMCA emmc jedec mechanical standard emmc spi
Text: NAND08GAH0B 1-Gbyte, 1.8 V/3 V supply, NAND flash memories with MultiMediaCard interface Features • Packaged NAND flash memory with MultiMediaCard interface ■ 1 Gbyte of formatted data storage ■ eMMC/MultiMediaCard system specification, compliant with V4.2
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NAND08GAH0B
NAND08GAH0B
emmc csd
emmc Initialization
CMD24
emmc ball
emmc 4.4 standard jedec
MultiMediaCard System Specification
MultiMediaCard System Specification Version MMCA
emmc jedec mechanical standard
emmc spi
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EXT_CSD
Abstract: eMMC emmc 4.5 MultiMediaCard System Specification Version MMCA 16G nand flash CMD60-CMD63 mmc EXT_CSD NAND08GAH0A eMMC 4.4 rca a 8321
Text: NAND08GAH0A NAND16GAH0D 1 Gbyte, 2 Gbyte, 1.8 V/3 V supply, NAND Flash memories with MultiMediaCard interface Preliminary Data Features • Packaged NAND Flash memory with MultiMediaCard interface ■ 1, 2 Gbytes of formatted data storage ■ eMMC™/MultiMediaCard system
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NAND08GAH0A
NAND16GAH0D
EXT_CSD
eMMC
emmc 4.5
MultiMediaCard System Specification Version MMCA
16G nand flash
CMD60-CMD63
mmc EXT_CSD
NAND08GAH0A
eMMC 4.4
rca a 8321
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KLM8G2FEJA-A001
Abstract: KLMAG4FEJA-A001 KLM8G2FEJA KLMBG8FEJA-A001 KLMAG4FEJA-B001 klm8g samsung eMMC 4.5 Samsung eMMC 4.41 KLMXGXFEJA-X001 KLMCGAFEJA-B001
Text: Hello All, 8/16/32GB 27nm eMMC parts are now available to sample CS type ! Please input sample requests for all customers using old generations of moviNAND now. We'll expedite for ASAP delivery. SEC will ramp 27nm production quickly so it is imperative that all customers get qualified ASAP.
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8/16/32GB
KLMXGXFEJA-X001
KLM8G2FEJA-A001
KLMAG4FEJA-A001
KLM8G2FEJA
KLMBG8FEJA-A001
KLMAG4FEJA-B001
klm8g
samsung eMMC 4.5
Samsung eMMC 4.41
KLMCGAFEJA-B001
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eMMC
Abstract: emmc spec samsung eMMC 4.5 emmc 4.5 spec emmc operation emmc Initialization KMCME0000M emmc 5.0 emmc 4.5 emmc spec samsung
Text: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid
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S19904EJ1V0AN00
CMD42
CMD43
CMD54
CMD55
CMD56
CMD59
eMMC
emmc spec
samsung eMMC 4.5
emmc 4.5 spec
emmc operation
emmc Initialization
KMCME0000M
emmc 5.0
emmc 4.5
emmc spec samsung
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K4X2G323PD8GD8
Abstract: K9HFGY8S5A-HCK0 K4H511638JLCCC samsung eMMC 5.0 KLMBG4GE2A-A001 K9K8G08U0D-SIB0 K4X51163PK-FGD8 KLMAG2GE4A k4h561638n-lccc K4G10325FG-HC03
Text: PRODUCT SELECTION GUIDE Displays, Memory and Storage 2H 2012 Samsung Semiconductor, Inc. Samsung continues to lead the industry with the broadest portfolio of memory products and technology. Its DRAM, flash, mobile, and graphics memory are found in computers—from
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BR-12-ALL-001
K4X2G323PD8GD8
K9HFGY8S5A-HCK0
K4H511638JLCCC
samsung eMMC 5.0
KLMBG4GE2A-A001
K9K8G08U0D-SIB0
K4X51163PK-FGD8
KLMAG2GE4A
k4h561638n-lccc
K4G10325FG-HC03
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SDIN7DP2-4G
Abstract: TWL6037 Sandisk eMMC OMAP5432 OMAP5430 SDIN7DP2 IN248 IN255 SN75LVCP412
Text: OMAP5432 ES2.0 EVM System Reference Manual Texas Instruments Revision 0.4 March 1, 2013 DOC-21163 OMAP5432 ES2.0 EVM System Reference Manual Preface Read This First About This Manual This manual should be used by software and hardware developers of applications based on the
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OMAP5432
DOC-21163
750-2628-2XX-SCH)
EVM5432
750-2628-213-EBOM)
SDIN7DP2-4G
TWL6037
Sandisk eMMC
OMAP5430
SDIN7DP2
IN248
IN255
SN75LVCP412
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OMAP5430
Abstract: OMAP5432 MIPI CSI-2 Parallel bridge Toshiba eMMC 4.40 emmc pcb layout toshiba eMMC DS MIPI DPI CAMERA PARALLEL RGB TO MIPI CSI-2 TWL6041 emmc toshiba
Text: Version F EL I M Data Manual IN Multimedia Device Engineering Samples 2.0 AR OMAP5430 Public Version PR ADVANCE INFORMATION concerns new products in the sampling or preproduction phase of development. Characteristic data and other specifications are subject to change without notice.
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OMAP5430
SWPS052F
OMAP5430
OMAP5432
MIPI CSI-2 Parallel bridge
Toshiba eMMC 4.40
emmc pcb layout
toshiba eMMC DS
MIPI DPI
CAMERA PARALLEL RGB TO MIPI CSI-2
TWL6041
emmc toshiba
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ADSP-BF561SBBCZ-5A
Abstract: D1854 ADSP-BF537-STAMP adzs-hpusb-ice ADZS-BF533 ADP5022 ADSP-BF516BBCZ-4 ADSP-BF518BBCZ-4F4 ADSP-BF539BBCZ-5F8 ADSP-BF504BCPZ
Text: Blackfin Processor Family Why Choose a Blackfin Processor? • High performance, 16-/32-bit Blackfin processor core with DSP and RISC functionality and programmability • Eliminates need for multiple separate processors • Large portfolio of products ranging from 300 MHz to 600 MHz
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16-/32-bit
G04492-2-9/10
ADSP-BF561SBBCZ-5A
D1854
ADSP-BF537-STAMP
adzs-hpusb-ice
ADZS-BF533
ADP5022
ADSP-BF516BBCZ-4
ADSP-BF518BBCZ-4F4
ADSP-BF539BBCZ-5F8
ADSP-BF504BCPZ
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LPDSP32
Abstract: Sanyo LPDSP32
Text: Ordering number : ENA2171A LC823430TA CMOS LSI Audio Processing System LSI for MP3 Record and Playback Devices http://onsemi.com Overview LC823430TA is an audio processing system for MP3 record and playback devices. It integrates DSP for digital signal processing and analog blocks such as audio ADC, audio DAC, and speaker and
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ENA2171A
LC823430TA
LC823430TA
32bit
LPDSP32
246KB)
170KB
154KB
TQFP128L
14X14)
LPDSP32
Sanyo LPDSP32
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Sanyo LPDSP32
Abstract: LPDSP32 emmc 4.5 emmc 5.0 emmc firmware TQFP128L eMMC BMODE20 emmc controller emmc Pin assignment
Text: Ordering number : ENA2171 LC823430TA CMOS IC 1-chip audio LSI for MP3 record and playback device http://onsemi.com Overview LC823430TA is 1-chip audio LSI for MP3 record and playback device. It integrates DSP for digital signal processing and analog blocks such as audio ADC, audio DAC, and speaker and
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ENA2171
LC823430TA
LC823430TA
32bit
LPDSP32
246KB)
170KB
154KB
A2171-20/20
Sanyo LPDSP32
emmc 4.5
emmc 5.0
emmc firmware
TQFP128L
eMMC
BMODE20
emmc controller
emmc Pin assignment
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Sanyo LPDSP32
Abstract: LPDSP32
Text: Ordering number : ENA2171 LC823430TA CMOS IC 1-chip audio LSI for MP3 record and playback device ht t p://onse m i.c om Overview LC823430TA is 1-chip audio LSI for MP3 record and playback device. It integrates DSP for digital signal processing and analog blocks such as audio ADC, audio DAC, and speaker and
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ENA2171
LC823430TA
LC823430TA
32bit
LPDSP32
246KB)
170KB
154KB
A2171-20/20
Sanyo LPDSP32
LPDSP32
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AS0B821-S78B-7H
Abstract: wifi antenna mtbf
Text: edm EDM Type 2 Compact Form Factor Freescale i.MX6 System on Module 2 2Gbit DDR3 = SELECT OPTION 2Gbit DDR3 ARM Cortex-A9 Freescale i.MX6 scalable single/dual/quad core EDM type 2 compact System-on-Module Cortex A9 GPU 2D Composition Video Decode Video Encode
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GC880
35Mtri/s
266Mpxl/s
GC320
600Mpxl/s,
1080p30
1080p30
1000Gbps
AS0B821-S78B-7H
wifi antenna mtbf
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AR6003
Abstract: SoC ARM cortex 64bit Hardware Manual
Text: TM August 2013 TM 2 • Learn about the Freescale i.MX 6 series of application processors’ key features, capabilities, uses and market segment targets • Learn about the Development Ecosystem available for the i.MX 6 Series family of processors • Understand the power and performance advantages of the
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ARM11
150MJuly
AR6003
SoC ARM cortex 64bit Hardware Manual
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SVID protocol
Abstract: No abstract text available
Text: Agilent Infiniium 9000 H-Series High-Definition Oscilloscopes Data Sheet See Your Signals in HD See Your Signals in HD The high-deinition 9000 H-Series oscilloscope offers up to 12 bits of resolution, which represents 4096 quantization levels, for precision signal viewing. The 9000 H-Series’
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BP-10-29-13)
5991-1520EN
SVID protocol
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Untitled
Abstract: No abstract text available
Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 5, 06/2013 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch
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IMX50CEC
MCIMX50
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Samsung eMMC 4.51
Abstract: samsung eMMC 4.5
Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 2, 05/2012 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch
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IMX50CEC
MCIMX50
Samsung eMMC 4.51
samsung eMMC 4.5
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samsung eMMC 4.5
Abstract: Samsung eMMC 4.41 lpddr2 emmc emmc 4.41 spec emmc 4.5 spec 153 ball eMMC memory Samsung eMMC 4.51 samsung* lpddr2* pop package emmc Pin assignment eMMC 4.4
Text: Freescale Semiconductor Data Sheet: Advanced Information Document Number: IMX50CEC Rev. 2, 04/2012 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch
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IMX50CEC
MCIMX50
samsung eMMC 4.5
Samsung eMMC 4.41
lpddr2 emmc
emmc 4.41 spec
emmc 4.5 spec
153 ball eMMC memory
Samsung eMMC 4.51
samsung* lpddr2* pop package
emmc Pin assignment
eMMC 4.4
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samsung eMMC 4.5
Abstract: eMMC 4.51 Samsung eMMC 4.41 emmc 4.5 spec Samsung eMMC 4.51 emmc 4.41 spec eMMC PoP samsung lpddr2 153 ball eMMC memory 0.8 emmc spec samsung
Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 2, 05/2012 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch
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IMX50CEC
MCIMX50
samsung eMMC 4.5
eMMC 4.51
Samsung eMMC 4.41
emmc 4.5 spec
Samsung eMMC 4.51
emmc 4.41 spec
eMMC PoP
samsung lpddr2
153 ball eMMC memory 0.8
emmc spec samsung
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Untitled
Abstract: No abstract text available
Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 6, 08/2013 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch
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IMX50CEC
MCIMX50
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Untitled
Abstract: No abstract text available
Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 3, 11/2012 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch
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IMX50CEC
MCIMX50
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