EE13 JWG2 Search Results

EE13 JWG2 Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
BGA and QFP Package mounting Abstract: MCP Technology Trend EE13 jwg2 EE13 JWG SC47D tfBGA PACKAGE thermal resistance EIA and EIAJ standards Combo (Spindle VCM) Driver BGA and QFP Package EE-13 Contextual Info: PACKAGE TRENDS 1-1 Packaging Trends Needs of electronic equipment Optimized System Integration Performance • Multiple functions • High speed • High output Outline • Small • Thin • Light Assembly • Automation • Systematization • High density	Original		PDF
MIL-STD-750C Abstract: SN 102 lcd tfbga TSOP 113 g EE-13 EE13 psi-celp JC11 C7021 ED-4701 Contextual Info: パッケージ動向 1-1 パッケージ実装動向電子機器ニーズ性能・外形・実装性の最適設計多機能性高速能高出力小形外薄形形軽量実自動化装システム化性高密度化実装動向パッケージ動向	Original	MIL-STD-202F, MIL-STD-750C MIL-STD-883E C7021 C7022 ISO14001 MIL-STD-750C SN 102 lcd tfbga TSOP 113 g EE-13 EE13 psi-celp JC11 C7021 ED-4701	PDF

Catalog Datasheet

Type

Document Tags

PDF

BGA and QFP Package mounting

Abstract: MCP Technology Trend EE13 jwg2 EE13 JWG SC47D tfBGA PACKAGE thermal resistance EIA and EIAJ standards Combo (Spindle VCM) Driver BGA and QFP Package EE-13
Contextual Info: PACKAGE TRENDS 1-1 Packaging Trends Needs of electronic equipment Optimized System Integration Performance • Multiple functions • High speed • High output Outline • Small • Thin • Light Assembly • Automation • Systematization • High density

Original

PDF

MIL-STD-750C

Abstract: SN 102 lcd tfbga TSOP 113 g EE-13 EE13 psi-celp JC11 C7021 ED-4701
Contextual Info: パッケージ動向 1-1 パッケージ実装動向電子機器ニーズ性能・外形・実装性の最適設計多機能性高速能高出力小形外薄形形軽量実自動化装システム化性高密度化実装動向パッケージ動向

Original

MIL-STD-202F, MIL-STD-750C MIL-STD-883E C7021 C7022 ISO14001 MIL-STD-750C SN 102 lcd tfbga TSOP 113 g EE-13 EE13 psi-celp JC11 C7021 ED-4701

PDF